Patents by Inventor Hades Lee

Hades Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of providing cassettes containing control wafers to designated processing tools and metrology tools
    Patent number: 7184851
    Abstract: A system for tool monitoring is provided. The system comprises a first cassette, a second cassette, a processing tool, a first metrology tool, and a second metrology tool. The first cassette contains a first control wafer used for a first metrology process. The second cassette contains a second control wafer used for a second metrology process. The processing tool receives the first cassette and processes the first control wafer, and receives the second cassette and processes the second control wafer. The first metrology tool receives the first cassette from the processing tool, and performs the first metrology process on the first control wafer processed by the processing tool. The second metrology tool receives the second cassette from the processing tool, and performs the second metrology process on the second control wafer processed by the processing tool.
    Type: Grant
    Filed: June 28, 2005
    Date of Patent: February 27, 2007
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yung-Cheng Chang, Hsueh-shih Fu, Hades Lee, Yi-Ping Huang
  • Systems and methods for tool monitoring
    Publication number: 20060293780
    Abstract: A system for tool monitoring is provided. The system comprises a first cassette, a second cassette, a processing tool, a first metrology tool, and a second metrology tool. The first cassette contains a first control wafer used for a first metrology process. The second cassette contains a second control wafer used for a second metrology process. The processing tool receives the first cassette and processes the first control wafer, and receives the second cassette and processes the second control wafer. The first metrology tool receives the first cassette from the processing tool, and performs the first metrology process on the first control wafer processed by the processing tool. The second metrology tool receives the second cassette from the processing tool, and performs the second metrology process on the second control wafer processed by the processing tool.
    Type: Application
    Filed: June 28, 2005
    Publication date: December 28, 2006
    Inventors: Yung-Cheng Chang, H. Fu, Hades Lee, Yi-Ping Huang