Patents by Inventor Hae Yong Eom

Hae Yong Eom has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin application apparatus, optical property correction apparatus and method, and method for manufacturing LED package
    Patent number: 9373553
    Abstract: A resin application apparatus includes: an optical property measurement unit measuring an optical property of light emitted from a light emitting diode (LED) chip which is mounted on a package body and to which transparent resin is not applied; and a resin application unit applying light conversion material-containing transparent resin to the LED chip in accordance with a resin application amount which is decided depending on the optical property measured by the optical measurement unit.
    Type: Grant
    Filed: December 31, 2013
    Date of Patent: June 21, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang Bok Yoon, Hae Yong Eom, Mi Hwa You, Seung Min Hong, Sang Hoon Lee, Yong Gu Kim
  • RESIN APPLICATION APPARATUS, OPTICAL PROPERTY CORRECTION APPARATUS AND METHOD, AND METHOD FOR MANUFACTURING LED PACKAGE
    Publication number: 20140212995
    Abstract: A resin application apparatus includes: an optical property measurement unit measuring an optical property of light emitted from a light emitting diode (LED) chip which is mounted on a package body and to which transparent resin is not applied; and a resin application unit applying light conversion material-containing transparent resin to the LED chip in accordance with a resin application amount which is decided depending on the optical property measured by the optical measurement unit.
    Type: Application
    Filed: December 31, 2013
    Publication date: July 31, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang Bok YOON, Hae Yong EOM, Mi Hwa YOU, Seung Min HONG, Sang Hoon LEE, Yong Gu KIM
  • Resin application apparatus, optical property correction apparatus and method, and method for manufacturing LED package
    Patent number: 8679865
    Abstract: A resin application apparatus includes: an optical property measurement unit measuring an optical property of light emitted from a light emitting diode (LED) chip which is mounted on a package body and to which transparent resin is not applied; and a resin application unit applying light conversion material-containing transparent resin to the LED chip in accordance with a resin application amount which is decided depending on the optical property measured by the optical measurement unit.
    Type: Grant
    Filed: August 26, 2010
    Date of Patent: March 25, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sang Bok Yoon, Hae Yong Eom, Mi Hwa You, Seung Min Hong, Sang Hoon Lee, Yong Gu Kim
  • APPARATUS FOR MEASURING OPTICAL PROPERTIES OF LED PACKAGE
    Publication number: 20120105836
    Abstract: An apparatus for measuring the optical properties of an LED package includes: a light detection unit detecting light output from a plurality of LED packages of an LED package array in order to measure the optical properties of each of the LED packages; a mounting unit fixing the LED package array thereon when the optical properties thereof are measured; and a voltage application unit applying a driving voltage to the individual LED packages in the LED package array when the optical properties of the LED packages are measured.
    Type: Application
    Filed: November 1, 2011
    Publication date: May 3, 2012
    Applicant: SAMSUNG LED CO., LTD.
    Inventors: Sang Bok YOON, Hae Yong EOM, Choong Hwan KWON
  • RESIN APPLICATION APPARATUS, OPTICAL PROPERTY CORRECTION APPARATUS AND METHOD, AND METHOD FOR MANUFACTURING LED PACKAGE
    Publication number: 20110053295
    Abstract: A resin application apparatus includes: an optical property measurement unit measuring an optical property of light emitted from a light emitting diode (LED) chip which is mounted on a package body and to which transparent resin is not applied; and a resin application unit applying light conversion material-containing transparent resin to the LED chip in accordance with a resin application amount which is decided depending on the optical property measured by the optical measurement unit.
    Type: Application
    Filed: August 26, 2010
    Publication date: March 3, 2011
    Inventors: Sang Bok YOON, Hae Yong Eom, Mi Hwa You, Seung Min Hong, Sang Hoon Lee, Yong Gu Kim