Abstract: An optoelectronic device package includes an optoelectronic device having an active region on a first surface of a substrate, a bond pad area on the first surface that includes at least one contact pad electrically connected to the active region, and a cap having a first cap surface and a second cap surface, the first cap surface being secured to the first surface of the substrate, the cap covering the optoelectronic device. At least one of the cap and the substrate has an angled sidewall extending at an angle relative to an axis parallel to an optical path. The at least one contact pad is exposed by and adjacent to the angled sidewall. An electrical line extends from each of the at least one contact pad along the angled sidewall and to the second cap surface that does not overlap the active region.

Abstract: A method of singulating includes scribing a first scribe line on a first side of a substrate, scribing a second scribe line on a second side of the substrate, the first and second sides facing away from each other, the second scribe line being substantially parallel to the first scribe line, and simultaneously separating the substrate at the first scribe line and the second scribe line.

Abstract: An optoelectronic device package includes an optoelectronic device having an active region on a first surface of a substrate, a bond pad area on the first surface that includes at least one contact pad electrically connected to the active region, and a cap having a first cap surface and a second cap surface, the first cap surface being secured to the first surface of the substrate, the cap covering the optoelectronic device. At least one of the cap and the substrate has an angled sidewall extending at an angle relative to an axis parallel to an optical path. The at least one contact pad is exposed by and adjacent to the angled sidewall. An electrical line extends from each of the at least one contact pad along the angled sidewall and to the second cap surface that does not overlap the active region.

Abstract: A method of singulating includes scribing a first scribe line on a first side of a substrate, scribing a second scribe line on a second side of the substrate, the first and second sides facing away from each other, the second scribe line being substantially parallel to the first scribe line, and simultaneously separating the substrate at the first scribe line and the second scribe line.

Abstract: Optical imaging apparatuses are provided having desired focal properties. An optical imaging apparatus can include at least one wafer level optical element, a spacer, a second wafer comprising a focus compensation standoff, and an electro-optical element. For some apparatuses, the focus compensation standoff may include an electro-optical element mounting surface having a roughness different from at least one other surface of the focus compensation standoff. Also described are methods of producing a plurality of optical imaging apparatuses. Some methods include providing an optical wafer having a first and second optical element, determining a first and second focal point of a first and second optical die; providing a second wafer having a first and second focus compensation standoff; and adjusting the heights of the first and second focus compensation standoffs to position a first and second electro-optical element at or near a first and second focal point, respectively.

Abstract: Optical imaging apparatus are provided having the desired focal properties, which can be manufactured and/or assembled at the wafer level.