Patents by Inventor Håkan Bygdö

Håkan Bygdö has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device with flip module having low height
    Patent number: 7965520
    Abstract: An electronic device is provided that includes a main printed circuit board (PCB) having a top surface, a bottom surface, and a hole extending between the top surface and the bottom surface. The electronic device further includes a module PCB having at least one electrical component mounted on a top surface of the module PCB, wherein the module PCB is inverted and assembled adjacent the main PCB such that the top surface of the module PCB faces the top surface of the main PCB, and the at least one electrical component extends into the hole. In addition, the electronic device includes a cover on the bottom surface of the main PCB that substantially covers the hole.
    Type: Grant
    Filed: January 22, 2007
    Date of Patent: June 21, 2011
    Assignee: Sony Ericsson Mobile Communications AB
    Inventors: Håkan Bygdö, Per Holmberg