Abstract: Multi-chip packages are provided having a first semiconductor chip arranged on a package substrate. The first semiconductor chip includes a first bonding pad connected to the package substrate. A second semiconductor chip is arranged on the first semiconductor chip. The second semiconductor chip has an overhang that protrudes from a side surface of the first semiconductor chip, and a second bonding pad arranged on the overhang. A third semiconductor chip is arranged on the second semiconductor chip to expose the overhang. The third semiconductor chip has a third bonding pad. A first conductive wire may be connected between the second bonding pad and the third bonding pad. A second conductive wire may be connected between the third bonding pad and the package substrate.