Patents by Inventor Ha Neul KIM

Ha Neul KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin for transparent encapsulation material, and associated encapsulation material and electronic device
    Patent number: 8847414
    Abstract: A resin for an encapsulation material includes a first polysiloxane including hydrogen bound to silicon (Si—H) at its terminal end, and a second polysiloxane including an alkenyl group bound to silicon (Si—Vi) at its terminal end, wherein a ratio (Si—H/Si—Vi) of hydrogen bound to silicon (Si—H) in the first polysiloxane to the alkenyl group bound to silicon (Si—Vi) in the second polysiloxane is about 1 to about 1.
    Type: Grant
    Filed: December 29, 2011
    Date of Patent: September 30, 2014
    Assignee: Cheil Industries, Inc.
    Inventors: Sung-Hwan Cha, Sang-Ran Koh, Yong Kook Kim, Woo-Han Kim, Ha Neul Kim, Chi Won An
  • COMPOSITION FOR ENCAPSULANT, ENCAPSULANT, AND ELECTRONIC DEVICE
    Publication number: 20140187734
    Abstract: A composition for an encapsulant, an encapsulant, and an electronic device, the composition including an adhesion-promoting agent, the adhesion-promoting agent including an epoxy group in an amount of about 2.0 to about 5.0 mmol/g, at least one first polysiloxane that includes a hydrogen bound to a silicon at a terminal end thereof, and at least one second polysiloxane that includes an alkenyl group bound to a silicon at a terminal end thereof.
    Type: Application
    Filed: December 27, 2013
    Publication date: July 3, 2014
    Inventors: Hong-Jung YOO, Woo-Han KIM, Ha-Neul KIM, Chi-Won AN, Eun-Seon LEE, Dong-il HAN
  • Method of Manufacturing Iron-Based Powder
    Publication number: 20130180360
    Abstract: A method of manufacturing iron-based powder includes providing an iron-based molten steel manufactured through a iron making process and a steelmaking process to a tundish; and performing water atomization over the molten steel discharged through a nozzle connected to the tundish. The iron-based powder is manufactured from the molten steel refined after a molten iron tapped from a iron making process is charged into a converter without a pre-treatment process of the molten iron, thus economically providing the highly clean iron-based powder.
    Type: Application
    Filed: September 15, 2011
    Publication date: July 18, 2013
    Applicants: Research Institute of Industrial Science & Technology, POSCO
    Inventors: Ha Neul Kim, Eon Sik Lee, Oh-Joon Kwon, Sun Jong Park, Hee Soo Kang
  • ENCAPSULATION MATERIAL AND ELECTRONIC DEVICE PREPARED USING THE SAME
    Publication number: 20120168815
    Abstract: An encapsulation material and an electronic device, the encapsulation material including a resin, the resin including a first polysiloxane including hydrogen bonded with silicon (Si—H) at a terminal end thereof, and a second polysiloxane including an alkenyl group bonded with silicon (Si-Vi) at a terminal end thereof, a phosphor, and a density controlling agent, wherein a weight ratio of the density controlling agent to the phosphor is about 1.5:1 to about 10:1.
    Type: Application
    Filed: December 28, 2011
    Publication date: July 5, 2012
    Inventors: Sang-Ran Koh, Yong Kook Kim, Woo-Han Kim, Ha Neul Kim, Chi Won An, Sung-Hwan Cha
  • RESIN FOR TRANSPARENT ENCAPSULATION MATERIAL, AND ASSOCIATED ENCAPSULATION MATERIAL AND ELECTRONIC DEVICE
    Publication number: 20120168780
    Abstract: A resin for an encapsulation material includes a first polysiloxane including hydrogen bound to silicon (Si—H) at its terminal end, and a second polysiloxane including an alkenyl group bound to silicon (Si-Vi) at its terminal end, wherein a ratio (Si—H/Si-Vi) of hydrogen bound to silicon (Si—H) in the first polysiloxane to the alkenyl group bound to silicon (Si-Vi) in the second polysiloxane is about 1 to about 1.
    Type: Application
    Filed: December 29, 2011
    Publication date: July 5, 2012
    Inventors: Sung-Hwan CHA, Sang-Ran KOH, Yong Kook KIM, Woo-Han KIM, Ha Neul KIM, Chi Won AN