Abstract: A process for forming a package of hot melt adhesive material includes forming a bottom layer of molten non-tacky polymeric material in a container and depositing a bead of molten non-tacky polymeric material along the top edges of an open-faced rigid container and allowing the bead of polymeric material to pour down the walls of the rigid container by gravity so as to coat the inside wall surfaces and bottom surface of the container with a substantially uniform layer of the non-tacky polymeric material. The layer of non-tacky polymeric material is allowed to solidify in the container and form a substantially rigid mold of the polymeric material within the container. The mold is located in a rigid support structure and is conveyed to a molten adhesive filling station. The mold is filled at the filling station with a metered amount of molten adhesive which is allowed to cool and solidify within the mold thereby forming a solidified package of hot melt adhesive material.