Patents by Inventor Hae Won Yoon

Hae Won Yoon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hydrogen sensor and hydrogen sensor manufacturing method
    Patent number: 12013384
    Abstract: Disclosed herein is a method for manufacturing a hydrogen sensor, the method comprising the steps of: disposing a thin film made of a transition metal or an alloy thereof on a surface of elastic substrate; applying a tensile force in a repetitive manner to the elastic substrate to form a nanocrack on the thin film disposed on the surface of the elastic substrate; and injecting hydrogen gas into the formed nanocrack and then removing the hydrogen gas to form a nanogap, wherein the tensile force in the step of forming a nanocrack is applied to an extent that the elastic substrate has a tensile strain of 25% to 100%.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: June 18, 2024
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION, INDUSTRY-ACADEMIC COOPERATION FNDN, YONSEI UNIV
    Inventors: Dong Gu Kim, Jang Hyeon Lee, Dae Sung Kwon, Hyun Soo Kim, Il Seon Yoo, Tae Ho Jeong, Woo Young Lee, Hyun Sook Lee, Se Young Park, Soo Min Lee, Jin Kyo Jeong, Hae Won Yoon
  • HYDROGEN SENSOR AND HYDROGEN SENSOR MANUFACTURING METHOD
    Publication number: 20230130510
    Abstract: Disclosed herein is a method for manufacturing a hydrogen sensor, the method comprising the steps of: disposing a thin film made of a transition metal or an alloy thereof on a surface of elastic substrate; applying a tensile force in a repetitive manner to the elastic substrate to form a nanocrack on the thin film disposed on the surface of the elastic substrate; and injecting hydrogen gas into the formed nanocrack and then removing the hydrogen gas to form a nanogap, wherein the tensile force in the step of forming a nanocrack is applied to an extent that the elastic substrate has a tensile strain of 25% to 100%.
    Type: Application
    Filed: June 21, 2022
    Publication date: April 27, 2023
    Inventors: Dong Gu Kim, Jang Hyeon Lee, Dae Sung Kwon, Hyun Soo Kim, Il Seon Yoo, Tae Ho Jeong, Woo Young Lee, Hyun Sook Lee, Se Young Park, Soo Min Lee, Jin Kyo Jeong, Hae Won Yoon