Abstract: An apparatus for disassembling an electronic component from a circuit board includes a base, a controller, a positioning assembly, and a heating and suction assembly. The controller is fixed to the base. The positioning assembly is arranged on the base and coupled to the controller. The positioning assembly is configured to be controlled by the controller to position the circuit board at a first predetermined position. The heating and suction assembly is movably arranged on the base and coupled to the controller. The heating and suction assembly is moved to a second predetermined position to heat the electronic component and moved to a third predetermined position to attract and hold the heated electronic component by suction, whereby the electronic component is disassembled from the circuit board.

Abstract: An apparatus for disassembling an electronic component from a circuit board includes a base, a controller, a positioning assembly, and a heating and suction assembly. The controller is fixed to the base. The positioning assembly is arranged on the base and coupled to the controller. The positioning assembly is configured to be controlled by the controller to position the circuit board at a first predetermined position. The heating and suction assembly is movably arranged on the base and coupled to the controller. The heating and suction assembly is moved to a second predetermined position to heat the electronic component and moved to a third predetermined position to attract and hold the heated electronic component by suction, whereby the electronic component is disassembled from the circuit board.

Abstract: A detaching apparatus includes a bench, a first supporting member attached to the bench, a convey system, a positioning member, a second supporting member, and a detaching member. The convey system is attached to the first supporting member for conveying a circuit board. The positioning member is attached to the first supporting member for positioning the circuit board. The second supporting member is attached to the bench and aligning with the first supporting member. The detaching member is attached to the second supporting member and includes a sliding bracket moving vertically relative to the bench, a moving block moving horizontally in the sliding bracket, a blade attached to the moving block, and a vacuum suction cup attached to the moving block and aligning with the blade.

Abstract: An apparatus for disassembling an electronic component from a circuit board includes a base, a controller, a positioning assembly, and a heating and suction assembly. The controller is fixed to the base. The positioning assembly is arranged on the base and coupled to the controller. The positioning assembly is configured to be controlled by the controller to position the circuit board at a first predetermined position. The heating and suction assembly is movably arranged on the base and coupled to the controller. The heating and suction assembly is moved to a second predetermined position to heat the electronic component and moved to a third predetermined position to attract and hold the heated electronic component by suction, whereby the electronic component is disassembled from the circuit board.

Abstract: An apparatus for removing cables is provided. The apparatus includes a worktable. An upper surface of the worktable is used to fix at least one motherboard separately. Each motherboard includes a cable fixed thereon. The apparatus includes a feeding assembly, a driving assembly and a removing assembly. The driving assembly and the removing assembly are located on the feeding assembly. The feeding assembly is used to drive the driving assembly and the removing assembly to move to a pre-defined position. The driving assembly is used to drive the removing assembly to remove the cable from the motherboard.

Abstract: An apparatus for disassembling an electronic component from a circuit board includes a base, a controller, a positioning assembly, and a heating and suction assembly. The controller is fixed to the base. The positioning assembly is arranged on the base and coupled to the controller. The positioning assembly is configured to be controlled by the controller to position the circuit board at a first predetermined position. The heating and suction assembly is movably arranged on the base and coupled to the controller. The heating and suction assembly is moved to a second predetermined position to heat the electronic component and moved to a third predetermined position to attract and hold the heated electronic component by suction, whereby the electronic component is disassembled from the circuit board.

Abstract: An apparatus for removing cables is provided. The apparatus includes a worktable. An upper surface of the worktable is used to fix at least one motherboard separately. Each motherboard includes a cable fixed thereon. The apparatus includes a feeding assembly, a driving assembly and a removing assembly. The driving assembly and the removing assembly are located on the feeding assembly. The feeding assembly is used to drive the driving assembly and the removing assembly to move to a pre-defined position. The driving assembly is used to drive the removing assembly to remove the cable from the motherboard.

Abstract: A detaching apparatus includes a bench, a first supporting member attached to the bench, a convey system, a positioning member, a second supporting member, and a detaching member. The convey system is attached to the first supporting member for conveying a circuit board. The positioning member is attached to the first supporting member for positioning the circuit board. The second supporting member is attached to the bench and aligning with the first supporting member. The detaching member is attached to the second supporting member and includes a sliding bracket moving vertically relative to the bench, a moving block moving horizontally in the sliding bracket, a blade attached to the moving block, and a vacuum suction cup attached to the moving block and aligning with the blade.

Abstract: A repair apparatus for a circuit board assembly includes a cooling device for a surface of the circuit board assembly opposite to the surface to be repaired. The cooling device defines a chamber for receiving the circuit board assembly. The circuit board assembly is disposed within the chamber to define a heat exchange space between the circuit board assembly and the bottom of the chamber. A method for repairing a circuit board assembly is also provided.

Abstract: A solder paste mixer includes a housing, a vibration mechanism, a rotating mechanism, and a fixture for fixing a solder paste jar. The housing defines a receiving space, and the vibration mechanism and the rotating mechanism are retained within the receiving space. The fixture can be vibrated by the vibration mechanism and rotated by the rotating mechanism.

Abstract: A solder paste mixer includes a housing, a vibration mechanism, a rotating mechanism, and a fixture for fixing a solder paste jar. The housing defines a receiving space, and the vibration mechanism and the rotating mechanism are retained within the receiving space. The fixture can be vibrated by the vibration mechanism and rotated by the rotating mechanism.

Abstract: A repair apparatus for a circuit board assembly includes a cooling device for a surface of the circuit board assembly opposite to the surface to be repaired. The cooling device defines a chamber for receiving the circuit board assembly. The circuit board assembly is disposed within the chamber to define a heat exchange space between the circuit board assembly and the bottom of the chamber. A method for repairing a circuit board assembly is also provided.