Patents by Inventor Hae Suk Chung

Hae Suk Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240274361
    Abstract: A multilayer electronic component according to an example embodiment of the present disclosure includes: a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer; and an external electrode disposed on the body, wherein the external electrode includes an electrode layer disposed on the body and connected to an internal electrode and including Cu and glass, and a plating layer disposed on the electrode layer, at least a portion of the Cu and at least a portion of the glass are disposed adjacent to the plating layer, and an oxide including Cu is disposed on at least a portion of Cu and at least a portion of the glass disposed adjacent to the plating layer.
    Type: Application
    Filed: December 26, 2023
    Publication date: August 15, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: San KYEONG, Ho Yeol LEE, Soung Jin KIM, Kun Hoi KOO, Hong Bum LEE, Bum Suk KANG, Kyung Ryul LEE, Hae Suk CHUNG
  • Publication number: 20240222011
    Abstract: A capacitor component may include: first and second connection conductive layers; a plurality of conductive nanowires respectively connecting the first and second connection conductive layers; a conductive body disposed between the first and second connection conductive layers to have a plurality of through-holes in which the plurality of conductive nanowires are disposed; and a dielectric film disposed so that at least a portion thereof is disposed between the plurality of conductive nanowires and the conductive body in the plurality of through-holes, wherein an aspect ratio, which is a ratio of a length to a width of one of the plurality of conductive nanowires, may be 1000 or more.
    Type: Application
    Filed: October 17, 2023
    Publication date: July 4, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hae Suk CHUNG, Woon Kyung LEE, Jung Sub CHOI, Gwang Pyo PARK, Ji Hoon PARK, Jun Goo WON, Hyun Goo JEON, Kwang Mook LEE
  • Publication number: 20240212941
    Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes; and external electrodes disposed on the body, wherein the dielectric layer includes a plurality of dielectric grains having a perovskite-based composition represented by ABO3, the A includes a first element including at least one of Bi, Na, K, Sr, and Ca, and the B includes a second element including Ti, wherein at least one of the plurality of dielectric grains has a core-shell structure, and a content of the first element included in the core portion is twice or more than a content of the first element included in the shell portion, and wherein the core portion includes a first core portion on an internal side and a second core portion covering at least a portion of the first core portion, and the second core portion includes Zr.
    Type: Application
    Filed: December 20, 2023
    Publication date: June 27, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chan Hee NAM, Oh Hun GWON, Jae Hyun PARK, Kwan Yeol PAEK, Chang Geon LEE, Hae Suk CHUNG
  • Patent number: 11618716
    Abstract: A manufacturing method of a dielectric ceramic composition includes attaching a reactive functional group to a surface of a base material powder particle of a perovskite structure.
    Type: Grant
    Filed: March 31, 2020
    Date of Patent: April 4, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chang Geon Lee, Hae Suk Chung, Yoon Soo Park, Dong Jun Jung, Yun Jung Park
  • Publication number: 20230093953
    Abstract: A method of producing a core-shell particle includes introducing a barium titanate-based base powder and an additive to a reactor, and exposing the barium titanate-based base powder and the additive to a thermal plasma torch to obtain core-shell particles including a core portion having barium titanate (BaTiO3) and a shell portion including the additive and formed on a surface of the core portion.
    Type: Application
    Filed: November 22, 2022
    Publication date: March 30, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Sung CHUN, Hae Suk CHUNG, Byung Sung KANG, Yun Jung PARK, Young Hoon SONG
  • Patent number: 11551871
    Abstract: A dielectric composition includes a ceramic powder, a high polymerization binder, and a low polymerization binder type dispersant having a degree of polymerization between 100 and 1,000.
    Type: Grant
    Filed: January 14, 2021
    Date of Patent: January 10, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Sung Chun, Seul Gi Kim, Hyo Kyong Seo, Hae Suk Chung, Byung Sung Kang
  • Patent number: 11538630
    Abstract: A method of producing a core-shell particle includes introducing a barium titanate-based base powder and an additive to a reactor, and exposing the barium titanate-based base powder and the additive to a thermal plasma torch to obtain core-shell particles including a core portion having barium titanate (BaTiO3) and a shell portion including the additive and formed on a surface of the core portion.
    Type: Grant
    Filed: May 1, 2020
    Date of Patent: December 27, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Sung Chun, Hae Suk Chung, Byung Sung Kang, Yun Jung Park, Young Hoon Song
  • Patent number: 11469044
    Abstract: A capacitor component includes a body including a plurality of dielectric layers and first and second internal electrodes, alternately disposed to face each other with respective dielectric layers interposed therebetween, and first and second external electrodes disposed on external surfaces of the body and connected to the first and second internal electrodes, respectively. The body includes a capacitance forming portion, in which capacitance is formed by including the first and second internal electrodes, cover portions disposed above and below the capacitance forming portion, respectively, and margin portions disposed on both side surfaces of the capacitance forming portion, respectively. At least one selected from the cover portions and the margin portions includes a plurality of graphene platelets.
    Type: Grant
    Filed: September 9, 2020
    Date of Patent: October 11, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Du Won Choi, Ji Hong Jo, Seok Kyoon Woo, Hae Suk Chung
  • Patent number: 11387041
    Abstract: By controlling shapes of internal electrodes, when short-circuit occurs between the internal electrodes, a short-circuited portion may be opened by an overcurrent, to serve as a fuse. Also, by controlling shapes of internal electrodes, equivalent series inductance (ESL) at a high frequency may be reduced.
    Type: Grant
    Filed: April 21, 2020
    Date of Patent: July 12, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Sun Won, Jong Duck Kim, Hae Suk Chung, Jae Joon Yu, Won Woo Cho, Ki Hong Kim
  • Patent number: 11227724
    Abstract: A method of manufacturing a multilayer ceramic capacitor includes forming a water-repellent coating layer on surfaces of a multilayer ceramic capacitor having an internal electrode, a dielectric layer, and an external electrode; and removing at least a portion of the water-repellent coating layer formed on the surfaces of the external electrode such that another portion of the water-repellent coating layer remains on surfaces of the dielectric layer. The external electrode has first and second surfaces opposing each other in a thickness direction, third and fourth surfaces opposing each other in a width direction, and fifth and sixth surfaces opposing each other in a length direction.
    Type: Grant
    Filed: August 20, 2019
    Date of Patent: January 18, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Sung Chun, Hyo Kyong Seo, Hae Suk Chung, Chae Min Park, Byung Sung Kang
  • Publication number: 20210188713
    Abstract: A manufacturing method of a dielectric ceramic composition includes attaching a reactive functional group to a surface of a base material powder particle of a perovskite structure.
    Type: Application
    Filed: March 31, 2020
    Publication date: June 24, 2021
    Inventors: Chang Geon LEE, Hae Suk CHUNG, Yoon Soo PARK, Dong Jun JUNG, Yun Jung PARK
  • Publication number: 20210193385
    Abstract: By controlling shapes of internal electrodes, when short-circuit occurs between the internal electrodes, a short-circuited portion may be opened by an overcurrent, to serve as a fuse. Also, by controlling shapes of internal electrodes, equivalent series inductance (ESL) at a high frequency may be reduced.
    Type: Application
    Filed: April 21, 2020
    Publication date: June 24, 2021
    Inventors: Jae Sun WON, Jong Duck KIM, Hae Suk CHUNG, Jae Joon YU, Won Woo CHO, Ki Hong KIM
  • Publication number: 20210159013
    Abstract: A method of producing a core-shell particle includes introducing a barium titanate-based base powder and an additive to a reactor, and exposing the barium titanate-based base powder and the additive to a thermal plasma torch to obtain core-shell particles including a core portion having barium titanate (BaTiO3) and a shell portion including the additive and formed on a surface of the core portion.
    Type: Application
    Filed: May 1, 2020
    Publication date: May 27, 2021
    Inventors: Jin Sung CHUN, Hae Suk CHUNG, Byung Sung KANG, Yun Jung PARK, Young Hoon SONG
  • Patent number: 11017953
    Abstract: A multilayer ceramic electronic component includes: a ceramic body having a dielectric layer, and a plurality of first and second internal electrodes facing each other with the dielectric layer interposed therebetween; and first and second external electrodes disposed on an outer surface of the ceramic body, respectively. The ceramic body includes an active portion including a plurality of internal electrodes facing each other with the dielectric layer interposed therebetween to form capacitance, and cover portions formed on upper and lower portions of the active portion. A buffer region is disposed between at least one pair of first and second internal electrodes among the plurality of first and second internal electrodes disposed inside the active portion, and satisfies the relation 0<tb<150 ?m+td, where td is a thickness of the dielectric layer, and tb is a thickness of the buffer region.
    Type: Grant
    Filed: July 30, 2020
    Date of Patent: May 25, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kyeong Jun Kim, Jang Hyun Lee, Hae Suk Chung, Do Lee, Byung Sung Kang, Ho In Jun
  • Publication number: 20210134528
    Abstract: A dielectric composition includes a ceramic powder, a high polymerization binder, and a low polymerization binder type dispersant having a degree of polymerization between 100 and 1,000.
    Type: Application
    Filed: January 14, 2021
    Publication date: May 6, 2021
    Inventors: Jin Sung CHUN, Seul Gi KIM, Hyo Kyong SEO, Hae Suk CHUNG, Byung Sung KANG
  • Publication number: 20200411238
    Abstract: A capacitor component includes a body including a plurality of dielectric layers and first and second internal electrodes, alternately disposed to face each other with respective dielectric layers interposed therebetween, and first and second external electrodes disposed on external surfaces of the body and connected to the first and second internal electrodes, respectively. The body includes a capacitance forming portion, in which capacitance is formed by including the first and second internal electrodes, cover portions disposed above and below the capacitance forming portion, respectively, and margin portions disposed on both side surfaces of the capacitance forming portion, respectively. At least one selected from the cover portions and the margin portions includes a plurality of graphene platelets.
    Type: Application
    Filed: September 9, 2020
    Publication date: December 31, 2020
    Inventors: Du Won CHOI, Ji Hong JO, Seok Kyoon WOO, Hae Suk CHUNG
  • Patent number: 10867749
    Abstract: A multilayer capacitor includes a capacitor body, a first external electrode, and a second external electrode. The capacitor body includes a plurality of first and second internal electrodes alternately stacked with dielectric layer interposed therebetween. The first and second external electrodes are electrically connected to the first and second internal electrodes, respectively. A first Schottky layer is Schottky-junctioned to an interface between the dielectric layer and the first internal electrode in the capacitor body. A second Schottky layer is Schottky-junctioned to an interface between the dielectric later and the second internal electrode in the capacitor body. The work function values of the first and second Schottky layers is higher than the work function values of the first and second internal electrodes.
    Type: Grant
    Filed: October 26, 2018
    Date of Patent: December 15, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Sung Chun, Hae Suk Chung, Kyeong Jun Kim, Byung Sung Kang
  • Publication number: 20200357575
    Abstract: A multilayer ceramic electronic component includes: a ceramic body having a dielectric layer, and a plurality of first and second internal electrodes facing each other with the dielectric layer interposed therebetween; and first and second external electrodes disposed on an outer surface of the ceramic body, respectively. The ceramic body includes an active portion including a plurality of internal electrodes facing each other with the dielectric layer interposed therebetween to form capacitance, and cover portions formed on upper and lower portions of the active portion. A buffer region is disposed between at least one pair of first and second internal electrodes among the plurality of first and second internal electrodes disposed inside the active portion, and satisfies the relation 0<tb<150 ?m+td, where td is a thickness of the dielectric layer, and tb is a thickness of the buffer region.
    Type: Application
    Filed: July 30, 2020
    Publication date: November 12, 2020
    Inventors: Kyeong Jun KIM, Jang Hyun LEE, Hae Suk CHUNG, Do LEE, Byung Sung KANG, Ho In JUN
  • Patent number: 10796851
    Abstract: A capacitor component includes a body including a plurality of dielectric layers and first and second internal electrodes, alternately disposed to face each other with respective dielectric layers interposed therebetween, and first and second external electrodes disposed on external surfaces of the body and connected to the first and second internal electrodes, respectively. The body includes a capacitance forming portion, in which capacitance is formed by including the first and second internal electrodes, cover portions disposed above and below the capacitance forming portion, respectively, and margin portions disposed on both side surfaces of the capacitance forming portion, respectively. At least one selected from the cover portions and the margin portions includes a plurality of graphene platelets.
    Type: Grant
    Filed: March 5, 2019
    Date of Patent: October 6, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Du Won Choi, Ji Hong Jo, Seok Kyoon Woo, Hae Suk Chung
  • Patent number: 10755860
    Abstract: A multilayer ceramic electronic component includes: a ceramic body having a dielectric layer, and a plurality of first and second internal electrodes facing each other with the dielectric layer interposed therebetween; and first and second external electrodes disposed on an outer surface of the ceramic body, respectively. The ceramic body includes an active portion including a plurality of internal electrodes facing each other with the dielectric layer interposed therebetween to form capacitance, and cover portions formed on upper and lower portions of the active portion. A buffer region is disposed between at least one pair of first and second internal electrodes among the plurality of first and second internal electrodes disposed inside the active portion, and satisfies the relation 0<tb<150 ?m+td, where td is a thickness of the dielectric layer, and tb is a thickness of the buffer region.
    Type: Grant
    Filed: February 13, 2019
    Date of Patent: August 25, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kyeong Jun Kim, Jang Hyun Lee, Hae Suk Chung, Do Lee, Byung Sung Kang, Ho In Jun