Abstract: The present disclosure describes dual-band antenna arrays and related methods for manufacturing and implementing dual-band antenna arrays. One exemplary dual-band antenna array comprises a top layer of fused silica substrate; a bottom layer of fused silica substrate; a ground plane positioned between the top and bottom layers of fused silica substrate, wherein the ground plane comprises layers of three different metals; antenna patch elements arranged on top of the top layer of fused silica substrate; an input feedline arrange on the bottom layer of the fused silica substrate; and a meanderline complimentary split ring resonator structure etched on a top surface of the ground plane, wherein the input feedline is directly coupled to the meanderline complimentary split ring resonator structure and is configured to excite a plurality of resonance frequencies of the antenna patch elements.

Abstract: The present disclosure relates to a cathode active material and a method for manufacturing the same, and in particular, to a cathode active material capable of accelerating charge transfer and lithium ion diffusion by shortening a distance of lithium diffusion through electrospinning a mixture solution for manufacturing the cathode active material, and a method for manufacturing the same.

Abstract: An interposer includes an interposer body; first and second lower patterns spaced apart from each other on a lower surface of the interposer body; and first and second upper patterns spaced apart from each other on an upper surface of the interposer body. The first and second upper patterns include first and second shape-securing layers spaced apart from each other on the upper surface of the interposer body, and first and second acoustic noise reduction layers disposed on the first and second shape-securing layers, respectively. An electronic component includes a capacitor and the interposer.

Abstract: A composite electronic component includes a capacitor including a capacitor body including a dielectric layer and first and second internal electrodes alternately stacked with the dielectric layer interposed therebetween, and first and second electrodes disposed on the capacitor body, and a varistor including a varistor body including ZnO and third and fourth electrodes disposed on the varistor body, wherein the first electrode is electrically connected to the third electrode and the second electrode is electrically connected to the fourth electrode.

Abstract: A varistor includes a substrate; first and second electrodes disposed on an upper side and a lower side of the substrate, respectively; a core varistor body surrounded by the substrate and disposed between the first and second electrodes; first and second terminals having at least portions disposed on one side and the other side of the substrate, respectively, and electrically connected to the first and second electrodes, respectively; and a cover varistor body covering the core varistor body and disposed in a level higher than an upper surface of the substrate or disposed in a level lower than a lower surface of the substrate.

Abstract: An interposer includes an interposer body; first and second lower patterns spaced apart from each other on a lower surface of the interposer body; and first and second upper patterns spaced apart from each other on an upper surface of the interposer body. The first and second upper patterns include first and second shape-securing layers spaced apart from each other on the upper surface of the interposer body, and first and second acoustic noise reduction layers disposed on the first and second shape-securing layers, respectively. An electronic component includes a capacitor and the interposer.

Abstract: A varistor includes a varistor body, a first terminal disposed on one side of the varistor body, a second terminal disposed on the other side of the varistor body, a first electrode disposed on an upper portion of the varistor body, electrically connected to the first terminal, and extending towards the other side of the varistor body, and a second electrode disposed on a lower portion of the varistor body, electrically connected to the second terminal, and extending towards the one side of the varistor body.

Abstract: A varistor includes a substrate, a varistor body disposed on one surface of the substrate, first and second electrodes disposed on the varistor body and spaced apart from each other, an insulating layer disposed on at least two of the first and second electrodes and the varistor body, and first and second terminals disposed on first and second sides of the substrate opposing each other, electrically connected to the first and second electrodes, respectively, and spaced apart from each other. The substrate has mechanical strength greater than that of the varistor body.

Abstract: A varistor includes a substrate; first and second electrodes disposed on an upper side and a lower side of the substrate, respectively; a core varistor body surrounded by the substrate and disposed between the first and second electrodes; first and second terminals having at least portions disposed on one side and the other side of the substrate, respectively, and electrically connected to the first and second electrodes, respectively; and a cover varistor body covering the core varistor body and disposed in a level higher than an upper surface of the substrate or disposed in a level lower than a lower surface of the substrate.

Abstract: A varistor includes a varistor body, a first terminal disposed on one side of the varistor body, a second terminal disposed on the other side of the varistor body, a first electrode disposed on an upper portion of the varistor body, electrically connected to the first terminal, and extending towards the other side of the varistor body, and a second electrode disposed on a lower portion of the varistor body, electrically connected to the second terminal, and extending towards the one side of the varistor body.

Abstract: A composite electronic component includes a capacitor including a capacitor body including a dielectric layer and first and second internal electrodes alternately stacked with the dielectric layer interposed therebetween, and first and second electrodes disposed on the capacitor body, and a varistor including a varistor body including ZnO and third and fourth electrodes disposed on the varistor body, wherein the first electrode is electrically connected to the third electrode and the second electrode is electrically connected to the fourth electrode.

Abstract: A resistor element includes a base substrate, a resistor layer disposed on one surface of the base substrate, a first electrode layer and a second electrode layer disposed on the resistor layer to be spaced apart from each other, a third electrode layer disposed between the first electrode layer and the second electrode layer to be spaced apart from the first electrode layer and the second electrode layer, a conductive resin electrode disposed on at least one end of the third electrode layer, and first to third plating layers disposed on the first to third electrode layers, respectively.

Abstract: A resistor element includes a base substrate, a resistor layer disposed on one surface of the base substrate, a first electrode layer and a second electrode layer disposed on the resistor layer to be spaced apart from each other, a third electrode layer disposed between the first electrode layer and the second electrode layer to be spaced apart from the first electrode layer and the second electrode layer, a conductive resin electrode disposed on at least one end of the third electrode layer, and first to third plating layers disposed on the first to third electrode layers, respectively.

Abstract: A resistor element includes a base substrate having first and second surfaces opposing each other; a resistor layer disposed on the first surface of the base substrate; first and second terminals disposed on opposing end portions of the base substrate, respectively, and electrically connected to opposing sides of the resistor layer, respectively; a third terminal disposed between the first terminal and the second terminal on the second surface of the base substrate and spaced apart from the first terminal and the second terminal; and electrostatic discharge (ESD)-preventing members connecting the first terminal and the third terminal to each other and connecting the second terminal and the third terminal to each other.

Abstract: A resistor element includes a base substrate having first and second surfaces opposing each other; a resistor layer disposed on the first surface of the base substrate; first and second terminals disposed on opposing end portions of the base substrate, respectively, and electrically connected to opposing sides of the resistor layer, respectively; a third terminal disposed between the first terminal and the second terminal on the second surface of the base substrate and spaced apart from the first terminal and the second terminal; and electrostatic discharge (ESD)-preventing members connecting the first terminal and the third terminal to each other and connecting the second terminal and the third terminal to each other.

Abstract: A resistor element includes a base substrate, a resistor layer disposed on one surface of the base substrate, a first electrode layer and a second electrode layer disposed on the resistor layer spaced apart from each other, a third electrode layer disposed between the first electrode layer and the second electrode layer to be spaced apart from the first electrode layer and the second electrode layer and being thicker than each of the first electrode layer and the second electrode layer, and first to third plating layers disposed on the first to third electrode layers, respectively.

Abstract: A resistor includes: a base substrate; a resistance layer disposed on one surface of the base substrate; first and second electrode layers disposed to be spaced apart from each other and covering portions of the resistance layer; and a third electrode layer disposed between the first and second electrode layers to be spaced apart from the first and second electrode layers and covering a portion of the resistance layer.

Abstract: A multi-terminal electronic component includes: a base material; a resistance layer disposed on a surface of the base material; a first terminal and a second terminal disposed to be spaced apart from each other while covering portions of the resistance layer, respectively; and a third terminal disposed between the first terminal and the second terminal and covering a portion of the resistance layer, wherein first and second side surfaces of the base material opposing each other are exposed from the first through third terminals.

Abstract: A resistor element includes a base substrate, a resistor layer disposed on one surface of the base substrate, a first electrode layer and a second electrode layer disposed on the resistor layer to be spaced apart from each other, a third electrode layer disposed between the first electrode layer and the second electrode layer to be spaced apart from the first electrode layer and the second electrode layer, a conductive resin electrode disposed on at least one end of the third electrode layer, and first to third plating layers disposed on the first to third electrode layers, respectively.