Patents by Inventor Hack S. Kang

Hack S. Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220089852
    Abstract: The present invention relates to a novel plastisol composition that cures at a temperature much lower than conventional plastisols. Also disclosed is a method of applying the composition.
    Type: Application
    Filed: December 6, 2021
    Publication date: March 24, 2022
    Inventor: Hack S. Kang
  • Publication number: 20220041875
    Abstract: The present invention relates to a novel PVC-free plastisol composition that cures at a temperature much lower than conventional plastisols. Also disclosed is a method of applying the composition.
    Type: Application
    Filed: August 23, 2021
    Publication date: February 10, 2022
    Inventor: Hack S. Kang
  • Patent number: 11193035
    Abstract: The present invention relates to a novel plastisol composition that cures at a temperature much lower than conventional plastisols. Also disclosed is a method of applying the composition.
    Type: Grant
    Filed: June 1, 2017
    Date of Patent: December 7, 2021
    Inventor: Hack S. Kang
  • Patent number: 11104818
    Abstract: The present invention relates to a novel PVC-free plastisol composition that cures at a temperature much lower than conventional plastisols. The plastisol composition includes an acrylate polymer; and a plasticizer mixture comprising at least three plasticizers selected from the group consisting of 2,2,4-trimethyl-1,3 pentanediol diisobutyrate, dioctyl terephthalate, dibutyl terephthalate, and benzyl butyl 1,2-cyclohexyldicarboxylate. Also disclosed is a method of applying the composition.
    Type: Grant
    Filed: June 1, 2017
    Date of Patent: August 31, 2021
    Inventor: Hack S. Kang
  • Publication number: 20190315980
    Abstract: The present invention relates to a novel PVC-free plastisol composition that cures at a temperature much lower than conventional plastisols. Also disclosed is a method of applying the composition.
    Type: Application
    Filed: June 1, 2017
    Publication date: October 17, 2019
    Inventor: Hack S. Kang
  • Publication number: 20190136083
    Abstract: The present invention relates to a novel plastisol composition that cures at a temperature much lower than conventional plastisols. Also disclosed is a method of applying the composition.
    Type: Application
    Filed: June 1, 2017
    Publication date: May 9, 2019
    Inventor: Hack S. Kang