Patents by Inventor Hagay Spector

Hagay Spector has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230401130
    Abstract: One embodiment provides an apparatus comprising a circuit board; an active interposer coupled with the circuit board via a debug package, and a graphics processor die coupled with the active interposer via the debug package. The graphics processor die includes graphics processor resources configured to execute instructions for a multi-die system on chip (SoC) device and excludes functionality that is implemented in a separate due of the multi-die SoC. The apparatus includes a field-programmable gate array (FPGA) including hardware logic that is configurable to emulate functionality provided by the separate die of the multi-die SoC device, which enables silicon validation of the graphics processor die separately from other dies of the multi-die SoC.
    Type: Application
    Filed: June 14, 2022
    Publication date: December 14, 2023
    Applicant: Intel Corporation
    Inventors: Rakesh Mehta, Hanmanthrao Patli, Ivan Herrera Mejia, Raj Chandar Rasappan, Hagay Spector, Renu Patle, Fylur Rahman Sathakathulla, Ruchira Liyanage, Raju Kasturi, Fred Steinberg, Ananth Gopalakrishnan, Satish Venkatesan, Pradyumna Reddy Patnam, Suresh Pothukuchi, Tapan Ganpule, Atthar H. Mohammed, Altug Koker
  • Publication number: 20230401132
    Abstract: Described herein is a generic hardware/software communication (HSC) channel that facilitates the re-use of pre-silicon DPI methods to enable FPGA-based post-silicon validation. The HSC channel translates a DPI interface into a hardware FIFO based mechanism. This translation allows the reuse of the methods without having to re-implement the entire flow in pure hardware. The core logic for the transactor remains the same, while only a small layer of the transactor is converted into the FIFO based mechanism.
    Type: Application
    Filed: June 14, 2022
    Publication date: December 14, 2023
    Applicant: Intel Corporation
    Inventors: Renu Patle, Hanmanthrao Patli, Rakesh Mehta, Hagay Spector, Ivan Herrera Mejia, Fylur Rahman Sathakathulla, Gowtham Raj Karnam, Mohsin Ali, Sahar Sharabi, Abraham Halevi Fraenkel, Eyal Pniel, Ehud Cohn, Raghav Ramesh Lakshmi, Altug Koker