Patents by Inventor Ha Q. Pham

Ha Q. Pham has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9745409
    Abstract: A liquid epoxy resin composition having a reduced tendency to crystallize including at least one liquid epoxy resin having the following generic chemical Structure (I): where n is 0 or an integer of 1 or more; and wherein n=0 is in the range of between about 1 wt % and about 90 wt %; wherein; n=1 is in the range of between about 7 wt % and about 20 wt %; n=2 is in the range of between about 0.8 wt % and about 3 wt %; and n=3 and above is in the range of about 0 wt % and about 2 wt %.
    Type: Grant
    Filed: November 1, 2011
    Date of Patent: August 29, 2017
    Assignee: BLUE CUBE IP LLC
    Inventors: Rajesh H. Turakhia, Cui-ping Chen, Bill Z. Dellinger, Ludovic Valette, Itaru Kudose, Ha Q. Pham
  • Publication number: 20160289444
    Abstract: Curable compositions, cured compositions, and methods of forming the same, including an epoxy resin, a curing agent, an amphiphilic toughening agent, and an inorganic nanofiller, wherein the toughening agent forms a second phase having at least one dimension being on the nanometer scale.
    Type: Application
    Filed: June 14, 2016
    Publication date: October 6, 2016
    Inventors: Kandathil Eapen Verghese, Ha Q. Pham, George Jacob, Marvin L. Dettioff
  • Publication number: 20160280846
    Abstract: A dual cure system including at least two different and separate types of chemical reactions occurring as the process of the present invention proceeds including, for example, the following two reactions: (1) free radical polymerization of methacrylated or acrylated polyol; and (2) an epoxy-curing agent reaction. The dual cure system of the present invention advantageously provides a first cure reaction of methacrylated or acrylated polyol followed by a second epoxy-curing agent thermoset reaction to form a cured thermoset exhibiting an elongation property of greater than about 5%.
    Type: Application
    Filed: December 2, 2014
    Publication date: September 29, 2016
    Inventors: Krishnan Karunakaran, Marvin L. Dettloff, Nikhil K.E. Verghese, Ha Q. Pham
  • Patent number: 9388311
    Abstract: Curable compositions, cured compositions, and methods of forming the same, including an epoxy resin, a curing agent, an amphiphilic toughening agent, and an inorganic nanofiller, wherein the toughening agent forms a second phase having at least one dimension being on the nanometer scale.
    Type: Grant
    Filed: July 28, 2008
    Date of Patent: July 12, 2016
    Assignee: Dow Global Technologies LLC
    Inventors: Kandathil Eapen Verghese, Ha Q. Pham, George Jacob, Marvin L. Dettloff
  • Patent number: 9074041
    Abstract: A curable epoxy resin composite composition including a reinforcing material and an epoxy resin composition, and a process for preparing a composite from such composition; wherein a combination of at least one alkanolamine and at least one styrenated phenol are present in the epoxy resin composition in a sufficient amount to increase the rate of reaction of the at least one epoxy resin and the at least one alkanolamine curing agent while maintaining the thermal and mechanical properties of the composite upon curing of the epoxy resin composition.
    Type: Grant
    Filed: September 21, 2010
    Date of Patent: July 7, 2015
    Assignee: Blue Cube IP LLC
    Inventors: Marvin L. Dettloff, Gary A. Hunter, Susan K. Falcone-Potts, Ha Q. Pham, Martine Rousse, Bernd Hoevel
  • Publication number: 20150141602
    Abstract: A monomer treatment process including treating at least one metathesis polymerizable monomer composition having a purity of less than 95 weight percent of a dicyclopentadiene monomer with an alkali metal-containing additive prior to polymerizing the metathesis polymerizable monomer composition such that the treated polymerized monomer exhibits improved properties in metathesis reactions.
    Type: Application
    Filed: April 16, 2013
    Publication date: May 21, 2015
    Inventors: Marvin L. Dettloff, Richard J. Keaton, Ha Q. Pham, Nikhil E. Verghese
  • Publication number: 20150065613
    Abstract: A curable epoxy adhesive composition including (a) at least one first epoxy resin; (b) at least one first diluent; (c) at least one first hardener; (d) at least a first hydrophilic filler that has a predetermined aspect ratio; (e) at least a second hydrophobic filler that is different from the first filler and that has a predetermined aspect ratio; and (f) at least a third filler that is different from the first and second fillers; wherein the third filler has a predetermined aspect ratio higher than the first filler and the second filer; and wherein the volume ratio of the third filler to the combination of the first filler and second filler is in the range of from 1:1 to 10:1 such as to minimize the thermal residual stresses of the cured product made from the curable composition.
    Type: Application
    Filed: April 3, 2013
    Publication date: March 5, 2015
    Applicants: Dow MF Produktions GmbH & Co. OHG, The Dow Chemical Company
    Inventors: Bharati Balijepalli, Theofanis Theofanous, Bernd Hoevel, Nikhil E. Verghese, Ha Q. Pham
  • Publication number: 20140316068
    Abstract: A bimodal toughening agent comprising a) a first preformed coreshell toughening agent and b) a second preformed coreshell toughening agent wherein the second preformed coreshell toughening agent has a particle size of at least two times larger than that of the first preformed coreshell toughening agent, and the use of the bimodal toughening agent in a thermosettable epoxy resin composition, is disclosed.
    Type: Application
    Filed: November 1, 2012
    Publication date: October 23, 2014
    Applicant: DOW GLOBAL TECHNOLOGIES LLC
    Inventors: George C. Jacob, Yasmin N. Srivastava, Nikhil E. Verghese, Theofanis Theofanous, Ludovic Valette, Ha Q. Pham
  • Publication number: 20140256856
    Abstract: A liquid epoxy resin composition having a reduced tendency to crystallize including at least one liquid epoxy resin having the following generic chemical Structure (I): where n is 0 or an integer of 1 or more; and wherein n=0 is in the range of between about 1 wt % and about 90 wt %; wherein; n=1 is in the range of between about 7 wt % and about 20 wt %; n=2 is in the range of between about 0.8 wt % and about 3 wt %; and n=3 and above is in the range of about 0 wt % and about 2 wt %.
    Type: Application
    Filed: November 1, 2011
    Publication date: September 11, 2014
    Applicant: Dow Global Technologies LLC
    Inventors: Rajesh H. Turakhia, Cui-ping Chen, Bill Z. Dellinger, Ludovic Valette, Itaru Kudose, Ha Q. Pham
  • Patent number: 8829101
    Abstract: A windmill blade which comprises reinforcing fibers in a toughened resin matrix. The resin matrix is made from a composition which comprises (a) one or more epoxy resins and/or one or more epoxy vinyl ester resins, (b) one or more reactive diluents, and (c) at least one amphiphilic block copolymer. The amphiphilic block copolymer comprises at least two different polyether blocks and is present in the composition in an amount of from about 0.5% to about 10% by volume, based on the total volume of the matrix composition.
    Type: Grant
    Filed: May 4, 2009
    Date of Patent: September 9, 2014
    Assignee: Dow Global Technologies LLC
    Inventors: George Jacob, Ha Q. Pham, Marvin L. Dettloff, Gary A. Hunter, Rajesh Turakhia
  • Patent number: 8552104
    Abstract: A composition comprising (1) a thermosettable resin selected from the group consisting of an epoxy resin, an epoxy vinyl ester resin, an unsaturated polyester resin or a mixture thereof, and (2) an amphiphilic mock copolymer dispersed in the thermosettable resin; fiber-reinforced plastics (FRP), coatings and composites prepared therefrom; and methods of preparing these.
    Type: Grant
    Filed: March 24, 2005
    Date of Patent: October 8, 2013
    Assignee: Dow Global Technologies LLC
    Inventors: Kandathil E. Verghese, Ha Q. Pham, Jerry E. White, Frank S. Bates
  • Publication number: 20130251931
    Abstract: Thermosetting epoxy-terminated oxazolidinone ring containing polymers which are obtainable by reacting at least one polyisocyanate compound with at least one hydroxy group containing epoxy resin and/or a combination of at least one epoxy resin and at least one di- or multifunctional nucleophilic compound that is capable of forming crosslinks between epoxy groups. The polymers have an onset glass transition temperature of at least about 45° C. and are capable of showing an onset glass transition temperature in the cured state at least about 160° C. Powder coating compositions comprising these polymers are also disclosed.
    Type: Application
    Filed: April 4, 2013
    Publication date: September 26, 2013
    Applicant: Dow Global Technologies LLC
    Inventors: Zeng Kun Liao, Fabio Aguirre Vargas, Ha Q. Pham, Gyongyi Gulyas
  • Patent number: 8466257
    Abstract: Methods and apparatus for the recovery and purification of solid salt compositions from an organic liquid containing epoxy resin and at least one of epihalohydrin and solvent to obtain purified salt and/or brine compositions that may be useful in industrial processes.
    Type: Grant
    Filed: February 9, 2009
    Date of Patent: June 18, 2013
    Assignee: Dow Global Technologies LLC
    Inventors: Thomas C. Young, Ha Q. Pham, Shuji Maeda
  • Publication number: 20120172493
    Abstract: A curable epoxy resin composite composition including a reinforcing material and an epoxy resin composition, and a process for preparing a composite from such composition; wherein a combination of at least one alkanolamine and at least one styrenated phenol are present in the epoxy resin composition in a sufficient amount to increase the rate of reaction of the at least one epoxy resin and the at least one alkanolamine curing agent while maintaining the thermal and mechanical properties of the composite upon curing of the epoxy resin composition.
    Type: Application
    Filed: September 21, 2010
    Publication date: July 5, 2012
    Inventors: Marvin L. Dettloff, Gary A. Hunter, Susan K. Falcone-Potts, Ha Q. Pham, Martine Rousse, Bernd Hoevel
  • Publication number: 20120010329
    Abstract: Curable epoxy resin compositions, cured epoxy resin compositions, and processes of forming the same, including at least one epoxy resin, at least one sterically hindered amine curing agent and at least one non-sterically hindered amine curing agent which provides toughness properties to the curable composition and resultant cured product made from the curable composition.
    Type: Application
    Filed: February 8, 2010
    Publication date: January 12, 2012
    Inventors: Gary A. Hunter, Ha Q. Pham, George Jacob, Rajesh Turakhia
  • Publication number: 20110130537
    Abstract: In an improved process for preparation of glycidyl ether resins that are solid at room temperature, sometimes referred to as solid epoxy resins”, from a reaction mixture of an aromatic hydroxyl-containing compound, an epihalohydrin and an inorganic hydroxide, add a reaction solvent that has both a ether moiety ad an alcohol moiety to the reaction mixture and use mole-equivalent ratio of moles (one mole-equivalent) epihalohydrin to hydroxyl moieties of the aromatic hydroxyl-containing compound that falls within a range of from 0.5:1 to 1:1.
    Type: Application
    Filed: July 7, 2009
    Publication date: June 2, 2011
    Applicant: DOW GLOBAL TECHNOLOGIES LLD
    Inventors: Philip J. Carlberg, Ha Q. Pham, Lemimg Gu, Eric B. Rippiinger, David H. West, William G. Worley, Thomas C. Young
  • Publication number: 20110104498
    Abstract: A structural composite uses a block copolymer toughening agent to increase the fracture resistance (toughness) of the structural composite. The structural composite comprises (i) a carbon fiber reinforcing material and (ii) a thermosettable resin composition; wherein the thermosettable resin composition comprises (a) a thermosettable resin and (b) at least one block copolymer toughening agent.
    Type: Application
    Filed: June 30, 2009
    Publication date: May 5, 2011
    Inventors: Rajesh Turakhia, Ha Q. Pham, Nikhil E. Verghese, George Jacob
  • Publication number: 20110058948
    Abstract: A windmill blade which comprises reinforcing fibers in a toughened resin matrix. The resin matrix is made from a composition which comprises (a) one or more epoxy resins and/or one or more epoxy vinyl ester resins, (b) one or more reactive diluents, and (c) at least one amphiphilic block copolymer. The amphiphilic block copolymer comprises at least two different polyether blocks and is present in the composition in an amount of from about 0.5% to about 10% by volume, based on the total volume of the matrix composition.
    Type: Application
    Filed: May 4, 2009
    Publication date: March 10, 2011
    Inventors: George Jacob, Ha Q. Pham, Marvin L. Dettloff, Gary A. Hunter, Rajesh Turakhia
  • Publication number: 20100331494
    Abstract: Methods and apparatus for the recovery and purification of solid salt compositions from an organic liquid containing epoxy resin and at least one of epihalohydrin and solvent to obtain purified salt and/or brine compositions that may be useful in industrial processes.
    Type: Application
    Filed: February 9, 2009
    Publication date: December 30, 2010
    Applicant: Dow Global Technologies Inc.
    Inventors: Thomas C. Young, Ha Q. Pham, Shuji Maeda
  • Patent number: 7820760
    Abstract: A curable adhesive epoxy resin composition including (a) an epoxy resin; (b) an amphiphilic block copolymer containing at least one epoxy resin miscible block segment and at least one epoxy resin immiscible block segment; wherein the immiscible block segment comprises at least one polyether structure provided that the polyether structure of said immiscible block segment contains at least one or more alkylene oxide monomer units having at least four carbon atoms; in an amount such that when the epoxy resin composition is cured, the bond strength of the resulting cured epoxy adhesive resin composition increases compared to an epoxy resin composition without said amphiphilic polyether block copolymer; and (c) at least one curing agent. The amphiphilic block copolymer is preferably an all polyether block copolymer such as a PEO-PBO diblock copolymer or a PEO-PBO-PEO triblock copolymer.
    Type: Grant
    Filed: November 2, 2005
    Date of Patent: October 26, 2010
    Inventors: Ha Q. Pham, Kandathil E. Verghese, Marvin L. Dettloff