Abstract: A filament includes a plurality of strings including radiation-emitting semiconductor chips electrically connected in series; and a plurality of contact structures to contact the strings, wherein the contact structures electrically connect to semiconductor chips at ends of the strings such that the strings are electrically drivable via the contact structures, and the filament is configured such that the strings are electrically drivable at least separately from one another via the contact structures.

Abstract: A filament includes a plurality of strings including radiation-emitting semiconductor chips electrically connected in series; and a plurality of contact structures to contact the strings, wherein the contact structures electrically connect to semiconductor chips at ends of the strings such that the strings are electrically drivable via the contact structures, and the filament is configured such that the strings are electrically drivable at least separately from one another via the contact structures.

Abstract: A light emitting diode (LED) lightning module is disclosed. The LED lighting module includes a heat sink, a circuit board, a carrier, semiconductor chips such as LEDs arranged on an upper surface of the carrier, and at least one holding device pressing a lower surface of the substrate against an upper surface of the heat sink. The semiconductor chips are electrically connected to the carrier. The carrier is electrically connected to the circuit board.

Abstract: In at least one embodiment of the optoelectronic lighting module the lighting module has a cooling body, a printed circuit board, and a substrate. One or more optoelectronic semiconductor chips is/are arranged on a substrate upper face. The semiconductor chips are electrically connected to the substrate. At least one retaining device lies directly or indirectly on the substrate upper face and presses a substrate lower face against a cooling body upper face. The substrate is electrically connected to the printed circuit board. The retaining device is electrically insulated from the at least one semiconductor chip.

Abstract: A luminescence diode chip includes a semiconductor layer sequence having an active layer suitable for generating electromagnetic radiation, and a first electrical connection layer, which touches and makes electrically conductive contact with the semiconductor layer sequence. The first electrical connection layer touches and makes contact with the semiconductor layer sequence in particular with a plurality of contact areas. In the case of the luminescence diode chip, an inhomogeneous current density distribution or current distribution is set in a targeted manner in the semiconductor layer sequence by means of an inhomogeneous distribution of an area density of the contact areas along a main plane of extent of the semiconductor layer sequence.

Abstract: A luminescence diode chip includes a semiconductor layer sequence having an active layer suitable for generating electromagnetic radiation, and a first electrical connection layer, which touches and makes electrically conductive contact with the semiconductor layer sequence. The first electrical connection layer touches and makes contact with the semiconductor layer sequence in particular with a plurality of contact areas. In the case of the luminescence diode chip, an inhomogeneous current density distribution or current distribution is set in a targeted manner in the semiconductor layer sequence by means of an inhomogeneous distribution of an area density of the contact areas along a main plane of extent of the semiconductor layer sequence.