Abstract: Disclosed is a semiconductor light emitting device including: a substrate; an n-type semiconductor layer giving an electron when receiving voltage; a p-type semiconductor layer giving a hole when receiving voltage; an active layer provided between the n-type semiconductor layer and the p-type semiconductor layer and including a quantum well structure to facilitate coupling between an electron and a hole; an n-type electrode including conductivity for applying voltage to the n-type semiconductor layer; a p-type electrode including conductivity for applying voltage to the p-type semiconductor layer; and am electric-current diffusion and hole injection layer provided between the p-type semiconductor layer and the p-type electrode and doped with n-type impurities and p-type impurities for diffusing an electric current and injecting a hole between the p-type electrode and the p-type semiconductor layer.

Abstract: Provided with a method of fabricating a 200-250 nm short-wavelength optoelectronic device, which has a combination of an optical device with a plurality of acceleration electrodes and a field emission device with a plurality of acceleration electrodes, from a semiconductor having a 5-6 eV energe band gap, based on a principle that an electron-hole pair is produced using a highly energetic electron which is injected from a field emission device, and short-wavelength photons are emitted when the electron recombines with the hole and confined in a quantum well to emit a light corresponding to the energy level of the quantum well, thereby eliminating the need of using dopants for forming n-p junctions in the semiconductor and achieving high efficiency in terms of energy because highly energetic electrons result in one or more electron-hole pairs.

Abstract: An effusion cell assembly for epitaxial apparatus is disclosed. The assembly includes an effusion cell incluing a growing material, a heater for supplying heats with the effusion cell to effuse the growing material, a supporting plate for supporting the heater, a bolt having one end connected to the supporting plate, a cell flange coupled to a lower flange of an adaptor for supporting the cell assembly, bellows fixed between the supporting plate and the cell flange including the bolt, and a control nut for expanding and contracting the bellows so as to separate only the cell assembly from a vacuum chamber with entire vacuum maintained in the vacuum chamber and local vacuum released in the cell assembly. The epitaxial apparatus further includes a control valve located between an entrance flange of the vacuum chamber and an upper adaptor flange of the adaptor for introducing and maintaining vacuum in the vacuum chamber.

Abstract: Disclosed is a fabricating method of a quantum wire laser diode, comprising the steps of preparing a GaAs substrate; sequentially forming n-type epitaxial layers and a first photoresist layer on the GaAs substrate; removing a portion of the intrinsic GaAs layer by using a first etching solution, and then removing the photoresist layer; wet-etching away a portion of the intrinsic AlAs layer in the vicinity of the opening by using a second etching solution; growing a quantum structure in the molecular beam epitaxy apparatus to form a multiple quantum well on the intrinsic GaAs layer and form a quantum wire on the n-type energy band slope layer through the opening; removing the quantum well, the intrinsic GaAs layer and the intrinsic AlAs layer simultaneously by using a third etching solution; sequentially forming a p-type energy band slope layer, a p-type cladding layer and a p.sup.