Abstract: A management apparatus is connected to a mount substrate manufacturing line including a print apparatus, a component mounting apparatus, and a reflow apparatus, through a network. The management apparatus instructs at least one of apparatuses that are at a more upstream side than a reflow apparatus in a mount substrate manufacturing line to start production of the mount substrate, based on first data relating to the period of time necessary to complete preparation for the performing of a process by the reflow apparatus.

Abstract: A management apparatus is connected to a mount substrate manufacturing line including at least a print apparatus, a component mounting apparatus, and a reflow apparatus, through a network. The management apparatus instructs at least one of apparatuses that are at a more upstream side than the reflow apparatus in a mount substrate manufacturing line, to perform at least any one of an operation relating to maintenance, an operation relating to calibration, and an warm-up operation, based on first data relating to a period of time necessary to complete preparation for performing a process by the reflow apparatus.

Abstract: A management apparatus is connected to a mount substrate manufacturing line including a print apparatus, a component mounting apparatus, and a reflow apparatus, through a network. The management apparatus instructs at least one of apparatuses that are at a more upstream side than a reflow apparatus in a mount substrate manufacturing line to start production of the mount substrate, based on first data relating to the period of time necessary to complete preparation for the performing of a process by the reflow apparatus.

Abstract: A management apparatus is connected to a mount substrate manufacturing line including at least a print apparatus, a component mounting apparatus, and a reflow apparatus, through a network. The management apparatus instructs at least one of apparatuses that are at a more upstream side than the reflow apparatus in a mount substrate manufacturing line, to perform at least any one of an operation relating to maintenance, an operation relating to calibration, and an warm-up operation, based on first data relating to a period of time necessary to complete preparation for performing a process by the reflow apparatus.

Abstract: A screen printing machine for forming a print of paste supplied to a mask plate having pattern holes, includes: a filling squeegee which is held to have a given clearance with respect to the mask plate, and which fills the pattern holes with the paste by moving the filling squeegee relative to the mask plate in a printing direction; and an urging member which urges the filling squeegee toward the mask plate such that at least the given clearance is maintained. The screen printing machine further includes a scraping squeegee which is held to maintain a given interval from the filling squeegee in the printing direction, and which scraps off paste remaining on the mask plate after passage of the filling squeegee by moving the scraping squeegee together with the filling squeegee in the printing direction.

Abstract: An electronic component mounting system includes a screen printing apparatus, a coating unit and an electronic component mounting apparatus. The screen printing apparatus supplies a solder paste to a plurality of first lands among lands of a board, using a mask plate including pattern holes formed so as to correspond to the plurality of first lands. The coating unit includes a discharge port for discharging the solder paste, and coats the solder paste through the discharge port on a plurality of second lands other than the plurality of first lands on the board to which the solder paste is supplied through the screen printing apparatus. The electronic component mounting apparatus mounts the electronic components on the first and second lands to which the solder paste is supplied through the screen printing apparatus and the coating unit.

Abstract: An electronic component mounting system includes a screen printing apparatus, a coating unit and an electronic component mounting apparatus. The screen printing apparatus supplies a solder paste to first specific lands of a board, using a mask plate that includes a stepped portion and pattern holes formed so as to correspond to the first specific lands. The coating unit coats the solder paste on second specific lands of the board which are positioned in a region of the board overlapping the stepped portion of the mask plate and a vicinity of the stepped portion when the screen printing apparatus supplies the solder paste using the mask plate. The electronic component mounting apparatus mounts the electronic components on the first and second specific lands to which the solder paste is supplied through the screen printing apparatus and the coating unit.

Abstract: A screen printing machine for forming a print of paste supplied to a mask plate having pattern holes, includes: a filling squeegee which is held to have a given clearance with respect to the mask plate, and which fills the pattern holes with the paste by moving the filling squeegee relative to the mask plate in a printing direction; and an urging member which urges the filling squeegee toward the mask plate such that at least the given clearance is maintained. The screen printing machine further includes a scraping squeegee which is held to maintain a given interval from the filling squeegee in the printing direction, and which scraps off paste remaining on the mask plate after passage of the filling squeegee by moving the scraping squeegee together with the filling squeegee in the printing direction.

Abstract: An electrode bonding method according to the present invention includes: a plasma cleaning step of irradiating an electrode surface to be cleaned of at least either one of a part, such as a semiconductor device, and a substrate with atmospheric pressure plasma for cleaning; an inert gas atmosphere maintaining step of covering the electrode surface to be cleaned and its vicinity with a first inert gas before the irradiation of the atmospheric pressure plasma is ended, and maintaining that state even thereafter; and a bonding step of bonding an electrode of the part and an electrode on the substrate before the inert gas atmosphere maintaining step is ended. The electrode surface is thereby plasma-cleaned without the possibility of damaging the part to be bonded to the substrate, and the cleaned state is maintained while bonding the electrodes to provide an electrode bonding state of high bonding force and high reliability.

Abstract: It is an object of the invention to provide a liquid substance supplying device exhibiting high operability in handling a container having a large capacity. A liquid substance supplying device for supplying a liquid substance reserved in a vertically elongated container 30 has a configuration in which a bottom part of a container holder 15 for holding the container inserted through an insertion hole provided on a top side of a holder main body 16 is pivoted on a base bracket 14 with a hinge portion 19 to support the container holder 15 such that it can assume either upright attitude or tilted attitude and in which the container holder 15 is fixed in the upright attitude by a holder fixing mechanism 20. As a result, the container holder 15 can be mounted and removed to and from the holder main body 16 in the tilted state at the time of a container replacing operation, which allows high operability to be maintained even in handling a large-capacity container having a great height dimension.

Abstract: An electrode bonding method according to the present invention includes: a plasma cleaning step of irradiating an electrode surface to be cleaned of at least either one of a part, such as a semiconductor device, and a substrate with atmospheric pressure plasma for cleaning; an inert gas atmosphere maintaining step of covering the electrode surface to be cleaned and its vicinity with a first inert gas before the irradiation of the atmospheric pressure plasma is ended, and maintaining that state even thereafter; and a bonding step of bonding an electrode of the part and an electrode on the substrate before the inert gas atmosphere maintaining step is ended. The electrode surface is thereby plasma-cleaned without the possibility of damaging the part to be bonded to the substrate, and the cleaned state is maintained while bonding the electrodes to provide an electrode bonding state of high bonding force and high reliability.

Abstract: It is an object of the invention to provide a liquid substance supplying device exhibiting high operability in handling a container having a large capacity. A liquid substance supplying device for supplying a liquid substance reserved in a vertically elongated container 30 has a configuration in which a bottom part of a container holder 15 for holding the container inserted through an insertion hole provided on a top side of a holder main body 16 is pivoted on a base bracket 14 with a hinge portion 19 to support the container holder 15 such that it can assume either upright attitude or tilted attitude and in which the container holder 15 is fixed in the upright attitude by a holder fixing mechanism 20. As a result, the container holder 15 can be mounted and removed to and from the holder main body 16 in the tilted state at the time of a container replacing operation, which allows high operability to be maintained even in handling a large-capacity container having a great height dimension.

Abstract: A method and apparatus for drawing a thick film circuit on a substrate by discharging a paste from a tank with a discharge hole. A waste drawing is performed by extruding the paste from the tank on a waste drawing section at a predetermined interval of non-drawing duration, thereby preventing paste clogging at the discharge hole and resulting in increase on workability and productivity.