Abstract: In an image processing method for a mobile communication terminal, a threshold value is set in advance for a state of traffic. A processing buffer of a second layer of the mobile terminal then analyzes a current state of traffic and compares it with the pre-set threshold value. If the traffic exceeds the threshold value, resolution of an image input through a camera is reduced, and the resolution-reduced image is transmitted. As a result, a natural looking image can be provided according to the state of traffic and thus reliability of a service quality can be enhanced.

Abstract: A washing machine having a broadcasting receiver for providing various multimedia contents on the washing machine is disclosed. A broadcast signal reception module is provided in the washing machine, such as a washer or dryer, which is frequently used in the user's living space. Therefore, the washing machine can not only perform a washing operation, but also output a broadcast signal. In particular, the provision of the broadcast signal reception module in the washing machine enables reception of a mobile broadcast signal, as well as a fixed broadcast signal, thereby making it possible to provide more various multimedia contents through the washing machine. Therefore, it is possible to increase customer satisfaction with a multifunction-alization of the washing machine and thus use the washing machine more universally, resulting in an increase in the competitiveness of a product.

Abstract: In one embodiment, a semiconductor chip has one or more peripheral bond pads. The semiconductor chip comprises a semiconductor substrate having a cell region and a peripheral circuit region adjacent to each other; a bond pad-wiring pattern formed on at least a part of the peripheral region of the semiconductor substrate; a passivation layer formed on the bond pad-wiring pattern and exposed portions of the semiconductor substrate; a pad-rearrangement pattern disposed over the passivation layer and electrically connected to the bond pad-wiring pattern; and an insulating layer formed over the pad-rearrangement pattern. The insulating layer has an opening therein that exposes a portion of the pad-rearrangement pattern to define a bond pad. The bond pad is disposed over at least a part of the cell region.

Abstract: A semiconductor package includes a semiconductor substrate having integrated circuits formed on a cell region and a peripheral circuit region adjacent to each other. A bond pad-wiring pattern is formed on the semiconductor substrate. A pad-rearrangement pattern is electrically connected to the bond pad-wiring pattern, The pad-rearrangement pattern includes a bond pad disposed over at least a part of the cell region.

Abstract: A semiconductor chip comprises a semiconductor substrate having integrated circuits formed on a cell region and a peripheral circuit region adjacent to each other. A bond pad-wiring pattern is formed on the semiconductor substrate. A pad-rearrangement pattern is electrically connected to the bond pad-wiring pattern. The pad-rearrangement pattern includes a bond pad disposed over at least a part of the cell region. Thus, with the embodiments of the present invention, the overall chip size can thereby be substantially reduced and an MCP can be fabricated without the problems mentioned above.

Abstract: A semiconductor chip comprises a semiconductor substrate having integrated circuits formed on a cell region and a peripheral circuit region adjacent to each other. A bond pad-wiring pattern is formed on the semiconductor substrate. A pad-rearrangement pattern is electrically connected to the bond pad-wiring pattern. The pad-rearrangement pattern includes a bond pad disposed over at least a part of the cell region. The bond pad-wiring pattern is formed substantially in a center region of the semiconductor substrate. Thus, with the embodiments of the present invention, the overall chip size can thereby be substantially reduced and an MCP can be fabricated without the problems mentioned above.

Abstract: A semiconductor chip comprises a semiconductor substrate having integrated circuits formed on a cell region and a peripheral circuit region adjacent to each other. A bond pad-wiring pattern is formed on the semiconductor substrate. A pad-rearrangement pattern is electrically connected to the bond pad-wiring pattern. The pad-rearrangement pattern includes a bond pad disposed over at least a part of the cell region. The bond pad-wiring pattern is formed substantially in a center region of the semiconductor substrate. Thus, with the embodiments of the present invention, the overall chip size can thereby be substantially reduced and an MCP can be fabricated without the problems mentioned above.

Abstract: A semiconductor chip comprises a semiconductor substrate having integrated circuits formed on a cell region and a peripheral circuit region adjacent to each other. A bond pad-wiring pattern is formed on the semiconductor substrate. A pad-rearrangement pattern is electrically connected to the bond pad-wiring pattern. The pad-rearrangement pattern includes a bond pad disposed over at least a part of the cell region. The bond pad-wiring pattern is formed substantially in a center region of the semiconductor substrate. Thus, with the embodiments of the present invention, the overall chip size can thereby be substantially reduced and an MCP can be fabricated without the problems mentioned above.

Abstract: A drying machine according to the present invention includes an interface unit connected to a separate washing machine with a data communication line for receiving load information from the washing machine, a rotatable drum containing a load of wet clothes which are previously washed by the washing machine, and an air supply system coupled to the drum for supplying dry air into the drum. The machine further includes a heater coupled to the air supply system for heating the dry air, and a dryer controller generating a control signal to the heater in accordance with a set of operation values which are determined based on the load information.

Abstract: A dishwasher, and a screen filter and a pump lower unit of the dishwasher are provided. The dishwasher includes the pump lower unit and the screen filter, a mounting protrusion and an insert hole, and a mounting knob. The screen filter is installed on the pump lower unit for removing impurities from wash liquid. The mounting protrusion and the insert hole are for aligning the screen filter with the pump lower unit. The mounting knob is for coupling a fastening member to fasten the screen filter to the pump lower unit.

Abstract: A sump of a dishwasher is provided. The dishwasher sump includes a case, a drain pump formed on the sump case, and a check valve that maintains pressure inside the drain pump at a predetermined pressure.

Abstract: There is provided a sump assembly of a dishwasher. The sump assembly includes a sump case for reserving washing water, the sump case having coupling bosses protruded upward, a sump cover seating on an upper portion of the sump case, the sump cover having a coupling boss and a coupling hole in which a coupling member is inserted, a self-cleaning filter assembly mounted on a top surface of the sump cover to filter foreign objects, the self-cleaning assembly having a coupling hole in which the coupling member is inserted, a washing pump for pumping out the washing water reserved in the sump case, a fluid passage guide for guiding flow of the washing water pumped from the washing pump, the fluid passage being mounted on a bottom of the sump cover, and a pump lower disposed between the washing pump and the fluid passage guide, the pump lower having a first coupling boss formed on a frame portion and a second coupling boss formed therein.

Abstract: A sump assembly for preventing leakage during the flow of washing water is provided. The sump assembly includes a sump case, a fluid passage guide, a sump cover, a lower nozzle holder, and a self-cleaning filter assembly. The sump case stores washing water. The fluid passage guide is disposed on top of the sump case and includes a wash pump within for inducing a forced flow of washing water. The sump cover is mounted on top of the fluid passage guide. The lower nozzle holder firmly contacts the top of the sump cover. The self-cleaning filter assembly is disposed in a space between the sump cover and the lower nozzle holder and includes a mesh filter within for filtering foreign objects.

Abstract: There is provided a soil jam preventing structure of a dishwasher having a tub. The soil jam preventing structure includes a sump case mounted on a floor of the tub to reserve washing water and a sump cover seating on an upper portion of the sump case, the sump cover having an outer frame portion, a rib extending from the outer frame portion, and a foreign object drain groove formed by cutting away a portion of the rib.

Abstract: A capacitor array of a semiconductor device including a plurality of capacitors is provided. The capacitor array includes a plurality of lower electrodes, which are formed over a semiconductor substrate. A dielectric layer formed over the lower electrodes, and an upper electrode formed over the dielectric layer. The plurality of lower electrodes are insulated from each other either by an insulating layer having pores of a low dielectric constant, or by an air gap.

Abstract: The present invention relates to a dryness measuring device, and more particularly the dryness measuring device for sensing a dryness status of laundry in drying. The present invention is to provide an electrode sensor for sensing the dryness status of the laundry and measuring a current dryness status by a variance of a voltage which is charged in capacitor based on a variance of resistance of the electrode sensor. And, the present invention minimizes outside effect by discharging of the charged voltage of the capacitor by designated periods.

Abstract: The present invention relates to a drier, more particularly a drier and a method of controlling drying for the same for prohibiting a heater form operating with an error and controlling a quantity of a power needed drying. For the process, the present invention is to provide a device (320) for checking whether a blower (31) is normally operated or not, a plurality of heaters, and a plurality of switching devices for controlling the heaters.

Abstract: A semiconductor chip comprises a semiconductor substrate having integrated circuits formed on a cell region and a peripheral circuit region adjacent to each other. A bond pad-wiring pattern is formed on the semiconductor substrate. A pad-rearrangement pattern is electrically connected to the bond pad-wiring pattern. The pad-rearrangement pattern includes a bond pad disposed over at least a part of the cell region. The bond pad-wiring pattern is formed substantially in a center region of the semiconductor substrate. Thus, with the embodiments of the present invention, the overall chip size can thereby be substantially reduced and an MCP can be fabricated without the problems mentioned above.

Abstract: The present invention relates to a dryness measuring device, and more particularly the dryness measuring device for sensing a dryness status of laundry in drying. The present invention is to provide an electrode sensor for sensing the dryness status of the laundry and measuring a current dryness status by a variance of a voltage which is charged in capacitor based on a variance of resistance of the electrode sensor. And, the present invention minimizes outside effect by discharging of the charged voltage of the capacitor by designated periods.