Abstract: A cleaning composition, a cleaning apparatus, and a method of fabricating a semiconductor device, the cleaning composition including a surfactant; deionized water; and an organic compound, wherein the surfactant is included in the cleaning composition in a concentration of about 0.28 M to about 0.39 M or a mole fraction of about 0.01 to about 0.017, and wherein the organic compound is included in the cleaning composition in a concentration of about 7.1 M to about 7.5 M or a mole fraction of about 0.27 to about 0.35.

Abstract: A cleaning composition, a cleaning apparatus, and a method of fabricating a semiconductor device, the cleaning composition including a surfactant; deionized water; and an organic compound, wherein the surfactant is included in the cleaning composition in a concentration of about 0.28M to about 0.39 M or a mole fraction of about 0.01 to about 0.017, and wherein the organic compound is included in the cleaning composition in a concentration of about 7.1 M to about 7.5 M or a mole fraction of about 0.27 to about 0.035.

Abstract: Disclosed are relate to an apparatus for supplying a cleaning liquid to a substrate. The cleaning liquid supply unit includes a mixing container having a liquid mixing space in the interior thereof, a first supply member configured to supply a first liquid into the liquid mixing space, a second supply member configured to supply a second liquid that is different from the first liquid into the liquid mixing space, and a mixing member configured to mix the first liquid and the second liquid supplied into the liquid mixing space, and the mixing member may include a circulation line, through which the liquids in the liquid mixing space circulate, and a pressure adjusting member configured to provide a pressure to the liquids such that the liquids in the liquid mixing space flows into the circulation line and adjust the pressure.

Abstract: Disclosed are an apparatus and a method for manufacturing a cleaning solution. The method includes mixing a surfactant chemical and pure water at a first temperature, and after the mixing of the surfactant chemical and the pure water at the first temperature, mixing the surfactant chemical and the pure water while cooling the surfactant chemical and the pure water to a second temperature that is lower than the first temperature.