Abstract: Described are anti-doppel antibody-drug conjugates, compositions comprising them, and related methods of treating doppel-associated diseases and conditions, including cancer.

Abstract: Described herein are doppel-targeting molecules (e.g., antibodies) useful for inhibiting pathological angiogenesis and treating diseases and conditions associated with pathological angiogenesis, such as tumors, cancers, atherosclerosis, tuberculosis, asthma, pulmonary arterial hypertension (PAH), neoplasms and neoplasm-related conditions, and for detecting doppel expression in a subject. Related compositions and methods also are described.

Abstract: Described herein are doppel-targeting molecules (e.g., antibodies) useful for inhibiting pathological angiogenesis and treating diseases and conditions associated with pathological angiogenesis, such as tumors, cancers, atherosclerosis, tuberculosis, asthma, pulmonary arterial hypertension (PAH), neoplasms and neoplasm-related conditions, and for detecting doppel expression in a subject. Related compositions and methods also are described.

Abstract: A semiconductor package includes a connection structure including an insulating layer, a redistribution layer disposed on the insulating layer, and a connection via penetrating through the insulating layer and connected to the redistribution layer, a semiconductor chip having an active surface on which connection pads are disposed and an inactive surface opposing the active surface, and having the active surface disposed on the connection structure to face the connection structure, and an encapsulant covering at least a portion of the semiconductor chip, wherein the semiconductor chip includes a groove formed in the active surface, and the groove has a shape in which a width of a region of at least a portion of an internal region located closer to a central portion of the semiconductor chip than the active surface is greater than a width of an entrance region.

Abstract: A semiconductor package includes a connection structure including an insulating layer, a redistribution layer disposed on the insulating layer, and a connection via penetrating through the insulating layer and connected to the redistribution layer, a semiconductor chip having an active surface on which connection pads are disposed and an inactive surface opposing the active surface, and having the active surface disposed on the connection structure to face the connection structure, and an encapsulant covering at least a portion of the semiconductor chip, wherein the semiconductor chip includes a groove formed in the active surface, and the groove has a shape in which a width of a region of at least a portion of an internal region located closer to a central portion of the semiconductor chip than the active surface is greater than a width of an entrance region.