Abstract: There is provided an adhesive tape for manufacturing electronic components comprising a heat-resistant substrate and an adhesive layer containing an adhesive composition disposed on the heat-resistant substrate, wherein the adhesive composition comprises a phenoxy resin, a curing agent, an energy ray curable acrylic resin and a photoinitiator, and wherein the adhesive layer is cured by heat and an energy ray.

Abstract: There is provided an adhesive tape for manufacturing electronic components comprising a heat-resistant substrate and an adhesive layer containing an adhesive composition disposed on the heat-resistant substrate, wherein the adhesive composition comprises a phenoxy resin, a curing agent, an energy ray curable acrylic resin and a photoinitiator, and wherein the adhesive layer is cured by heat and an energy ray.

Abstract: Disclosed herein are a resin composition for no-flow underfill, which can be formed into a film, a no-flow underfill film formed from the composition and a manufacturing method of the no-flow underfill film. The resin composition for no-flow underfill has a viscosity higher than 500 cps which is suitable for coating on a film. Thus, the no-flow underfill composition can be manufactured into a laminatable film type without any additional additive. Accordingly, the resin composition makes it possible to accurately control the thickness and area of underfill, unlike the prior paste type composition.

Abstract: This disclosure provides a method for laminating an adhesive tape and a lead frame, more specifically to reduce the warpage of a lead frame after heated lamination in which an adhesive tape for manufacturing semiconductor devices is attached to the lead frame, satisfying all the properties required for lamination, and avoiding adhesive residues from adhesive tapes and the leakage of a sealing resin. A method for laminating an adhesive tape and a lead frame comprises laminating an adhesive tape and a lead, wherein the lamination temperature of an adhesive tape surface and that of a lead frame surface are different from each other, for example, wherein the lamination temperature of the lead frame surface is lower than that of the adhesive tape surface by about 1 to about 200° C.

Abstract: There is provided a method for treating a surface of a substrate, comprising forming a layer, such as a mixed self-assembled monolayer (SAM), on the surface via chemical vapor deposition (CVD) with a CF3-functionalized organic silane and a CH3-functionalized organic silane, wherein the length of a carbon chain of the CH3-functional organic silane is shorter than a carbon chain of the CF3-functionalized organic silane.