Patents by Inventor Ha II Kim

Ha II Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150189735
    Abstract: Disclosed herein are a rigid flexible printed circuit board and a method of manufacturing the same. The rigid flexible printed circuit board includes: a flexible substrate having a flexible region and a plurality of rigid regions; a first insulating layer formed in the rigid regions and extended from the rigid regions to cover a portion of the flexible region; and a plurality of build-up layers formed in the first insulating layer of the rigid regions and including a build-up insulating layer and a circuit pattern, wherein at least one of the plurality of build-up layers has a thickness different from those of the other build-up layers.
    Type: Application
    Filed: April 9, 2014
    Publication date: July 2, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kyung Chul Yu, Ha II Kim, Young Man Kim, Dong Gi An
  • Publication number: 20100147563
    Abstract: Disclosed is a substrate having an electromagnetic shielding member, which includes a first circuit layer connected to a ground layer, a coverlay formed on the first circuit layer, an electromagnetic shielding member formed on the coverlay, and a first via formed in the coverlay to connect the electromagnetic shielding member to the first circuit layer, so that the electromagnetic shielding member and the ground layer are connected to each other through a via structure, thereby preventing the electromagnetic shielding member from becoming cracked due to the stepped portion of the substrate.
    Type: Application
    Filed: June 2, 2009
    Publication date: June 17, 2010
    Applicant: SAMSUNG ELECTRO MECHANICS CO., LTD.
    Inventors: Young Po Park, Going Sik Kim, Hwan Yong Jung, Ha II Kim, Dong Gi An, Myeong Hui Jung