Abstract: A Field Emission Device (FED) and its method of manufacture includes: forming a substrate; forming a cathode having a cathode aperture on an upper surface of the substrate; forming a material layer having a first through hole with a smaller diameter than that of the cathode aperture on an upper surface of the cathode; forming a first insulator having a first cavity on an upper surface of the material layer; forming a gate electrode having a second through hole on an upper surface of the first insulator; and forming an emitter in a central portion of the cathode aperture.

Abstract: A field emission type backlight device with high light efficiency may include a front substrate, a reflective substrate on the front substrate, a rear substrate separated from the front substrate by a predetermined gap, anode electrodes provided with a predetermined gap between them on the rear substrate, a light-emitting layer on the anode electrode, a cathode electrode and a gate electrode spaced apart on the rear substrate between the anode electrodes, and an electron emission source emitting electrons by electric field on the cathode electrode.

Abstract: A method of manufacturing a field emission device (FED), which reduces the number of photomask patterning processes and improves the manufacturing yield of the FED, is provided.

Abstract: A thermal electron emission backlight device comprises: a first substrate and a second substrate disposed in parallel and separated by a predetermined distance from each other; a first anode electrode and a second anode electrode facing the first anode electrode, the first and second anode electrodes being formed on inner surfaces of the first substrate and the second substrate, respectively; cathode electrodes disposed at predetermined intervals and in parallel with each other between the first substrate and the second substrate; a phosphor layer formed on the second anode electrode; and a plurality of spacers disposed between the first substrate and the second substrate so as to maintain the predetermined distance therebetween. When a predetermined voltage is applied to the cathode electrodes, thermal electrons are emitted from the cathode electrodes.

Abstract: A method of manufacturing a field emission device (FED), which reduces the number of photomask patterning processes and improves the manufacturing yield of the FED, is provided.

Abstract: A thermal electron emission backlight device comprises: a first substrate and a second substrate disposed in parallel and separated by a predetermined distance from each other; a first anode electrode and a second anode electrode facing the first anode electrode, the first and second anode electrodes being formed on inner surfaces of the first substrate and the second substrate, respectively; cathode electrodes disposed at predetermined intervals and in parallel with each other between the first substrate and the second substrate; a phosphor layer formed on the second anode electrode; and a plurality of spacers disposed between the first substrate and the second substrate so as to maintain the predetermined distance therebetween. When a predetermined voltage is applied to the cathode electrodes, thermal electrons are emitted from the cathode electrodes.

Abstract: In a field emission backlight unit, a method of driving the same, and a method of manufacturing a lower substrate, the field emission backlight unit includes: a lower substrate; first and second electrodes alternately formed in parallel lines on the lower substrate; emitters interposed between the lower substrate and the first electrodes; an upper substrate spaced a predetermined distance from the lower substrate and facing the lower substrate; a third electrode formed on a bottom surface of the upper substrate; and a phosphor layer formed on the third electrode. The driving method comprises applying a cathode voltage to the first electrodes and a gate voltage to the second electrodes, followed by reversing the application of the voltages to the first and second electrodes. The manufacturing method comprises forming and drying or firing a patterned carbon nanotube (CNT) layer, and then pattering, drying and firing a conductive thick film.

Abstract: A Field Emission Device (FED) and its method of manufacture includes: forming a substrate; forming a cathode having a cathode aperture on an upper surface of the substrate; forming a material layer having a first through hole with a smaller diameter than that of the cathode aperture on an upper surface of the cathode; forming a first insulator having a first cavity on an upper surface of the material layer; forming a gate electrode having a second through hole on an upper surface of the first insulator; and forming an emitter in a central portion of the cathode aperture.

Abstract: A field emission type backlight device with high light efficiency may include a front substrate, a reflective substrate on the front substrate, a rear substrate separated from the front substrate by a predetermined gap, anode electrodes provided with a predetermined gap between them on the rear substrate, a light-emitting layer on the anode electrode, a cathode electrode and a gate electrode spaced apart on the rear substrate between the anode electrodes, and an electron emission source emitting electrons by electric field on the cathode electrode.