Abstract: Provided is a camera module that includes: an image sensing device; a first signal transmitting element on which there are formed a device coupling portion that is coupled to the image sensing device, and an external coupling portion that extends from one end of the device coupling portion to protrude from the image sensing device and is coupled to an external substrate; an auto-focus (AF) module including: an AF device, and a second signal transmitting element coupled to the first signal transmitting element to electrically connect the AF device and the external substrate; a lens module including a plurality of lens which focuses light onto the image sensing device; and a coupling element that couples the first and second signal transmitting elements so that they are electrically connected.

Abstract: A camera module and a method of manufacturing the camera module are provided. The camera module includes a substrate having an opening through which light passes, a circuit pattern for transmitting an electrical signal, and first and second terminals connected to the circuit pattern; an image sensor combined with the substrate so as to receive the light through the opening, and electrically connected to the first terminals; a lead frame disposed around the image sensor and electrically connected to the second terminals of the substrate; a housing combined on a surface of the substrate opposite to another surface on which the image sensor and the lead frame are combined; and a lens disposed in the housing.

Abstract: A camera module package includes an image sensor module that can be formed as a chip scale package (CSP) with a wire bonding structure. The image sensor module includes an image sensing device unit having an image sensing device, a pixel area part formed on a surface of the image sensing device, and a device connecting pad formed on a surface of the image sensing device for electrically connecting to external devices; a circuit board to which the image sensing device unit is attached on one surface, to which a board connecting pad that is electrically connected to the image sensing device unit is formed on the other surface, and that contains holes corresponding to locations of the pixel area part and the device connecting pad; and a connecting unit for connecting the device connecting pad and the board connecting pad.

Abstract: Provided is a camera module that includes: an image sensing device; a first signal transmitting element on which there are formed a device coupling portion that is coupled to the image sensing device, and an external coupling portion that extends from one end of the device coupling portion to protrude from the image sensing device and is coupled to an external substrate; an auto-focus (AF) module including: an AF device, and a second signal transmitting element coupled to the first signal transmitting element to electrically connect the AF device and the external substrate; a lens module including a plurality of lens which focuses light onto the image sensing device; and a coupling element that couples the first and second signal transmitting elements so that they are electrically connected.

Abstract: A camera module package includes an image sensor module that can be formed as a chip scale package (CSP) with a wire bonding structure. The image sensor module includes an image sensing device unit having an image sensing device, a pixel area part formed on a surface of the image sensing device, and a device connecting pad formed on a surface of the image sensing device for electrically connecting to external devices; a circuit board to which the image sensing device unit is attached on one surface, to which a board connecting pad that is electrically connected to the image sensing device unit is formed on the other surface, and that contains holes corresponding to locations of the pixel area part and the device connecting pad; and a connecting unit for connecting the device connecting pad and the board connecting pad.