Abstract: A dual tip test probe assembly for use in both cantilever and vertical probe applications includes first and second elongated test probes, each having a body portion and a tip portion with a tip configured to make contact with a device under test. An electrically-insulating material is disposed between but not in contact with the body portions of the first and second elongated test probes to electrically isolate the first and second elongated test probes. The first and second elongated test probes are held in alignment with respect to each other so that the tip of the first elongated test probe is adjacent to and not in contact with the tip of the second elongated test probe for making simultaneous contact with the device under test. The dual tip test probe assembly provides a low inductance and a small, stable footprint for testing small and/or non-flat test points.

Abstract: A dual tip test probe assembly for use in both cantilever and vertical probe applications includes first and second elongated test probes, each having a body portion and a tip portion with a tip configured to make contact with a device under test. An electrically-insulating material is disposed between but not in contact with the body portions of the first and second elongated test probes to electrically isolate the first and second elongated test probes. The first and second elongated test probes are held in alignment with respect to each other so that the tip of the first elongated test probe is adjacent to and not in contact with the tip of the second elongated test probe for making simultaneous contact with the device under test. The dual tip test probe assembly provides a low inductance and a small, stable footprint for testing small and/or non-flat test points.

Abstract: A probe card assembly is provided. The probe card assembly includes a substrate layer defining a plurality of apertures and a plurality of probes. Each of the probes has a base and a tip. The base of each probe is configured to be at least partially inserted within one of the plurality of apertures.

Abstract: A probe card assembly for providing electrical interconnection between a semiconductor device to be tested and a test system is provided. The probe card assembly includes a plurality of probes supported by a support substrate, each of the plurality of probes including an end portion extending away from the support substrate. The end portion is configured to be electrically connected to a semiconductor device to be tested. The probe card assembly also includes a dielectric sheet positioned between the support substrate and the end portion of the plurality of probes such that the probes extend through apertures defined by the dielectric sheet.

Abstract: A blade probe card includes a plurality of blades that each includes a first end connected to a printed circuit board and a second end. A probe member is attached to the second end of each blade and extends outward to make contact with a device under test. A ground member is attached to the second end of each blade. The blade probe card also includes a common ground member that is separate from the printed circuit board and coupled to the ground member of each blade. Each blade may also include a first conductive signal trace and two or more conductive ground traces formed on a surface of each blade. The first conductive signal trace electrically connects the probe member to a contact on the printed circuit board. The two or more conductive ground traces are adjacent to the conductive signal trace and reduce crosstalk between the blades.

Abstract: A probe card assembly for providing electrical interconnection between a semiconductor device to be tested and a test system is provided. The probe card assembly includes a plurality of probes supported by a support substrate, each of the plurality of probes including an end portion extending away from the support substrate. The end portion is configured to be electrically connected to a semiconductor device to be tested. The probe card assembly also includes a dielectric sheet positioned between the support substrate and the end portion of the plurality of probes such that the probes extend through apertures defined by the dielectric sheet.

Abstract: A probe card assembly is provided. The probe card assembly includes a substrate layer defining a plurality of apertures and a plurality of probes. Each of the probes has a base and a tip. The base of each probe is configured to be at least partially inserted within one of the plurality of apertures.

Abstract: A probe card assembly for providing electrical interconnection between a semiconductor device to be tested and a test system is provided. The probe card assembly includes a plurality of probes supported by a support substrate, each of the plurality of probes including an end portion extending away from the support substrate. The end portion is configured to be electrically connected to a semiconductor device to be tested. The probe card assembly also includes a dielectric sheet positioned between the support substrate and the end portion of the plurality of probes such that the probes extend through apertures defined by the dielectric sheet.

Abstract: A probe card assembly is provided. The probe card assembly includes a substrate layer defining a plurality of apertures and a plurality of probes. Each of the probes has a base and a tip. The base of each probe is configured to be at least partially inserted within one of the plurality of apertures.

Abstract: A blade probe card includes a plurality of blades that each includes a first end connected to a printed circuit board and a second end. A probe member is attached to the second end of each blade and extends outward to make contact with a device under test. A ground member is attached to the second end of each blade. The blade probe card also includes a common ground member that is separate from the printed circuit board and coupled to the ground member of each blade. Each blade may also include a first conductive signal trace and two or more conductive ground traces formed on a surface of each blade. The first conductive signal trace electrically connects the probe member to a contact on the printed circuit board. The two or more conductive ground traces are adjacent to the conductive signal trace and reduce crosstalk between the blades.

Abstract: A probe card assembly for providing electrical interconnection between a semiconductor device to be tested and a test system is provided. The probe card assembly includes a plurality of probes supported by a support substrate, each of the plurality of probes including an end portion extending away from the support substrate. The end portion is configured to be electrically connected to a semiconductor device to be tested. The probe card assembly also includes a dielectric sheet positioned between the support substrate and the end portion of the plurality of probes such that the probes extend through apertures defined by the dielectric sheet.

Abstract: A probe card assembly is provided. The probe card assembly includes a substrate layer defining a plurality of apertures and a plurality of probes. Each of the probes has a base and a tip. The base of each probe is configured to be at least partially inserted within one of the plurality of apertures.

Abstract: A device having battery-save circuitry includes a power-on reset circuit (603), an OR-gate (604) coupled to the power-on reset circuit (603), a current-boost timer circuit (602) coupled to the OR-gate (604), a reference oscillator (403) with a start-up current mode enabled by the current-boost timer circuit (602), and a low current secondary reference oscillator (613). A method of operating the device includes operating the device in a battery-save mode and an active mode. A first clock signal is used as a microprocessor clock signal while operating the device in the battery-save mode, and a second or third clock signal is used as the microprocessor clock signal while operating the device in the active mode.