Abstract: Provided are an imaging encoding method and device. When carrying out image encoding for a block within a slice, at least one block in a restored block of the slice is set as a reference block. When this is done, the encoding parameters of the reference block are distinguished, and the block to be encoded is encoded adaptively based on the encoding parameter.

Abstract: Provided are an imaging encoding method and device. When carrying out image encoding for a block within a slice, at least one block in a restored block of the slice is set as a reference block. When this is done, the encoding parameters of the reference block are distinguished, and the block to be encoded is encoded adaptively based on the encoding parameter.

Abstract: This application relates to an optical sensor element. In one aspect, the optical sensor element includes a graphite column including one or more graphite rods. The optical sensor element may also include one or more first graphene layers partly or entirely covering each of both ends of the graphite column. The optical sensor element may further include one or more second graphene layers partly or entirely covering the outer circumferential surface of the graphite column. This application also relates to an optical sensor for measuring the concentration of a greenhouse gas and the optical sensor includes the optical sensor element.

Abstract: An image encoding/decoding method is disclosed. An image decoding method of the present invention may comprise identifying a region by partitioning an image, and determining a prediction mode of the region on the basis of at least one of a size of the region, a partition shape, and a coding parameter of the region. The determined prediction mode of the region may be determined as a prediction mode of all coding blocks included in the region.

Abstract: A multi-channel optical sub-assembly includes a printed circuit board with a signal processor mounted thereon, a package window mounted on the printed circuit board, the package window including a transparent material, a package mounted on the package window, and an optical device accommodated into an inner space of the package and configured to convert an electrical signal, input from the signal processor, into an optical signal, wherein the electrical signal sequentially passes through a window through electrode buried in the package window and a package through electrode buried in the package and is input to the optical device.

Abstract: The present invention relates to a method of manufacturing a separable semiconductor substrate, and a thin film device and composite device manufactured by the same, and the method of manufacturing a separable semiconductor substrate according to an embodiment of the present invention includes providing a substrate and forming a buffer layer including carbon and aluminum nitride.

Abstract: The present invention provides a surface acoustic wave filter with a mass addition film formed on a plurality of electrodes. The surface acoustic wave filter includes a substrate on which a support substrate, an energy confinement layer, and a piezoelectric layer are sequentially stacked; first and second bus bars extended in a first direction on the substrate and spaced apart from each other in a second direction perpendicular to the first direction; a plurality of IDT electrodes alternately extended from the first and second bus bars in the second direction and spaced apart from each other in the first direction; and a mass addition film extended in the first direction to cover the top surface of the plurality of IDT electrodes and the top surface of the substrate exposed between the plurality of IDT electrodes.

Abstract: Provided are an image encoding method and device. When carrying out image encoding for a block within a slice, at least one block in a restored block of the slice is set as a reference block. When this is done, the encoding parameters of the reference block are distinguished, and the block to be encoded is encoded adaptively based on the encoding parameters.

Abstract: Provided are an image encoding method and device. When carrying out image encoding for a block within a slice, at least one block in a restored block of the slice is set as a reference block. When this is done, the encoding parameters of the reference block are distinguished, and the block to be encoded is encoded adaptively based on the encoding parameters.

Abstract: The present invention provides a manifold refrigerant module comprising: a manifold plate having a plurality of refrigerant flow paths formed therein; and a plurality of heat exchangers arranged on the manifold plate, wherein the plurality of heat exchangers are arranged in the left-right direction or the up-down direction.

Abstract: The present invention relates to a Ga2O3 crystal film deposition method according to HVPE, a deposition apparatus, and a Ga2O3 crystal film-deposited substrate using the same. According to an embodiment of the present invention, a Ga2O3 crystal film deposition method, which includes a first step of supplying GaCl gas onto a single-crystal semiconductor substrate via a central supply channel and a second step of supplying oxygen and HCl gas onto the single-crystal semiconductor substrate onto which the GaCl gas is supplied, is provided.

Abstract: The automatic control system of the smart bus platform includes a plurality of electronic devices provided in the shelter and a control unit. The control unit controls at least one of the plurality of electronic devices based on at least one of the number of users and a prospective staying time of the users in the shelter.

Abstract: A method for growing a nitride film in accordance with an exemplary embodiment includes charging a substrate into a growth space, and growing a nitride film on the substrate, wherein the growing of a nitride film may include reacting a first reaction gas with a source raw material to supply a generated gas to the growth space, supplying a second reaction gas to the growth space, and supplying an oxygen-containing gas and a hydrogen-containing gas to the growth space. Accordingly, according to exemplary embodiments, even when a nitride film is formed thin, it is possible to planarize the upper surface of the nitride film. Accordingly, it is possible to reduce process time required to grow or form the nitride film until the upper surface thereof is planarized, and thus, there is an effect of improving the production rate.

Abstract: The automatic control system of the smart bus platform includes a plurality of electronic devices provided in the shelter and a control unit. The control unit controls at least one of the plurality of electronic devices based on at least one of the number of users and a prospective staying time of the users in the shelter.

Abstract: Provided is a method for manufacturing a monocrystalline substrate, the method including: a process of forming a seed layer on a base charged into a monocrystalline growth apparatus; a process of taking the base, on which the seed layer is formed, out of the monocrystalline growth apparatus and irradiating laser onto the seed layer from a lower side of the base to form a separation layer having a plurality of voids; a process of charging the base, on which the separation layer is formed, into the monocrystalline growth apparatus to form a monocrystalline layer on the separation layer; and a separation process of taking the base, on which the separation layer and the monocrystalline layer are formed, out of the monocrystalline growth apparatus to separate the monocrystalline layer from the base.

Abstract: The present invention is directed to a method of manufacturing a substrate, which includes loading a base substrate into a reaction furnace; forming a buffer layer on the base substrate; forming a separation layer on the buffer layer; forming a semiconductor layer on the separation layer at least two; and separating the semiconductor layer from the base substrate via the separation layer through natural cooling by unloading the base substrate from the reaction furnace.

Abstract: Provided is a semiconductor substrate and a method for manufacturing the same. The semiconductor substrate includes a substrate, a discontinuously formed hemispheric metal layer on the substrate, and a semiconductor layer on the hemispheric metal layer. A plurality of voids on the interface of the substrate and discontinuous hemisphere are formed to absorb or relax the stain of interface. Accordingly, even if a subsequent layer is relatively thickly formed on the substrate, substrate bow or warpage can be minimized.

Abstract: Provided are a semiconductor substrate including an uneven structure disposed on a surface of a substrate, a buffer layer disposed on the uneven structure, the buffer layer having an acicular structure, a compound semiconductor layer disposed on the buffer layer to planarize the uneven structure, and a plurality of voids defined between the substrate and the compound semiconductor layer, and a method for manufacturing the same. Thus, since the acicular structure disposed on the uneven structure of the substrate forms the voids on an interface between the substrate and the single crystal GaN layer to relax a stress due to a lattice mismatch and intercept propagation of a breakdown potential, a warpage characteristic of the grown single crystal GaN layer may be reduced, as well as, crystallinity may be improved.

Abstract: Provided is a semiconductor substrate and a method for manufacturing the same. The semiconductor substrate includes a substrate, a discontinuously formed hemispheric metal layer on the substrate, and a semiconductor layer on the hemispheric metal layer. A plurality of voids on the interface of the substrate and discontinuous hemisphere are formed to absorb or relax the stain of interface. Accordingly, even if a subsequent layer is relatively thickly formed on the substrate, substrate bow or warpage can be minimized.

Abstract: A dental implant package includes a main body having a partition portion that is formed therein and separates a fixture accommodation space accommodating a fixture of a dental implant from an auxiliary accommodation space accommodating any of a healing abutment and a cover screw, wherein a first opening and a second opening are formed at both ends of the main body, a leveler accommodated in at least a part of the fixture accommodation space and supporting the fixture accommodated in the fixture accommodation space at a predetermined height, a first cover detachably coupled to the main body and blocking the first opening, and a second cover detachably coupled to the main body and blocking the second opening. The fixture and any of the healing abutment and the cover screw can be stored with a simple structure. Also, the fixture and the healing abutment or the cover screw can be easily pulled out during an implant operation.