Abstract: A display device including a substrate including a display area and a non-display area, pixels provided in the display area, an encapsulation layer on the pixels, a first conductive pattern on the encapsulation layer and including a first metal layer of sensing lines disposed in a non-sensing area corresponding to the non-display area, a first insulating layer on the first conductive pattern, a second conductive pattern on the first insulating layer and including a second metal layer of the sensing lines, and a second insulating layer on the second conductive pattern, in which the first metal layer includes a first end located in the non-sensing area corresponding to a first side of a sensing area and a second end located in the non-sensing area corresponding to a second side adjacent to the first side, and the first end and the second end are spaced apart from each other.

Abstract: A display device including a substrate including a display area and a non-display area, pixels provided in the display area, an encapsulation layer on the pixels, a first conductive pattern on the encapsulation layer and including a first metal layer of sensing lines disposed in a non-sensing area corresponding to the non-display area, a first insulating layer on the first conductive pattern, a second conductive pattern on the first insulating layer and including a second metal layer of the sensing lines, and a second insulating layer on the second conductive pattern, in which the first metal layer includes a first end located in the non-sensing area corresponding to a first side of a sensing area and a second end located in the non-sensing area corresponding to a second side adjacent to the first side, and the first end and the second end are spaced apart from each other.

Abstract: A semiconductor package includes a second semiconductor die stacked on a first semiconductor die. The first semiconductor die includes a first contact pad connected to a first integrated circuit, and includes a second contact pad connected to a third contact pad by a first interconnection line. The second semiconductor die includes a fourth contact pad connected to the third contact pad and connected to a second integrated circuit. A first bonding wire is connected to the first contact pad, and a second bonding wire is connected to the second contact pad.

Abstract: A touch sensor including a base layer including a sensing area and a non-sensing area, first and second sensor patterns disposed in the sensing area and arranged along first and second directions, respectively, first bridge patterns arranged along the first direction, second bridge patterns arranged along the second direction, and sensing lines disposed in the non-sensing area and connected to each of the first and second sensor patterns, in which each of the sensing lines includes a first metal layer and a second metal layer with an insulating layer interposed therebetween, each of the sensing lines has a first portion and a second portion, the second portion corresponding to at least one of the first bridge patterns disposed at a corner portion of the sensing area, and the second portion of at least one of the sensing lines has a single layer structure including only the second metal layer.

Abstract: A touch sensor including a base layer including a sensing area and a non-sensing area, first and second sensor patterns disposed in the sensing area and arranged along first and second directions, respectively, first bridge patterns arranged along the first direction, second bridge patterns arranged along the second direction, and sensing lines disposed in the non-sensing area and connected to each of the first and second sensor patterns, in which each of the sensing lines includes a first metal layer and a second metal layer with an insulating layer interposed therebetween, each of the sensing lines has a first portion and a second portion, the second portion corresponding to at least one of the first bridge patterns disposed at a corner portion of the sensing area, and the second portion of at least one of the sensing lines has a single layer structure including only the second metal layer.

Abstract: A touch sensor including a base layer including a sensing area and a non-sensing area, first and second sensor patterns disposed in the sensing area and arranged along first and second directions, respectively, first bridge patterns arranged along the first direction, second bridge patterns arranged along the second direction, and sensing lines disposed in the non-sensing area and connected to each of the first and second sensor patterns, in which each of the sensing lines includes a first metal layer and a second metal layer with an insulating layer interposed therebetween, each of the sensing lines has a first portion and a second portion, the second portion corresponding to at least one of the first bridge patterns disposed at a corner portion of the sensing area, and the second portion of at least one of the sensing lines has a single layer structure including only the second metal layer.

Abstract: A stack package includes a plurality of sub-packages vertically stacked. Each of the sub-packages includes a bridge die having a plurality of vertical interconnectors and a semiconductor die. A first group of vertical interconnectors disposed in a first bridge die included in a first sub-package of the sub-packages and other vertical interconnectors connected to the first group of vertical interconnectors constitute a first electric path, and a second group of vertical interconnectors disposed in a second bridge die included in a second sub-package of the sub-packages and other vertical interconnectors connected to the second group of vertical interconnectors constitute a second electric path. The first and second electric paths are electrically isolated from each other and disposed to provide two separate electric paths.

Abstract: A touch sensor including a base layer including a sensing area and a non-sensing area, first and second sensor patterns disposed in the sensing area and arranged along first and second directions, respectively, first bridge patterns arranged along the first direction, second bridge patterns arranged along the second direction, and sensing lines disposed in the non-sensing area and connected to each of the first and second sensor patterns, in which each of the sensing lines includes a first metal layer and a second metal layer with an insulating layer interposed therebetween, each of the sensing lines has a first portion and a second portion, the second portion corresponding to at least one of the first bridge patterns disposed at a corner portion of the sensing area, and the second portion of at least one of the sensing lines has a single layer structure including only the second metal layer.

Abstract: The present disclosure relates to a display device. The display device according to an exemplary embodiment includes a display area comprising a plurality of pixels, a peripheral area that is disposed outside the display area, and a wiring portion in the peripheral area. The wiring portion includes a plurality of signal lines that are adjacent to each other and are arranged along a first direction and each extends in a second direction that is different from the first direction. The plurality of signal lines are arranged in an order of average voltages of signals respectively transmitted by the plurality of signal lines during one frame.

Abstract: A stack package includes a plurality of sub-packages vertically stacked. Each of the sub-packages includes a bridge die having a plurality of vertical interconnectors and a semiconductor die. A first group of vertical interconnectors disposed in a first bridge die included in a first sub-package of the sub-packages and other vertical interconnectors connected to the first group of vertical interconnectors constitute a first electric path, and a second group of vertical interconnectors disposed in a second bridge die included in a second sub-package of the sub-packages and other vertical interconnectors connected to the second group of vertical interconnectors constitute a second electric path. The first and second electric paths are electrically isolated from each other and disposed to provide two separate electric paths.

Abstract: A semiconductor package includes a semiconductor chip and a package substrate. The package substrate includes a base layer, a first group of conductive lines disposed on a first surface of the base layer, and a second group of conductive lines disposed on a second surface of the base layer and electrically connected to respective ones of the first group of conductive lines. The package substrate further includes a plating lead line connected to one of the first group of conductive lines, opening holes located between remaining portions of the second group of conductive lines to separate the second group of conductive lines from each other.

Abstract: The present disclosure relates to a display device. The display device according to an exemplary embodiment includes a display area comprising a plurality of pixels, a peripheral area that is disposed outside the display area, and a wiring portion in the peripheral area. The wiring portion includes a plurality of signal lines that are adjacent to each other and are arranged along a first direction and each extends in a second direction that is different from the first direction. The plurality of signal lines are arranged in an order of average voltages of signals respectively transmitted by the plurality of signal lines during one frame.

Abstract: An organic light emitting diode (OLED) display includes a display panel including a flexible substrate and a thin film encapsulation (TFE) for covering and protecting an organic light emitting element formed on the flexible substrate, a first protective film arranged on the TFE to be opposite to the TFE, a second protective film arranged on the flexible substrate to be opposite to the flexible substrate, a first adhesive disposed between the TFE and the first protective film, a second adhesive disposed between the flexible substrate and the second protective film, a third protective film arranged on the second protective film to be opposite to the second protective film, and a third adhesive disposed between the second protective film and the third protective film.