Patents by Inventor H. Ryan Chase

H. Ryan Chase has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microball placement solutions
    Patent number: 7494913
    Abstract: Microball delivery solutions for solder bumping are generally described. In this regard, according to one example embodiment, a microball delivery assembly includes a mask with at least two microball holder(s) to hold at least two different sizes of microball(s) that may correspond with at least two different-sized openings on a substrate, to provide simultaneous delivery of different-sized microballs upon a substrate.
    Type: Grant
    Filed: August 31, 2006
    Date of Patent: February 24, 2009
    Assignee: Intel Corporation
    Inventors: Houssam Jomaa, Ravi K. Nalla, H. Ryan Chase
  • Microball placement solutions
    Publication number: 20080054047
    Abstract: Microball delivery solutions for solder bumping are generally described. In this regard, according to one example embodiment, a microball delivery assembly includes a mask with at least two microball holder(s) to hold at least two different sizes of microball(s) that may correspond with at least two different-sized openings on a substrate, to provide simultaneous delivery of different-sized microballs upon a substrate.
    Type: Application
    Filed: August 31, 2006
    Publication date: March 6, 2008
    Inventors: Houssam Jomaa, Ravi K. Nalla, H. Ryan Chase