Abstract: A connector for a cooling block having a connector body defining at least one connector passage. The connector is connectable to a top side of the cooling block body such that the at least one connector passage is in fluid communication with one or both of a conduit inlet and a conduit outlet of the cooling block. A cooling block comprising a cooling block body defining a fluid conduit therein for circulating a cooling fluid therethrough, the fluid conduit having a conduit inlet and a conduit outlet for receiving and discharging the cooling fluid respectively, and the connector connected to the top side of the cooling block body such that the at least one connector passage is in fluid communication with one or both of the conduit inlet and the conduit outlet of the cooling block.

Abstract: A method for assembling a liquid cooling assembly includes: providing liquid cooling blocks each defining an internal fluid conduit; providing a first heat spreading base defining at least one first pocket; and providing a second heat spreading base defining second pockets, a number of second pockets being greater than a number of the at least one first pocket. When assembling a first liquid cooling assembly: at least one liquid cooling block is selected to mate with the first heat spreading base; and the selected at least one liquid cooling block is inserted at least partly into a corresponding one of the at least one first pocket. When assembling a second liquid cooling assembly: at least two liquid cooling blocks are selected to mate with the second heat spreading base; and the selected at least two liquid cooling blocks are inserted at least partly into corresponding ones of the second pockets.

Abstract: A liquid cooling arrangement for cooling heat-generating components of a datacenter server rack. The cooling arrangement includes a liquid cooling loop configured to convey a cooling liquid, a plurality of server clusters each server cluster having a plurality of server assemblies that incorporate at least one respective liquid cooling unit, and a plurality of heat exchangers fluidly connected to the liquid cooling units of the plurality of server clusters via the liquid cooling loop. The heat exchangers configured to receive the heated cooling liquid discharged from the respective liquid cooling units and cool the received heated cooling liquid along with a pump fluidly coupled to the plurality of heat exchangers via the liquid cooling loop, wherein at least a portion of the liquid cooling loop comprises a serialized configuration that serially couples the server clusters and/or serially couples the server clusters and the heat exchangers.

Abstract: A water block for cooling a heat-generating component has a body defining an internal fluid conduit for circulating fluid within the water block. The body defines a fluid inlet and a fluid outlet for feeding fluid into and discharging fluid from the internal fluid conduit respectively. The body includes: an external thermal transfer surface configured to be in contact with the heat-generating component; an opposite external surface on an opposite side of the body from the external thermal transfer surface; and at least one hollow fin extending from the opposite external surface, the at least one hollow fin defining at least one external fin passage, each of the at least one hollow fin defining an internal fin recess that forms part of the internal fluid conduit of the water block.

Abstract: A system provides cooling to an infrastructure having heat-generating units. Internal cooling units are thermally connected to the heat-generating units. An external cooling unit dissipates thermal energy of a heat-transfer fluid circulating in the internal cooling units. A cooling circuit connects the internal and external cooling units. A pump maintains a flow of the heat-transfer fluid for transferring thermal energy from the heat generating units to the external cooling unit. A reservoir thermally connected to the cooling circuit contains a phase change material (PCM) changing between solid and liquid states according to a temperature of the heat-transfer fluid. Thermal energy is transferred between the cooling circuit and the PCM depending on whether a temperature of the heat-transfer fluid is above or below a phase-change temperature value of the PCM. A supplemental cooling device thermally connected to the reservoir dissipates heat from the reservoir to the atmosphere.

Abstract: A cooling block includes a body having a thermal transfer surface configured to be in thermal contact with a heat-generating electronic component. The body defines a fluid conduit having a plurality of channels such that the cooling fluid flows in parallel along the channels. Each channel is defined between first and second internal sidewalls; and top and bottom walls. Each channel has either: a first dimensional configuration including first height and width values; or a second dimensional configuration including second height and width values. The first height value is greater than the second height value. The second width value is greater than the first width value. A thickness of a material of the body between the thermal transfer surface and a first channel is less than a thickness of the material of the body between the thermal transfer surface and a second channel.

Abstract: A cooling block for cooling a heat-generating electronic component includes a body defining a fluid conduit. The body includes a plurality of pins for deflecting cooling fluid flowing within the fluid conduit. The fluid conduit has a passage extending in a longitudinal direction from an inlet point to an outlet point. Each passage is defined by: first and second internal sidewalls facing each other from the inlet point to the outlet point; a pin row disposed between the first and second internal sidewalls, the pin row including a multitude of pins spaced apart from each other in the longitudinal direction, the pins of the pin row being aligned with each other in a lateral direction of the cooling block, each pin having a lacrimiform shape and having a rounded end and a pointed end, each pin being oriented such that the pointed end is downstream from the rounded end.

Abstract: A cooling block for cooling a heat-generating electronic component includes a body having a thermal transfer surface and defining a fluid conduit for circulating a cooling fluid therein. The fluid conduit has a passage extending from a first point to a second point along a longitudinal direction. The passage is defined in part by first and second internal sidewalls, each having a scalloped or undulating shape. A width of the passage is measured between the internal sidewalls in a lateral direction. The passage is defined in part by a pin row disposed between the internal sidewalls, the pin row including multiple pins. The pins of the pin row are spaced apart along the longitudinal direction and are aligned with each other in the lateral direction such that a linear pin axis extending in the longitudinal direction traverses each pin. A method for manufacturing a cooling block is also disclosed.

Abstract: Cooling arrangement and method for cooling of a heat source. The cooling arrangement includes a closed loop, a semi-open loop and at least one fan. The closed loop includes a primary side of a liquid-to-liquid heat exchanger receiving a first cooling fluid heated by the heat source, a first air-to-liquid heat exchanger downstream the primary side, and a first pump returning the first cooling fluid to the heat source. The semi-open loop includes a tank storing a second cooling fluid, a second pump drawing the second cooling fluid from the tank, a secondary side of the liquid-to-liquid heat exchanger receiving the second cooling fluid from the second pump, an evaporating pad downstream said secondary side, and an inlet fluidly connected to a source of the second cooling fluid. The at least one fan causes an air flow through the evaporating pad and through the first air-to-liquid heat exchanger.

Abstract: A cooling arrangement for a rack hosting electronic equipment and at least one fan comprises first and second air-liquid heat exchangers. A first one is mounted to the rack so that heated air expelled from the rack by the fan flows therethrough. The second one is mounted to the first one so that air having flowed through the first heat exchanger flows through the second heat exchanger. Each heat exchanger comprises a frame, an inlet receiving liquid from a cold supply line, an outlet returning liquid to a hot return line, and a continuous internal conduit forming a plurality of interconnected parallel sections. The cooling arrangement is mounted to the rack so that the first and second frames are parallel and adjacent. One interconnected parallel section of the first heat exchanger nearest to its inlet is proximate one interconnected parallel section of the second heat exchanger nearest to its outlet.

Abstract: A liquid cooling device for cooling at least one target component that includes: a base member to be in thermal contact with the at least one target component to be cooled by the liquid cooling device, the base member including a lower surface configured to be placed in contact with the at least one target component, the base member defining a plurality of pockets spaced apart from one another on an upper side thereof and defining a plurality of fluid conduits configured to internally circulate a cooling liquid therethrough. Each of the plurality of pockets arranged to accommodate a corresponding fluid conduit and an interconnecting channel defined by the base member and extending between two neighboring pockets of the plurality of pockets for distributing the cooling fluid from the fluid conduit of one pocket to the fluid conduit of a neighboring pocket.

Abstract: A method for assembling a liquid cooling assembly includes: providing liquid cooling blocks each defining an internal fluid conduit; providing a first heat spreading base defining at least one first pocket; and providing a second heat spreading base defining second pockets, a number of second pockets being greater than a number of the at least one first pocket. When assembling a first liquid cooling assembly: at least one liquid cooling block is selected to mate with the first heat spreading base; and the selected at least one liquid cooling block is inserted at least partly into a corresponding one of the at least one first pocket. When assembling a second liquid cooling assembly: at least two liquid cooling blocks are selected to mate with the second heat spreading base; and the selected at least two liquid cooling blocks are inserted at least partly into corresponding ones of the second pockets.

Abstract: A cooling block assembly for cooling a heat-generating electronic component includes: an upper block portion defining at least one internal fluid conduit and having a lower surface configured to face toward the heat-generating electronic component; a boss spaced from the lower surface and having a thermal transfer surface configured to be in thermal contact with the heat-generating electronic component, the thermal transfer surface being offset from the lower surface, a periphery of the thermal transfer surface being smaller than a periphery of the upper block portion, the periphery of the thermal transfer surface being contained within the periphery of the upper block portion in a projection thereof on a plane parallel to the thermal transfer surface; and heat distributing devices for distributing heat through a phase change of a working substance contained therein, each heat distributing device being disposed partially between the boss and the lower surface.

Abstract: A water block assembly includes first and second water block units having respective first and second fluid conduits. The second water block unit is stacked on the first water block unit. The second fluid conduit operates either in parallel with the first fluid conduit or fluidly independent therefrom, such that cooled fluid is fed to the first and second fluid conduits. The first water block unit includes a first base portion and a first cover portion disposed on and affixed to the first base portion. The first cover portion defines a first fluid inlet and a first fluid outlet of the first fluid conduit. The second water block unit includes a second base portion and a second cover portion disposed on and affixed to the second base portion. The second cover portion defines a second fluid inlet and a second fluid outlet of the second fluid conduit.

Abstract: A thermal transfer device has a body and a fluid conduit defined in the body. The body has a thermal transfer surface configured to be placed in contact with a target component. The fluid conduit is configured for conveying fluid through the body and is thermally coupled to the thermal transfer surface.

Abstract: An uninterruptible power supply (UPS) includes: a housing defining an interior space; a door operatively connected to the housing, the door being configured to be selectively opened and closed for accessing the interior space of the housing; san electrical system enclosed within the housing; at least one liquid cooling device mounted to a target component of the UPS disposed within the housing for cooling thereof, the at least one liquid cooling device defining a fluid conduit for circulating fluid therethrough; and a pumping module including at least one pump fluidly connected to the at least one liquid cooling device for circulating fluid therethrough, each of the at least one pump and the fluid conduit of the at least one liquid cooling device defining in part a liquid cooling circuit, the pumping module being mounted to the door and disposed on an exterior side thereof.

Abstract: A method for controlling a cooling system of a rack, the rack comprising a heat generating component. The method comprises receiving, by a controller, at least one first temperature indications indicative of temperature variations of at least one heat transfer fluid circulating in at least one respective liquid channel of the cooling system; receiving, by the controller, at least one second temperature indications indicative of a temperature of an air flow of ambient air within the rack, the air flow being generated by at least one fan of the cooling system; and adjusting, based on the at least one first and second temperature indications, a rotational speed of the at least one fan and a rotational speed of at least one pump configured for causing the at least one heat transfer fluid to flow in at least one respective liquid channel.

Abstract: A rack assembly for a data center includes: a rack frame housing at least one heat-generating component; a heat exchanger defining a first internal fluid conduit; at least one liquid cooling block connected to the at least one heat-generating component, each of the at least one liquid cooling block defining a second internal fluid conduit, the second internal fluid conduit being in thermal connection with the first internal fluid conduit; a cooling loop independent from any sources of cooling fluid external to the rack assembly and comprising the first and second internal fluid conduits, the cooling loop transferring heat from the second internal fluid conduit to the first internal fluid conduit; and a fluid compensation system comprising a reservoir fluidly connected to the cooling loop and an actuating device to force cooling fluid from the reservoir to the cooling loop to compensate for loss of cooling fluid in the cooling loop.

Abstract: Cooling arrangement and method for cooling of a heat source. The cooling arrangement comprises a closed loop, a semi-open loop and at least one fan. The closed loop comprises a primary side of a liquid-to-liquid heat exchanger receiving a first cooling fluid heated by the heat source, a first air-to-liquid heat exchanger downstream said primary side, and a first pump returning the first cooling fluid to the heat source. The semi-open loop comprises a tank storing a second cooling fluid, a second pump drawing the second cooling fluid from the tank, a secondary side of the liquid-to-liquid heat exchanger receiving the second cooling fluid from the second pump, an evaporating pad downstream said secondary side, and an inlet fluidly connected to a source of the second cooling fluid. The at least one fan causes an air flow through the evaporating pad and through the first air-to-liquid heat exchanger.

Abstract: A liquid cooling device for cooling at least one target component includes a base member configured to be in thermal contact with the at least one target component to be cooled by the liquid cooling device. The base member defines a plurality of pockets spaced apart from one another. A plurality of cover members are connected to the base member and are at least partially received in a corresponding pocket. Each cover member has a fluid inlet and outlet. The cover and base members define together a plurality of fluid conduits that are independent from one another. Each fluid conduit is defined between a cover member and the base member such that a number of the fluid conduits is equal to a number of the cover members. Each fluid conduit respectively receives and discharges fluid through the fluid inlet and the fluid outlet of the corresponding cover member.