Patents by Inventor Hagime Serizawa

Hagime Serizawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5254609
    Abstract: A composition comprising (A) 97 to 20 parts by weight of a polyarylene sulfide resin and (B) 3 to 80 parts by weight of a polyamide resin with (C) 0.1 to 15 parts by weight of a compound having a carbon-carbon double bond and an epoxy group in its molecule and, if necessary, (D) a radical initiator and/or (E) a filler.
    Type: Grant
    Filed: December 19, 1991
    Date of Patent: October 19, 1993
    Assignee: Polyplastics Co., Ltd.
    Inventors: Hagime Serizawa, Hiroyuki Sano, Masaru Kubota
  • Patent number: 5242959
    Abstract: A polyarylene sulfide resin composition having improved adhesion comprises (A) 100 parts by weight of a polyarylene sulfide resin, (B) 0.1 to 15 parts by weight of a compound having a carbon-carbon double bond and an epoxy group in its molecule and, if necessary, (C) a radical initiator and (D) a filler.
    Type: Grant
    Filed: December 17, 1991
    Date of Patent: September 7, 1993
    Assignee: Polyplastics Co., Ltd.
    Inventors: Hagime Serizawa, Masaru Kubota
  • Patent number: 5227427
    Abstract: A polyarylene sulfide resin composition which yields a molded article having excellent surface appearance and excellent toughness and impact resistance comprises a blend of a polyarylene sulfide resin and a polyolefin resin with a compound having a carbon-carbon double bond and an epoxy group in its molecule. Optionally a radical initiator and a filler can be added to the composition.
    Type: Grant
    Filed: April 29, 1992
    Date of Patent: July 13, 1993
    Assignee: Polyplastics Co., Ltd.
    Inventors: Hagime Serizawa, Masaru Kubota, Hiroyuki Sano