Abstract: Disclosed is an electrode assembly, a battery, and a battery pack and a vehicle including the same. In the electrode assembly, a first electrode, a second electrode, and a separator interposed therebetween are wound based on a winding axis to define a core and an outer circumference. The first electrode includes a first active material portion coated with an active material layer and a first uncoated portion not coated with an active material layer along a winding direction. At least a part of the first uncoated portion is defined as an electrode tab by itself. The first uncoated portion includes a first portion adjacent to the core of the electrode assembly, a second portion adjacent to the outer circumference of the electrode assembly, and a third portion interposed between the first portion and the second portion. The first portion or the second portion has a smaller height than the third portion in the winding axis direction.

Abstract: Disclosed is an electrode assembly, a battery, and a battery pack and a vehicle including the same. In the electrode assembly, a first electrode, a second electrode, and a separator interposed therebetween are wound based on an axis to define a core and an outer circumference. The first electrode includes an uncoated portion at a long side end thereof and exposed out of the separator along a winding axis direction of the electrode assembly. A part of the uncoated portion is bent in a radial direction of the electrode assembly to form a bending surface region that includes overlapping layers of the uncoated portion, and in a partial region of the bending surface region, the number of stacked layers of the uncoated portion is 10 or more in the winding axis direction of the electrode assembly.

Abstract: Example embodiments relate to a wafer aligning apparatus and a method thereof. The wafer aligning apparatus may include a first light sensor unit adapted to output light to an edge of a wafer, a second light sensor unit adapted to output light on a marking position of the wafer, and a controller to calculate a wafer aligning value from an edge position value and a marking position value read from the first and the second light sensor units, respectively.

Abstract: A multi-chamber processing system for use in manufacturing semiconductor devices allows various ones of the chambers to be disassembled while wafers continue to be processed using the remaining chambers. The multi-chamber processing system includes a load lock chamber, a process chamber, and a transfer chamber through which wafers are transferred between the load lock and process chambers, and a respective pair of gates interposed between the load lock chamber and the transfer chamber and between the transfer chamber and the process chamber. The manufacturing process can continue uninterrupted when the process chamber is cleaned or when one of the load lock and process chambers must be repaired.