Abstract: Disclosed are a method and device for uplink transmission and reception in a wireless communication system. A method for a terminal to perform uplink transmission in a wireless communication system according to an embodiment of the present disclosure may comprise the steps of: receiving at least one timing advance (TA) parameter from a base station; calculating the TA on the basis of at least one valid TA parameter; and performing uplink transmission on the basis of the TA, wherein the at least one TA parameter includes at least one common TA parameter, a second common TA parameter of a second order is valid on the basis that the first common TA parameter of a first order is valid, and the first order is lower than the second order.

Abstract: Various embodiments of the present invention relate to a method for managing a memory in a Java execution environment, and an electronic device for performing same, and an electronic device may comprise a processor and a memory electrically connected to the processor, wherein: the memory is configured to store multiple Java application programs, and stores instructions that, when executed, cause the processor to execute a virtual machine configured to execute at least one Java application stored in the memory; and when generation of an object is detected during execution of the Java application, the virtual machine executed by the processor generates a reference for the generated object, identifies an application, which has generated the object by a threshold or more, on the basis of the generated reference, and provides information on the identified application to the processor. Other embodiments may also be possible.

Abstract: A method of manufacturing an insole may include providing an electronic element on a support layer; connecting a connector to the support layer; providing the support layer to a lower mold frame; covering the lower mold frame with an upper mold frame; and applying a foam material between the lower mold frame and the upper mold frame.

Abstract: An insole including a base; an electronic element provided to the base; a connection line configured to extend from the electronic element and to pass through the base; and a cover provided on a top surface of the base to cover the electronic element and configured to be separable from the base.

Abstract: An insole may include an insole body in a shape receivable in a shoe; an electronic element provided in the insole body; a connection line configured to electrically connect to the electronic element and including a contact terminal exposed to the outside of the insole body; and a connector including a detachable member configured to at least partially protrude outward from the insole body and configured to support the contact terminal.

Abstract: An insole may include an insole body in a shape receivable in a shoe; an electronic element provided in the insole body; a connection line configured to electrically connect to the electronic element and including a contact terminal exposed to the outside of the insole body; and a connector including a detachable member configured to at least partially protrude outward from the insole body and configured to support the contact terminal.

Abstract: An insole may include an insole body in a shape receivable in a shoe; an electronic element provided in the insole body; a connection line configured to electrically connect to the electronic element and including a contact terminal exposed to the outside of the insole body; and a connector including a detachable member configured to at least partially protrude outward from the insole body and configured to support the contact terminal.

Abstract: A method of manufacturing an insole may include providing an electronic element on a support layer; connecting a connector to the support layer; providing the support layer to a lower mold frame; covering the lower mold frame with an upper mold frame; and applying a foam material between the lower mold frame and the upper mold frame.