Abstract: A process for providing event photographs for inspection, selection and distribution via a computer network generally includes the steps of taking event photographs, associating identifying data with each photograph taken, transferring the photographs to a computer network server, and permitting access to the server for searching of a particular photograph utilizing the identifying data. The identifying data can include a name of an event participant, a number corresponding to a number worn by the event participant, the date and time the photograph was taken, or a code captured from a component as it passes a sensor. Such a component can be passive or active and can include a bar code, inductive device or an electronic transmitting device which is worn by the event participant. The event participants are informed of the identifying data by posting the identifying data associated with each photograph so that it is made available to the participants of the event for later use in searching the server.

Abstract: An wafer polishing pad assembly for use in CMP includes an optical sensor for sensing reflectivity of the wafer during polishing, and produces a corresponding signal, and transmits the signal from the rotating pad to a stationary portion of the assembly. The signal is transmitting off the pad through non-contact couplings such inductive coupling or optical couplings after being converted into signal formats enabling non-contact transmission.

Abstract: A plurality of different structural members for reinforcing a plate-like structure, such as a bushing tip plate for intended use in forming fibers from a fluid material supplied to a bushing assembly, are disclosed. Each reinforcing member includes a body having a first portion for attachment to the structure and a second portion having a profile with a variable height including at least one apex. The body may be integrally formed of a single piece of material, or two or formed from more separate pieces of material bonded or secured together. The body may be T-shaped, L-shaped, or F-shaped in cross-section. The second portion of the body may have an inverted V-shaped profile, an inverted W-shaped profile, or an arcuate profile. The at least one apex may be located at the midpoint or elsewhere along the length of the body.

Abstract: Disclosed is a system and method for monitoring, diagnosing, and treating certain respiratory conditions, such as asthma. The system includes a mask apparatus fitted with a pH sensor and thermocouple, a continuous positive airway pressure (CPAP) device, a processing receiver, and a therapeutic nebulizer/atomizer/humidifier device. The mask apparatus, CPAP device and therapeutic nebulizer/atomizer/humidifier device are connected by a pneumatic means. The pH sensor and the thermocouple are in electrical communication with the processing receiver that controls, through an electronic means, the CPAP device and therapeutic nebulizer/atomizer/humidifier device. The electrical communications can be in the form of a plurality of wires or employ wireless means.

Abstract: Disclosed is a system and method for monitoring, diagnosing, and treating certain medical conditions, such as asthma, gastroesophageal reflux or laryngopharyngeal reflux. The system includes a mask apparatus or sensor module fitted with a pH sensor and thermocouple, a continuous positive airway pressure (CPAP) device, a processing receiver, and a therapeutic nebulizer/atomizer/humidifier device. The mask apparatus, CPAP device and therapeutic nebulizer/atomizer/humidifier device are connected by a pneumatic means. The pH sensor and the thermocouple are in electrical communication with the processing receiver that controls, through an electronic means, the CPAP device and therapeutic nebulizer/atomizer/humidifier device. The electrical communications can be in the form of a plurality of wires or employ wireless means.

Abstract: An apparatus is disclosed which improves the optical monitoring of semi-conductor wafers undergoing chemical mechanical planarization. The apparatus consists of two assemblies. Firstly, a fiber optical wave-guide assembly installed within the polishing pad during the pad's construction. This assembly forms an integrated optical waveguide originating from the center of rotation of the polishing pad and terminating at a location within the wafer track. Secondly, a vacuum hub, tube, and angular encoder assembly, which provides light coupling to the center of rotation of the polishing pad and also provides resolution of the angular position and speed of the polishing pad, polishing table, and optical waveguide.

Abstract: A trigger system including a photosensor having a polarizing light filter n positioned in a light receiving end of a housing. A lens is disposed in the housing for focusing light onto a transducer. A switch is electronically coupled to the transducer for selecting either a passive or active mode. In the active mode, a light source is directed at the photosensor, whereby a trigger signal is generated when an object disrupts the received light. In the passive mode, an opaque screen is spaced from the photosensor and a source of light is directed at the opaque screen, whereby a trigger signal is generated from the light reflected from an object positioned between the screen and photosensor. The trigger system may be electronically linked to a photographic system for high speed or action photography.

Abstract: The invention is a new method and apparatus that can be used to detect, recognize, and analyze people or other objects in security checkpoints, public-places, parking lots, or in similar environments under surveillance to detect the presence of certain objects of interests (e.g., people), and to identify their activities for security and other purposes in real-time. The system can detect a wide range of activities for different applications. The method detects any new object introduced into a known environment and then classifies the object regions to human body parts or to other non-rigid and rigid objects. By comparing the detected objects with the graphs from a database in the system, the methodology is able to identify object parts and to decide on the presence of the object of interest (human, bag, dog, etc.) in video sequences. The system tracks the movement of different object parts in order to combine them at a later stage to high-level semantics.

Abstract: An optical sensor that includes a light source and a detector is located within a cavity in a polishing pad so as to face the surface that is being polished. Light from the light source is reflected from the surface being polished and the detector detects the reflected light. The electrical signal produced by the detector is conducted to a hub located at the central aperture of the polishing pad. The disposable polishing pad is removably connected, both mechanically and electrically to the hub. The hub contains electronic circuitry that is concerned with supplying power to the optical sensor and with transmitting the electrical signal to a non-rotating station. Several techniques are described for accomplishing these tasks. The system permits continuous monitoring of an optical characteristic of a surface that is being polished, even while the polishing machine is in operation, and permits the end point of the polishing process to be determined.

Abstract: A trigger system including a photosensor having a polarizing light filter n positioned in a light receiving end of a housing. A lens is disposed in the housing for focusing light onto a transducer. A switch is electronically coupled to the transducer for selecting either a passive or active mode. In the active mode, a light source is directed at the photosensor, whereby a trigger signal is generated when an object disrupts the received light. In the passive mode, an opaque screen is spaced from the photosensor and a source of light is directed at the opaque screen, whereby a trigger signal is generated from the light reflected from an object positioned between the screen and photosensor. The trigger system may be electronically linked to a photographic system for high speed or action photography.

Abstract: An wafer polishing pad assembly for use in CMP includes an optical sensor for sensing reflectivity of the wafer during polishing, and produces a corresponding signal, and transmits the signal from the rotating pad to a stationary portion of the assembly. The signal is transmitting off the pad through non-contact couplings such inductive coupling or optical couplings after being converted into signal formats enabling non-contact transmission.

Abstract: A method and system of transforming a source code file to obtain a reduced size source code file. In one embodiment, a source code file is translated to obtain a translation error list. The source code file is transformed to obtain a reduced size source code file, which is a test case file that is equivalent to the source code file. In one embodiment, a source code file is translated to obtain a translation error list and a reduced size source code file is automatically translated to obtain a reduced size source code file translation error list. The error lists are compared in order to determine whether the reduced size source code file is an equivalent test case for the source code file.

Abstract: An apparatus is disclosed which improves the optical monitoring of semi-conductor wafers undergoing chemical mechanical planarization (CMP). The apparatus consists of a hub containing printed circuit board mounted optical and electronic devices, which couple light into a waveguide integrated into a CMP polishing pad. The hub is attached to the CMP polishing pad and rotates with the pad during the CMP operation. The electronics sense light emitting from the waveguide, convert the light into an electrical signal, amplify and analyze the electrical signal, and communicate the result of the analysis to remote CMP tool control systems.

Abstract: Code compression techniques and decompression architectures for embedded systems are disclosed, providing good compression ratio while improving decompression time for VLIW instructions and reducing bus power consumption. The invention includes two fixed-to-variable (F2V) length code compression schemes based on a reduced arithmetic code compression algorithm combining arithmetic coding with probability models; a static probability model using static coding and semi-adaptive coding using a Markov model. Multi-bit decompression methods for the F2V techniques are presented, together with a parallel decompression scheme that tags and divides a compressed block into smaller sub-blocks. The Markov model provides better compression ratio, but the static model has a less complicated decompression unit design. The invention also includes two variable-to-fixed (V2F) length coding algorithms, one based on Tunstall coding and another on arithmetic coding.

Abstract: An wafer polishing pad assembly for use in CMP includes an optical sensor for sensing reflectivity of the wafer during polishing, and produces a corresponding signal, and transmits the signal from the rotating pad to a stationary portion of the assembly. The signal is transmitting off the pad through non-contact couplings such inductive coupling or optical couplings after being converted into signal formats enabling non-contact transmission.

Abstract: An apparatus is disclosed which improves the optical monitoring of semiconductor wafers undergoing chemical mechanical planarization. The apparatus consists of two assemblies. Firstly, a fiber optical wave-guide assembly installed within the polishing pad during the pad's construction. This assembly forms an integrated optical waveguide originating from the center of rotation of the polishing pad and terminating at a location within the wafer track. Secondly, a vacuum hub, tube, and angular encoder assembly, which provides light coupling to the center of rotation of the polishing pad and also provides resolution of the angular position and speed of the polishing pad, polishing table, and optical waveguide.

Abstract: An optical endpoint system for a CMP system with a viewport located off-center on the platen, said view port being adjustable in height so that the window of the viewport can be made flush with the top of the polishing pad.

Abstract: An optical sensor that includes a light source and a detector is located within a cavity in a polishing pad so as to face the surface that is being polished. Light from the light source is reflected from the surface being polished and the reflected light is detected by the detector. The electrical signal produced by the detector is conducted to a hub located at the central aperture of the polishing pad. The disposable polishing pad is removably connected, both mechanically and electrically to the hub. The hub contains electronic circuitry that is concerned with supplying power to the optical sensor and with transmitting the electrical signal to a non-rotating station. Several techniques are described for accomplishing these tasks. The system permits continuous monitoring of an optical characteristic of a surface that is being polished, even while the polishing machine is in operation, and permits the end point of the polishing process to be determined.

Abstract: A method and system for computer network analysis. A test network is configured and test scenarios are run using exemplary software applications. Trace data including network response and load information is collected during the test scenarios. The trace data is used as input data into various network analysis tools. The network analysis tools evaluate the computer network's response using a variety of criteria. A final report is generated proposing a computer network configuration suitable for satisfying the requirements of the exemplary software applications.

Abstract: An optical sensor that includes a light source and a detector is located within a cavity in a polishing pad so as to face the surface that is being polished. Light from the light source is reflected from the surface being polished and the detector detects the reflected light. The electrical signal produced by the detector is conducted to a hub located at the central aperture of the polishing pad. The disposable polishing pad is removably connected, both mechanically and electrically to the hub. The hub contains electronic circuitry that is concerned with supplying power to the optical sensor and with transmitting the electrical signal to a non-rotating station. Several techniques are described for accomplishing these tasks. The system permits continuous monitoring of an optical characteristic of a surface that is being polished, even while the polishing machine is in operation, and permits the end point of the polishing process to be determined.