Abstract: A method for preparing a semiconductor device includes: providing a semiconductor substrate, in which a trench is formed on the semiconductor substrate, a filling layer is formed in the trench, and a void is formed in the filling layer; removing a portion of the filling layer to expose the void; forming a plug, in which the plug is configured to plug the void and extends into the void by at least a preset distance; and removing a portion of the filling layer and remaining the plug with at least a preset height until the filling layer reaches a preset thickness to form a contact hole.

Abstract: A method for mobility enhancement in wireless communication systems is provided. The method is performed by a User Equipment (UE) configured with a first Small Data Transmission (SDT) configuration by a first cell. The method includes receiving a Radio Resource Control (RRC) release message including a suspend configuration from the first cell; transitioning to an RRC INACTIVE state in response to receiving the RRC release message; receiving, in the RRC INACTIVE state, a System Information Block Type 1 (SIB1) including a second SDT configuration from a second cell; camping on the second cell in response to receiving the SIB1 from the second cell; and while the UE is camping on the second cell, refraining from using the first SDT configuration to initiate an SDT procedure associated with the second cell in a case that the UE does not support performing the SDT procedure associated with the second cell.

Abstract: A light emitting device is disclosed, in which a body is provided with a first joining portion, light-emitting elements located at a side of the body having the first joining portion for emitting light and an optical processing element disposed at a side of the light-emitting elements having a second joining portion corresponding to the first joining portion for processing light emitted from each light-emitting element, such that even light emission is obtained.

Abstract: An optical processing element has a first face and a second face opposite to the first face. A first processing portion is disposed on the first face and a second processing portion is disposed on the second face. The first processing portion and the second processing portion both have continuous arc patterns. The radius of the arc pattern of the first processing portion is not equal to that of the arc pattern of the second procession portion. The optical processing element processes light source in order to produce even light emission, thereby solving the shortcomings of the prior art.

Abstract: A heat-dissipating module is applicable in a light-emitting device for dissipating heat of light-emitting elements in the light-emitting device. The heat-dissipating module has a heat-dissipating base located in the light-emitting device, a printed circuit board disposed on the heat-dissipating base for receiving the plurality of light-emitting elements and power lines through the heat-dissipating base and electrically connected to the printed circuit board, allowing heat-and-electricity separation, thereby improving reliability and solving the shortcomings of the prior art.

Abstract: A light-emitting device is disclosed, in which a body is provided with a first joining portion, light-emitting elements located at a side of the body having the first joining portion for emitting light and an optical processing element disposed at a side of the light-emitting elements having a second joining portion corresponding to the first joining portion for processing light emitted from each light-emitting element, such that even light emission is obtained.

Abstract: A light-emitting device is disclosed, in which a body and a heat-dissipating base disposed at a side of the body are provided. The heat-dissipating base has light-emitting elements located at a side of the body for emitting light, a printed circuit board for receiving the light-emitting elements and power lines through the heat-dissipating base and electrically connected to the printed circuit board, allowing heat-and-electricity separation, thereby improving reliability.