Abstract: An embodiment relates to a substrate and a semiconductor module. A substrate capable of manufacturing a substrate for packaging, which is an individual product, with excellent yield despite cracks that may occur at edges or side surfaces of a core is provided.

Abstract: The present invention relates to a conjugate in which a polypeptide capable of forming a dimer is fused to the C-terminus of the heavy chain or light chain of an antibody or fragment thereof, a composition for increasing antigen-binding avidity of an antibody in proportion to the density of a target antigen, and a method for increasing antigen-binding avidity using the same. The present invention also relates to the treatment or diagnosis of diseases using the conjugate.

Abstract: A lighting device includes a light guide plate configured to guide and diffuse a light from a light source, and a garnish body including a lighting area to which the diffused light is radiated, wherein the light guide plate is disposed at a predetermined angle with respect to the garnish body.

Abstract: A method of operating a host device to control a storage device which includes a register is provided. The method includes: providing the storage device with a partial array refresh setting indicating a non-masking segment among a masking segment and the non-masking segment; providing a refresh command to the storage device; and providing a write command for the masking segment to the storage device to control the storage device to store data while a partial array refresh is performed in the storage device based on the refresh command.

Abstract: Provided are a composition for treating or preventing recurrence of keloid comprising tauroursodeoxycholic acid as an active ingredient, and a method for treating keloid or preventing recurrence of keloid using the composition.

Abstract: A semiconductor device comprises a substrate that including a frontside comprising an active region and a backside opposite to the frontside, an electronic element on the active region, a frontside wiring structure electrically connected to the electronic element on the frontside of the substrate, and a backside wiring structure electrically connected to the electronic element on the backside of the substrate. The backside wiring structure includes a plurality of backside wiring patterns sequentially stacked on the backside of the substrate, and a super via pattern that intersects and extends through at least one layer of the plurality of backside wiring patterns.

Abstract: A wound dressing patch includes a backing film; an absorbent foam pad coupled to the a portion of one surface of the backing film; an adhesive sheet provided on a remaining portion of the one surface of the backing film; and a lining material provided along a peripheral edge portion of the adhesive sheet and configured to impart a predetermined stiffness to the backing film. The lining material is spaced apart from the absorbent foam pad to surround the absorbent foam pad in a form of a substantially closed curve along the peripheral edge portion of the adhesive sheet, and a distance between the lining material and an end of the adhesive sheet is shorter than a distance between the lining material and an edge of the absorbent foam pad.

Abstract: An auxiliary device for use in a trocar instrument, including a trocar needle having a fastening groove formed on an outer circumferential surface thereof. The auxiliary device includes: a body into which at least a portion of the trocar needle is inserted; and a hook connected to the body and configured to be inserted into the fastening groove of the trocar needle. The hook includes a fixing portion fixed to the body and a coupling portion extending from one end of the fixing portion and configured to be inserted into the fastening groove when the trocar needle is disposed inside the body. A gap is formed between the fixing portion and the coupling portion.

Abstract: The tinnitus testing apparatus of this invention comprises a control part that in turn comprises: an auditory stimulus generation part that can generate a stimulus; and an AEP acquisition and amplitude measurement part that can acquire auditory evoked potential (AEP) brain waves of a examinee due to said stimulus and measure the specific amplitude of said acquired brainwaves; wherein said auditory stimulus is one or more of: a 1st stimulus containing continuous noise and pulse noise; and a 2nd stimulus containing pulse noise and continuous noise with a silent gap.

Abstract: Provided is a cochlear implant device with a glasses shape. The disclosed cochlear implant device improves body wearability and aesthetic effects by designing the cochlear implant device to have a glasses shape, and achieves alignment of a receiver coil implanted into the body and a transmission coil outside the body without using a magnet because the transmission coil is integrally provided at an end of a glasses temple such that a region of a body with which the transmission coil comes into contact is changed according to a bending degree of the glasses temple.

Abstract: An apparatus for treating dizziness comprises an input unit configured to input a type of dizziness suffered by a patient, a storage unit configured to store different treatment methods respectively corresponding to different types of dizziness, an operation unit configured to search for a treatment method corresponding to the diagnosed type of dizziness among the treatment methods stored in the storage unit based on the diagnosed type of dizziness, and an output unit configured to output the searched treatment method for the inputted type of dizziness to the patient.

Abstract: An implant package for a cochlear prosthesis is implanted in a head of a person to be adjacent to an extracorporeal device. An inner coil unit receives an electrical signal generated by an audio processor. A main body is connected to the inner coil unit to convert the electrical signal into an electrical stimulation signal. An electrode unit is connected to the main body and inserted into a cochlea to stimulate auditory nerves of the cochlea using the electrical stimulation signal. The inner coil unit may be separated from the main body to be disposed between skin and muscle of the head. The coil within the head is separated from the main body to be disposed between the skin and the muscle to improve communications efficiency for electrical signals.

Abstract: A cochlear implant. An audio processor converts sound into an electrical signal. An outer coil unit transmits the electrical signal into the head of a user. An inner coil unit transmits and receives the electrical signal transmitted by the outer coil unit. A main body is connected to the inner coil unit to convert the electrical signal into an electrical stimulation signal. An electrode unit is connected to the main body and inserted into a cochlea to stimulate auditory nerves of the cochlea using the electrical stimulation signal. The outer coil unit is configured to surround an ear. The outer coil has a modified structure by which wearing sensation and implantation convenience are improved.

Abstract: A semiconductor device may include an insulating layer, a pad, a circuit, at least one first wiring, at least one second wiring, at least one third wiring, and a pad contact. The pad may be disposed on the insulating layer. The circuit may be disposed in the insulating layer. The circuit may be positioned below the pad. The first wiring may be disposed between the pad and the circuit. The second wiring may be disposed between the pad and the first wiring. The third wiring may be disposed between the pad and the second wiring. The pad contact may be configured to directly connect the pad to the circuit.

Abstract: A display apparatus including a substrate, a display panel on the substrate, and an encapsulation film sealing the display panel. The encapsulation film includes at least one organic layer and/or at least one inorganic layer and at least one pair of conductive layers.

Abstract: A semiconductor device may include an insulating layer, a pad, a circuit, at least one first wiring, at least one second wiring, at least one third wiring, and a pad contact. The pad may be disposed on the insulating layer. The circuit may be disposed in the insulating layer. The circuit may be positioned below the pad. The first wiring may be disposed between the pad and the circuit. The second wiring may be disposed between the pad and the first wiring. The third wiring may be disposed between the pad and the second wiring. The pad contact may be configured to directly connect the pad to the circuit.

Abstract: A semiconductor device and a method for fabricating the same are provided.

Abstract: A semiconductor device may include an insulating layer, a pad, a circuit, at least one first wiring, at least-one second wiring, at least one third wiring, and a pad contact. The pad may be disposed on the insulating layer. The circuit may be disposed in the insulating layer. The circuit may be positioned below the pad. The first wiring may be disposed between the pad and the circuit. The second wiring may be disposed between the pad and the first wiring. The third wiring may be disposed between the pad and the second wiring. The pad contact may be configured to directly connect the pad to the circuit.

Abstract: A semiconductor device and a method for fabricating the same are provided.

Abstract: A display apparatus including a substrate, a display panel on the substrate, and an encapsulation film sealing the display panel. The encapsulation film includes at least one organic layer and/or at least one inorganic layer and at least one pair of conductive layers.