Abstract: A technique includes displaying, by a computer using a graphical interface, a map of a geographical area, where the map includes political boundaries. The technique includes displaying, by the computer, graphical images on the map representing a plurality of aspects that are associated with the management of a plurality of projects as corresponding geographical features on the map. The technique includes graphically segregating, by the computer, the plurality of projects on the map using the political boundaries; receiving input, via interaction with the displayed map; and changing, by the computer, in response to the interaction, how a given aspect of the plurality of aspects of a given project of the plurality of projects is represented on the map.

Abstract: A resource processing method and apparatus. The method is achieved by a computer configured to execute the following steps: generating a resource allocation chart based on a resource allocation request; processing the resource allocation chart and generating an access entrance of the resource allocation chart; opening the access entrance to enable at least one third party resource supplier to respond to the resource allocation request via the access entrance. The method further comprises: when the resources are not available or not suitable for allocation, receiving a resource allocation chart, wherein the resource allocation chart is based on the resource allocation request; generating an access entrance of the resource allocation chart; opening the access entrance to at least one third party resource supplier; and receiving the allocated resources from the at least one third party resource supplier by responding to the resource allocation request through the access entrance.

Abstract: A playback device is provided. The playback device includes a processor; an audio interface connected to the processor and configured to output audio; a communication interface connected to the processor and configured to communicate over a network; a memory operably connected to the processor; and instructions stored in the memory. The instructions are executable by the processor such that the playback device can receive an audio stream via a first wireless network; play back, via the audio interface, audio content based on the audio stream; while receiving the audio stream via the first wireless network, transmit an indication of availability of the audio stream; detect a request, from another playback device, to play back the audio stream; establish a second wireless network; detect that the other playback device has joined the second wireless network; and transmit the audio stream to the other playback device via the second wireless network.

Abstract: Methods of fabricating a multi-layer semiconductor structure are provided. In one embodiment, a method includes depositing a first dielectric layer over a semiconductor structure, depositing a first metal layer over the first dielectric layer, patterning the first metal layer to form a plurality of first metal lines, and depositing a second dielectric layer over the first metal lines and the first dielectric layer. The method also includes removing a portion of the second dielectric layer over selected first metal lines to expose a respective top surface of each of the selected first metal lines. The method further includes reducing a thickness of the selected first metal lines to be less than a thickness of the unselected first metal lines. A multi-layer semiconductor structure is also provided.

Abstract: Methods of fabricating a multi-layer semiconductor structure are provided. In one embodiment, a method includes depositing a first dielectric layer over a semiconductor structure, depositing a first metal layer over the first dielectric layer, patterning the first metal layer to form a plurality of first metal lines, and depositing a second dielectric layer over the first metal lines and the first dielectric layer. The method also includes removing a portion of the second dielectric layer over selected first metal lines to expose a respective top surface of each of the selected first metal lines. The method further includes reducing a thickness of the selected first metal lines to be less than a thickness of the unselected first metal lines. A multi-layer semiconductor structure is also provided.

Abstract: Methods of fabricating a multi-layer semiconductor structure are provided. In one embodiment, a method includes depositing a first dielectric layer over a semiconductor structure, depositing a first metal layer over the first dielectric layer, patterning the first metal layer to form a plurality of first metal lines, and depositing a second dielectric layer over the first metal lines and the first dielectric layer. The method also includes removing a portion of the second dielectric layer over selected first metal lines to expose a respective top surface of each of the selected first metal lines. The method further includes reducing a thickness of the selected first metal lines to be less than a thickness of the unselected first metal lines. A multi-layer semiconductor structure is also provided.

Abstract: A method is described for launching a vehicular camera application residing on a docked mobile communication device, such as a smartphone, tablet computer, or mp3 player, for example. A common feature for the many choices of a mobile communication device is that the mobile communication device comprises embedded data processing capability. The launching operation of the vehicular camera application includes detecting a communicative coupling of the mobile communication device with a docking device; and thereafter initiating the vehicular camera application that resides on the mobile communication device. Images are displayed on the mobile communication device that was captured by a vehicular camera or a camera integrated with the mobile communication device or communicatively coupled to the mobile communication device.

Abstract: A method for recording a geographical location from a docked mobile communication device that includes detecting a mobile communication device communicatively coupled to a docking device; and detecting that the mobile communication device is communicatively uncoupled from the docking device. Afterwards, the geographical location of the mobile communication device is recorded and stored in memory upon detecting that the mobile communication device has communicatively uncoupled from the docking device.

Abstract: A technique for multicast switching in a distributed communication system having a plurality of cooperating modules enables a module to forward multicast packets associated with a multicast stream without using a centralized module or control logic by determining all network interfaces and remote modules associated with the multicast stream and forwarding multicast packets to only those network interfaces and remote modules associated with the multicast stream. IGMP snooping may be used to determine the network interfaces and remote modules associated with the multicast stream, and may also be used to determine host addresses, router addresses, and an IGMP version for each network interface and for each remote module. In order to generate IGMP messages, the module learns a multicast device address from received IGMP messages and uses the multicast device address to send the IGMP messages.

Abstract: Methods of fabricating a multi-layer semiconductor structure are provided. In one embodiment, a method includes depositing a first dielectric layer over a semiconductor structure, depositing a first metal layer over the first dielectric layer, patterning the first metal layer to form a plurality of first metal lines, and depositing a second dielectric layer over the first metal lines and the first dielectric layer. The method also includes removing a portion of the second dielectric layer over selected first metal lines to expose a respective top surface of each of the selected first metal lines. The method further includes reducing a thickness of the selected first metal lines to be less than a thickness of the unselected first metal lines. A multi-layer semiconductor structure is also provided.

Abstract: Connection between optical fibers and optical components within a semiconductor substrate. A lens is created at the front of a semiconductor substrate. A tapered hole is created in the back of the substrate exposing part or all of the surface of the lens. An optical component is formed or affixed at the front surface of the substrate. A volume of transparent adhesive is placed in the hole, followed by an optical fiber, which is thus coupled to the surface of the lens. A light guide is created on the front of the substrate overlying the lens to direct optical signals between the optical fiber inserted in the tapered hole and the optical component on the surface of the substrate.

Abstract: A wire-bonding substrate includes a curvilinear wire-bond pad. The curvilinear wire-bond pad is used in reverse wire bonding to couple a die with the substrate. A curvilinear wire-bond pad is also disclosed that is located directly above the via in the substrate. A wire-bonding substrate includes a first wire-bond pad and a first via that is disposed directly below the first wire-bond pad in the wire-bonding substrate. A package is includes a chip stack with a total die-side characteristic dimension, and a total substrate-side characteristic dimension that is smaller than the total die-side characteristic dimension. A computing system includes the curvilinear wire-bond pad.

Abstract: A wire-bonding substrate includes a curvilinear wire-bond pad. The curvilinear wire-bond pad is used in reverse wire bonding to couple a die with the substrate. A curvilinear wire-bond pad is also disclosed that is located directly above the via in the substrate. A wire-bonding substrate includes a first wire-bond pad and a first via that is disposed directly below the first wire-bond pad in the wire-bonding substrate. A package is includes a chip stack with a total die-side characteristic dimension, and a total substrate-side characteristic dimension that is smaller than the total die-side characteristic dimension. A computing system includes the curvilinear wire-bond pad.

Abstract: An address reporting technique for reporting address information in a distributed communication environment retrieves locally owned address information from each of a number of distributed address databases, sorts the address information according to a predetermined sorting scheme, and reports the sorted address information. Each address database is maintained by one of a plurality of interconnected modules. A reporting module reports address information by retrieving locally owned address information from its address database, retrieves locally owned address information from each of the other interconnected modules, sorts the address information according to a predetermined sorting scheme, and reports the sorted address information.

Abstract: A technique for multicast switching in a distributed communication system having a plurality of cooperating modules enables a module to forward multicast packets associated with a multicast stream without using a centralized module or control logic by determining all network interfaces and remote modules associated with the multicast stream and forwarding multicast packets to only those network interfaces and remote modules associated with the multicast stream. IGMP snooping may be used to determine the network interfaces and remote modules associated with the multicast stream, and may also be used to determine host addresses, router addresses, and an IGMP version for each network interface and for each remote module. In order to generate IGMP messages, the module learns a multicast device address from received IGMP messages and uses the multicast device address to send the IGMP messages.

Abstract: Connection between optical fibers and optical components within a semiconductor substrate. A lens is created at the front of a semiconductor substrate. A tapered hole is created in the back of the substrate exposing part or all of the surface of the lens. An optical component is formed or affixed at the front surface of the substrate. A volume of transparent adhesive is placed in the hole, followed by an optical fiber, which is thus coupled to the surface of the lens. A light guide is created on the front of the substrate overlying the lens to direct optical signals between the optical fiber inserted in the tapered hole and the optical component on the surface of the substrate.

Abstract: A wire-bonding substrate includes a curvilinear wire-bond pad. The curvilinear wire-bond pad is used in reverse wire bonding to couple a die with the substrate. A curvilinear wire-bond pad is also disclosed that is located directly above the via in the substrate. A wire-bonding substrate includes a first wire-bond pad and a first via that is disposed directly below the first wire-bond pad in the wire-bonding substrate. A package is includes a chip stack with a total die-side characteristic dimension, and a total substrate-side characteristic dimension that is smaller than the total die-side characteristic dimension. A computing system includes the curvilinear wire-bond pad.

Abstract: A decentralized management model enables a plurality of interconnected modules to be managed and controlled as an integrated unit without requiring any one of the interconnected modules to operate as a fully centralized manager. One of the interconnected modules is configured to operate as a base module, which coordinates certain network management operations among the interconnected modules. Each of the interconnected modules is capable of sending and receiving management and control information. Each of the interconnected modules maintains a segmented management database containing network management parameters that are specific to the particular module, and also maintains a shadowed management database containing network management parameters that are common to all of the interconnected modules in the stack.

Abstract: A microlens of an inorganic material having a relatively high index of refraction is formed with a convex lower surface for refracting light from above through an underlying spacer layer to converge on a photodiode therebelow. The microlens and photodiode may be replicated in an array of such elements along with color filters and CMOS circuit elements on a semiconductor chip to provide an image sensor. The spacer layer, which has a relatively low refractive index, is subjected to a selective isotropic etch through an opening in an etch mask to define a concave surface that forms an interface with the convex lower surface of the microlens upon subsequent conformal deposition of the material of the microlens.

Abstract: A distributed address database management technique involves maintaining an address database by each of a number of interconnected modules. Each module maintains a number of locally owned address entries and a number of remotely owned address entries in the address database. Each module monitors the status of its locally owned address entries, maintains the locally owned address entries based upon the status, and provides the status to the other interconnected modules. Each module maintains the remotely owned address entries based upon the status received from the other interconnected modules. When a module adds a locally owned address entry to its address database, the module notifies the other interconnected modules, which in turn add a corresponding remotely owned address entry to their respective address databases.