Patents by Inventor HAI-BING JIANG

HAI-BING JIANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150023543
    Abstract: An earphone includes an earphone housing, a soft plastic piece, a speaker positioned in the earphone housing, and an earphone cable connected to the speaker. The earphone housing includes a first housing and a second housing. The soft plastic piece is positioned between the first housing and the second housing, and the soft plastic piece, the first housing and the second housing are fused together.
    Type: Application
    Filed: October 7, 2014
    Publication date: January 22, 2015
    Inventors: YI XIONG, ZHI-HUA LIN, HAI-BING JIANG
  • Patent number: 8887375
    Abstract: An earphone includes an earphone housing, a speaker positioned in the earphone, and an earphone cable connected to the speaker. The earphone housing has a first housing and a second housing. The first housing forms a first connecting surface, and the second housing forms a second connecting surface. The first connecting surface and the second connecting surface abut against each other and are ultrasonically fused together, in which excess plastic is formed and arranged along a fusing line. A method of manufacturing above-described earphone is also provided. The method also includes the forming of an excess plastic arranged along a fusing line formed between the first housing and the second housing made during ultrasonic fusion, the removing of excess plastic of the earphone phone by a cutter, and the grinding of the earphone housing by a grinding device.
    Type: Grant
    Filed: April 20, 2012
    Date of Patent: November 18, 2014
    Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Yi Xiong, Zhi-Hua Lin, Hai-Bing Jiang
  • Publication number: 20130034259
    Abstract: An earphone includes an earphone housing, a speaker positioned in the earphone, and an earphone cable connected to the speaker. The earphone housing has a first housing and a second housing. The first housing forms a first connecting surface, and the second housing forms a second connecting surface. The first connecting surface and the second connecting surface abut against each other and are ultrasonically fused together, in which excess plastic is formed and arranged along a fusing line. A method of manufacturing above-described earphone is also provided. The method also includes the forming of an excess plastic arranged along a fusing line formed between the first housing and the second housing made during ultrasonic fusion, the removing of excess plastic of the earphone phone by a cutter, and the grinding of the earphone housing by a grinding device.
    Type: Application
    Filed: April 20, 2012
    Publication date: February 7, 2013
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., FU TAI HUA INDUSTRY (SHENZHEN) CO., LTD.
    Inventors: YI XIONG, ZHI-HUA LIN, HAI-BING JIANG