Abstract: A cooling block includes a body having a thermal transfer surface configured to be in thermal contact with a heat-generating electronic component. The body defines a fluid conduit having a plurality of channels such that the cooling fluid flows in parallel along the channels. Each channel is defined between first and second internal sidewalls; and top and bottom walls. Each channel has either: a first dimensional configuration including first height and width values; or a second dimensional configuration including second height and width values. The first height value is greater than the second height value. The second width value is greater than the first width value. A thickness of a material of the body between the thermal transfer surface and a first channel is less than a thickness of the material of the body between the thermal transfer surface and a second channel.

Abstract: A heat sink for collecting thermal energy from a heat generating component. The heat sink comprises a base comprising a thermal transfer surface configured to be placed in thermal contact with the heat-generating component, an external surface opposite from the thermal transfer surface and an inlet side of the base extending between an edge of the thermal transfer surface and an edge of the external surface and a plurality of fins extending from the external surface. The fins define a plurality of fin passages therebetween, at least one fin of the plurality of fins having non-straight longitudinal edges extending along the external surface and defining at least in part at least one non-straight fin passage.

Abstract: A method for controlling a cooling system of a rack, the rack comprising a heat generating component. The method comprises receiving, by a controller, at least one first temperature indications indicative of temperature variations of at least one heat transfer fluid circulating in at least one respective liquid channel of the cooling system; receiving, by the controller, at least one second temperature indications indicative of a temperature of an air flow of ambient air within the rack, the air flow being generated by at least one fan of the cooling system; and adjusting, based on the at least one first and second temperature indications, a rotational speed of the at least one fan and a rotational speed of at least one pump configured for causing the at least one heat transfer fluid to flow in at least one respective liquid channel.

Abstract: A cooling block assembly for cooling a heat-generating electronic component includes: an upper block portion defining at least one internal fluid conduit and having a lower surface configured to face toward the heat-generating electronic component; a boss spaced from the lower surface and having a thermal transfer surface configured to be in thermal contact with the heat-generating electronic component, the thermal transfer surface being offset from the lower surface, a periphery of the thermal transfer surface being smaller than a periphery of the upper block portion, the periphery of the thermal transfer surface being contained within the periphery of the upper block portion in a projection thereof on a plane parallel to the thermal transfer surface; and heat distributing devices for distributing heat through a phase change of a working substance contained therein, each heat distributing device being disposed partially between the boss and the lower surface.

Abstract: Autonomous rack system configurations for datacenter operations are presented that include a combination of a first rack structure incorporating front-mounted heat exchanger and a second rack structure incorporating a rear-mounted heat exchanger, such that liquid-cooled heat-generating electronic components that are less tolerant to higher temperatures are disposed within the first rack structure and liquid-cooled heat-generating electronic components that are more tolerant to higher temperatures are disposed within the second rack structure. These configurations utilize the residual air flow that passes through the less temperature tolerant electronic components of the first rack structure and redirect it to the second rack structure to cool the more temperature tolerant electronic components of the second rack structure.

Abstract: The invention relates to a fluid cooling method for rack-mounted processing assemblies, comprising measuring internal temperatures of said at least one air cooled electronic processing element and, when internal temperatures of rack-mounted processing assembly are less than a predetermined limit, and, determining whether at the current input cooling liquid temperature, internal temperatures of said at least one air cooled electronic processing element are less than a predetermined limit.

Abstract: A cooling block comprising a body having fluid conduit for circulating a cooling fluid defined by a passage. The passage comprises a longitudinal passage axis; first and second internal sidewalls defining the passage; a plurality of pins disposed between the internal sidewalls for deflecting the cooling fluid flowing within the passage, each pin having a head end and a tail end, and the plurality of pins being disposed as a pin row in the passage with the head end and the tail end of each pin disposed along the longitudinal passage axis, wherein at least a portion of a perimeter shape of each pin is defined by a nested trigonometric function including a factor of asymmetry, the nested trigonometric function including a factor of asymmetry defining a spline which is used to manufacture the pin. A method of manufacturing the cooling block.

Abstract: A liquid cooling device for cooling at least one target component that includes: a base member to be in thermal contact with the at least one target component to be cooled by the liquid cooling device, the base member including a lower surface configured to be placed in contact with the at least one target component, the base member defining a plurality of pockets spaced apart from one another on an upper side thereof and defining a plurality of fluid conduits configured to internally circulate a cooling liquid therethrough. Each of the plurality of pockets arranged to accommodate a corresponding fluid conduit and an interconnecting channel defined by the base member and extending between two neighboring pockets of the plurality of pockets for distributing the cooling fluid from the fluid conduit of one pocket to the fluid conduit of a neighboring pocket.

Abstract: A rack assembly for a data center includes: a rack frame housing at least one heat-generating component; a heat exchanger defining a first internal fluid conduit; at least one liquid cooling block connected to the at least one heat-generating component, each of the at least one liquid cooling block defining a second internal fluid conduit, the second internal fluid conduit being in thermal connection with the first internal fluid conduit; a cooling loop independent from any sources of cooling fluid external to the rack assembly and comprising the first and second internal fluid conduits, the cooling loop transferring heat from the second internal fluid conduit to the first internal fluid conduit; and a fluid compensation system comprising a reservoir fluidly connected to the cooling loop and an actuating device to force cooling fluid from the reservoir to the cooling loop to compensate for loss of cooling fluid in the cooling loop.

Abstract: A method for making a cooling block for cooling a heat-generating electronic component. The method includes providing a base defining an open passage and a protrusion and providing a cover positionable on the base to close the open passage forming a fluid conduit. The cover has an underside defining a recess which receives at least a free end of the protrusion. The method includes positioning the cover on the base such that at least the free end of the protrusion is received in the recess and the open passage is closed to form the fluid conduit and welding an outer side of the cover, along a weld path which includes at least a portion on the cover above the recess. A cooling block made by the method.

Abstract: A connector for a cooling block having a connector body defining at least one connector passage. The connector is connectable to a top side of the cooling block body such that the at least one connector passage is in fluid communication with one or both of a conduit inlet and a conduit outlet of the cooling block. A cooling block comprising a cooling block body defining a fluid conduit therein for circulating a cooling fluid therethrough, the fluid conduit having a conduit inlet and a conduit outlet for receiving and discharging the cooling fluid respectively, and the connector connected to the top side of the cooling block body such that the at least one connector passage is in fluid communication with one or both of the conduit inlet and the conduit outlet of the cooling block.

Abstract: A liquid cooling arrangement for cooling a server rack housing a plurality of server clusters containing heat-generating processing assemblies with liquid cooling units is presented. The cooling arrangement comprises a liquid distribution loop supplying a cooling liquid to the server clusters and returning a heated liquid from the server clusters with heat exchangers fluidly connected to a supply side of the liquid distribution loop.

Abstract: A method for assembling a liquid cooling assembly includes: providing liquid cooling blocks each defining an internal fluid conduit; providing a first heat spreading base defining at least one first pocket; and providing a second heat spreading base defining second pockets, a number of second pockets being greater than a number of the at least one first pocket. When assembling a first liquid cooling assembly: at least one liquid cooling block is selected to mate with the first heat spreading base; and the selected at least one liquid cooling block is inserted at least partly into a corresponding one of the at least one first pocket. When assembling a second liquid cooling assembly: at least two liquid cooling blocks are selected to mate with the second heat spreading base; and the selected at least two liquid cooling blocks are inserted at least partly into corresponding ones of the second pockets.

Abstract: A liquid cooling arrangement for cooling heat-generating components of a datacenter server rack. The cooling arrangement includes a liquid cooling loop configured to convey a cooling liquid, a plurality of server clusters each server cluster having a plurality of server assemblies that incorporate at least one respective liquid cooling unit, and a plurality of heat exchangers fluidly connected to the liquid cooling units of the plurality of server clusters via the liquid cooling loop. The heat exchangers configured to receive the heated cooling liquid discharged from the respective liquid cooling units and cool the received heated cooling liquid along with a pump fluidly coupled to the plurality of heat exchangers via the liquid cooling loop, wherein at least a portion of the liquid cooling loop comprises a serialized configuration that serially couples the server clusters and/or serially couples the server clusters and the heat exchangers.

Abstract: A water block for cooling a heat-generating component has a body defining an internal fluid conduit for circulating fluid within the water block. The body defines a fluid inlet and a fluid outlet for feeding fluid into and discharging fluid from the internal fluid conduit respectively. The body includes: an external thermal transfer surface configured to be in contact with the heat-generating component; an opposite external surface on an opposite side of the body from the external thermal transfer surface; and at least one hollow fin extending from the opposite external surface, the at least one hollow fin defining at least one external fin passage, each of the at least one hollow fin defining an internal fin recess that forms part of the internal fluid conduit of the water block.

Abstract: A system provides cooling to an infrastructure having heat-generating units. Internal cooling units are thermally connected to the heat-generating units. An external cooling unit dissipates thermal energy of a heat-transfer fluid circulating in the internal cooling units. A cooling circuit connects the internal and external cooling units. A pump maintains a flow of the heat-transfer fluid for transferring thermal energy from the heat generating units to the external cooling unit. A reservoir thermally connected to the cooling circuit contains a phase change material (PCM) changing between solid and liquid states according to a temperature of the heat-transfer fluid. Thermal energy is transferred between the cooling circuit and the PCM depending on whether a temperature of the heat-transfer fluid is above or below a phase-change temperature value of the PCM. A supplemental cooling device thermally connected to the reservoir dissipates heat from the reservoir to the atmosphere.

Abstract: A cooling block includes a body having a thermal transfer surface configured to be in thermal contact with a heat-generating electronic component. The body defines a fluid conduit having a plurality of channels such that the cooling fluid flows in parallel along the channels. Each channel is defined between first and second internal sidewalls; and top and bottom walls. Each channel has either: a first dimensional configuration including first height and width values; or a second dimensional configuration including second height and width values. The first height value is greater than the second height value. The second width value is greater than the first width value. A thickness of a material of the body between the thermal transfer surface and a first channel is less than a thickness of the material of the body between the thermal transfer surface and a second channel.

Abstract: A cooling block for cooling a heat-generating electronic component includes a body defining a fluid conduit. The body includes a plurality of pins for deflecting cooling fluid flowing within the fluid conduit. The fluid conduit has a passage extending in a longitudinal direction from an inlet point to an outlet point. Each passage is defined by: first and second internal sidewalls facing each other from the inlet point to the outlet point; a pin row disposed between the first and second internal sidewalls, the pin row including a multitude of pins spaced apart from each other in the longitudinal direction, the pins of the pin row being aligned with each other in a lateral direction of the cooling block, each pin having a lacrimiform shape and having a rounded end and a pointed end, each pin being oriented such that the pointed end is downstream from the rounded end.

Abstract: A cooling block for cooling a heat-generating electronic component includes a body having a thermal transfer surface and defining a fluid conduit for circulating a cooling fluid therein. The fluid conduit has a passage extending from a first point to a second point along a longitudinal direction. The passage is defined in part by first and second internal sidewalls, each having a scalloped or undulating shape. A width of the passage is measured between the internal sidewalls in a lateral direction. The passage is defined in part by a pin row disposed between the internal sidewalls, the pin row including multiple pins. The pins of the pin row are spaced apart along the longitudinal direction and are aligned with each other in the lateral direction such that a linear pin axis extending in the longitudinal direction traverses each pin. A method for manufacturing a cooling block is also disclosed.

Abstract: Cooling arrangement and method for cooling of a heat source. The cooling arrangement includes a closed loop, a semi-open loop and at least one fan. The closed loop includes a primary side of a liquid-to-liquid heat exchanger receiving a first cooling fluid heated by the heat source, a first air-to-liquid heat exchanger downstream the primary side, and a first pump returning the first cooling fluid to the heat source. The semi-open loop includes a tank storing a second cooling fluid, a second pump drawing the second cooling fluid from the tank, a secondary side of the liquid-to-liquid heat exchanger receiving the second cooling fluid from the second pump, an evaporating pad downstream said secondary side, and an inlet fluidly connected to a source of the second cooling fluid. The at least one fan causes an air flow through the evaporating pad and through the first air-to-liquid heat exchanger.