Abstract: An electrode for a dye-sensitized solar cell of the present invention includes a substrate; and a nanocomposite layer including a nanocomposite formed on the substrate, wherein the nanocomposite contains: metal, metal oxide or both; and inorganic materials, a conductive polymer or both.

Abstract: Disclosed is an apparatus for spinning a test tray and an in-line test handler including the above apparatus, wherein the apparatus may include a supporting unit for supporting a test tray transported between first and second chamber units facing in the different directions, wherein the first chamber unit is provided at a predetermined interval from the second chamber unit; a base unit to which the supporting unit is spinnably connected; and a spinning unit which spins the test tray so that semiconductor devices received in the test tray are tested at the same arrangement in each of the first chamber unit and the second chamber unit.

Abstract: Disclosed is an apparatus for spinning a test tray and an in-line test handler including the above apparatus, wherein the apparatus may include a supporting unit for supporting a test tray transported between first and second chamber units facing in the different directions, wherein the first chamber unit is provided at a predetermined interval from the second chamber unit; a base unit to which the supporting unit is spinnably connected; and a spinning unit which spins the test tray so that semiconductor devices received in the test tray are tested at the same arrangement in each of the first chamber unit and the second chamber unit.

Abstract: Provided is a nanocomplex comprising a core consisting of a metal; and a periphery being formed on a surface of the core to surround the core and consisting of an inorganic substance and a conductive polymer.

Abstract: Provided is a nanocomplex comprising a core consisting of a metal; and a periphery being formed on a surface of the core to surround the core and consisting of an inorganic substance and a conductive polymer

Abstract: A test handler includes a loading unit including a loading picker and a loading ascending/descending unit, an unloading unit including an unloading picker and an unloading ascending/descending unit, and a chamber system. A passage site connects the loading unit and the chamber system, and also connects the chamber system and the unloading unit. The arrangement of the handler reduces the time for the loading and unloading processes by performing the loading and unloading processes on separate test trays located at separate loading and unloading positions.

Abstract: An apparatus for transferring packaged chips, a test handler, and a method for manufacturing packaged chips are provided. The apparatus for transferring packaged chips may include a main frame having a coupling member coupled to a base plate and a supporting member coupled to the coupling member, a plurality of first pickers coupled to one side of the supporting member so as to be movable in a horizontal direction, a plurality of second pickers coupled to the other side of the supporting member so as to be movable in the horizontal direction, and a control unit to determine distances by which the first pickers and the second pickers move in the horizontal direction.

Abstract: A handler for handling semiconductor chips during a testing process includes a loading position at which packaged chips are loaded into a test tray, and an unloading position at which the packaged chips are unloaded from the test tray. The test tray follows a path through the handler from the loading position to the unloading position, and from the unloading position to the loading position. By separately performing the loading and unloading operations at these different positions within the handler, malfunctions in loading and unloading pickers that load and unload the chips may be reduced. Further, a malfunction in one picker performing one operation may be prevented from influencing operations of the other picker performing another operation. Additionally, collision between the loading picker and the unloading picker may be prevented.

Abstract: A test handler includes a loading unit including a loading picker and a loading ascending/descending unit, an unloading unit including an unloading picker and an unloading ascending/descending unit, and a chamber system. A passage site connects the loading unit and the chamber system, and also connects the chamber system and the unloading unit. The arrangement of the handler reduces the time for the loading and unloading processes by performing the loading and unloading processes on separate test trays located at separate loading and unloading positions.

Abstract: A handler for handling semiconductor chips during a testing process includes a loading position at which packaged chips are loaded into a test tray, and an unloading position at which the packaged chips are unloaded from the test tray. The test tray follows a path through the handler from the loading position to the unloading position, and from the unloading position to the loading position. By separately performing the loading and unloading operations at these different positions within the handler, malfunctions in loading and unloading pickers that load and unload the chips may be reduced. Further, a malfunction in one picker performing one operation may be prevented from influencing operations of the other picker performing another operation. Additionally, collision between the loading picker and the unloading picker may be prevented.

Abstract: A carrier module for a test tray includes a main body having an insertion slot that passes through the main body. An upright-positionable packaged chip can be inserted into the insertion slot, and a holding unit, provided on the main body holds and releases the upright-positionable packaged chip. The upright positionable packaged chip is held in a position where electrical contacts on the chip package are exposed from the main body so that the chip package can be tested.