Abstract: A semiconductor device includes a gate electrode, a gate insulating layer, an active layer, a source electrode and a drain electrode. The gate insulating layer is disposed between the gate electrode and the active layer, the source electrode and the drain electrode are arranged on one side of the gate insulating layer, wherein the gate insulating layer includes multilayer oxide films stacked on each other and at least one interface layer between the multilayer oxide films, and the material of the at least one interface layer is different from the material of the oxide films.

Abstract: In some embodiments, the present disclosure relates to an integrated chip. The integrated chip may comprise a first metal line disposed over a substrate. A via may be disposed directly over a top of the first metal line and the via may comprise a first lower surface and a second lower surface above the first lower surface. A first dielectric structure may be disposed laterally adjacent to the first metal line and may be disposed along a sidewall of the first metal line. A first protective etch-stop structure may be disposed directly over a top of the first dielectric structure and the first protective etch-stop structure may vertically separate the second lower surface of the via from the top of the first dielectric structure.

Abstract: A technique for improving wireless communication characteristics involving matching transmitter antenna patterns to receiver antenna patterns. In a specific implementation, the transmitter antenna pattern adapts to changing parameters, such as when a smartphone is initially held in a first orientation and is later held in a second orientation. Because the transmitter antenna pattern matches receiver antenna patterns, signal quality between stations improves. In some implementations, antennas are organized and mounted to maximize spatial diversity to cause peak gains in different directions.

Abstract: Integrated circuit devices and methods of forming the same are provided. A method according to the present disclosure includes providing a workpiece including a semiconductor substrate, a first ILD layer over the semiconductor substrate, and a first metal feature in the first ILD layer; depositing a second metal feature over the workpiece such that the second metal feature is electrically coupled to the first metal feature; patterning the second metal feature to form a first trench adjacent to the first metal feature; depositing a blocking layer over the workpiece, wherein the blocking layer selectively attaches to the first ILD layer; depositing a barrier layer over the workpiece, wherein the barrier layer selectively forms over the second metal feature relative to the first ILD layer; and depositing a second ILD layer over the workpiece.

Abstract: Examples of an integrated circuit with an interconnect structure and a method for forming the integrated circuit are provided herein. In some examples, the method includes receiving a workpiece that includes a substrate and an interconnect structure. The interconnect structure includes a first conductive feature disposed within a first inter-level dielectric layer. A blocking layer is selectively formed on the first conductive feature without forming the blocking layer on the first inter-level dielectric layer. An alignment feature is selectively formed on the first inter-level dielectric layer without forming the alignment feature on the blocking layer. The blocking layer is removed from the first conductive feature, and a second inter-level dielectric layer is formed on the alignment feature and on the first conductive feature. The second inter-level dielectric layer is patterned to define a recess for a second conductive feature, and the second conductive feature is formed within the recess.

Abstract: The present disclosure provides a method for forming an integrated circuit (IC) structure. The method comprises providing a substrate including a conductive feature; forming aluminum (Al)-containing dielectric layer on the conductive feature; forming a low-k dielectric layer on the Al-containing dielectric layer; and etching the low-k dielectric layer to form a contact trench aligned with the conductive feature. A bottom of the contact trench is on a surface of the Al-containing dielectric layer.

Abstract: Provided are compounds having a tetradentate structure of that are useful as emitters in OLED applications.

Abstract: A cover configured to be attached to, and cover a portion of, a handheld electronic device. The cover includes a shell having a first side and a second side and a wireless charging receiver module connectable to the handheld electronic device. When attached to the handheld electronic device the first side of the shell faces the handheld electronic device. The wireless charging receiver module is positioned on the first side of the shell.

Abstract: A charging battery unit includes a receiving unit and a battery. The receiving unit includes a fixing member and a coil fixed on the fixing member. The coil receives external electromagnetic signals to generate induction currents. The battery is electrically connected to the coil and receives the induction currents generated by the coil. The present disclosure also relates an electronic device with the charging battery unit.

Abstract: The present disclose relates to a wireless charging device for charging a portable electronic device. The wireless charging device includes a charging panel, a transmitting unit and a heat dissipation unit. The charging panel includes a first surface and a second surface opposite to the first surface, the first surface supports the portable electronic device, and the portable electronic device includes a top surface away from the charging panel. The transmitting unit includes a coil for generating electromagnetic signals for charging the portable electronic device. The heat dissipation unit includes a base and a pressing portion connected to the base. The base thermally contacts the second surface of the charging panel, and the pressing portion thermally contacts the top surface of the portable electronic device.

Abstract: A cover configured to be attached to, and cover a portion of, a handheld electronic device. The cover includes a shell having a first side and a second side and a wireless charging receiver module connectable to the handheld electronic device. When attached to the handheld electronic device the first side of the shell faces the handheld electronic device. The wireless charging receiver module is positioned on the first side of the shell.

Abstract: The present disclose relates to a wireless charging device for charging a portable electronic device. The wireless charging device includes a charging panel, a transmitting unit and at least one adsorbent unit. The charging panel includes a first surface and a second surface opposite to the first surface. The first surface supports the portable electronic device. The charging panel defines a through hole through the first surface. The transmitting unit includes a coil for generating electromagnetic signals. The adsorbent unit extends through the through hole of the charging panel and adsorbs the portable electronic device.

Abstract: A charging battery unit includes a receiving unit and a battery. The receiving unit includes a fixing member and a coil fixed on the fixing member. The coil receives external electromagnetic signals to generate induction currents. The battery is electrically connected to the coil and receives the induction currents generated by the coil. The present disclosure also relates an electronic device with the charging battery unit.

Abstract: The present disclose relates to a wireless charging device for charging a portable electronic device. The wireless charging device includes a charging panel, a transmitting unit and a heat dissipation unit. The charging panel includes a first surface and a second surface opposite to the first surface, the first surface supports the portable electronic device, and the portable electronic device includes a top surface away from the charging panel. The transmitting unit includes a coil for generating electromagnetic signals for charging the portable electronic device. The heat dissipation unit includes a base and a pressing portion connected to the base. The base thermally contacts the second surface of the charging panel, and the pressing portion thermally contacts the top surface of the portable electronic device.

Abstract: The present disclose relates to a wireless charging device for charging a portable electronic device. The wireless charging device includes a charging panel, a transmitting unit and at least one adsorbent unit. The charging panel includes a first surface and a second surface opposite to the first surface. The first surface supports the portable electronic device. The charging panel defines a through hole through the first surface. The transmitting unit includes a coil for generating electromagnetic signals. The adsorbent unit extends through the through hole of the charging panel and adsorbs the portable electronic device.

Abstract: The present disclose relates to a charging device for charging portable electronic devices. The charging device includes a transmitting unit, a receiving unit and an output port. The transmitting unit includes a first coil for generating electromagnetic signals for charging the portable electronic device. The receiving unit includes a charging panel and at least one second coil arranged on the charging panel. The at least one second coil receives the electromagnetic signals generated by the transmitting unit to generate induction currents. The output port is electrically connected to the receiving unit for outputting the induction currents. The portable electronic device is selectively electrically connected to the charging panel or the output port for charging.

Abstract: A housing for a portable electronic device includes a metallic base, a chemical plating layer, a prime layer, a color coating layer, a decorative layer, and a transparent protection layer. The chemical plating layer, the prime layer, the color coating layer, the decorative layer, and the transparent protection layer are coated on the metallic base in that order. The decorative layer defines a pattern extending through the decorative layer.

Abstract: A housing includes a plastic substrate, a supporting layer, a hair line layer, a decorative layer, and a transparent protection layer. The supporting layer, the hair line layer, the decorative layer, and the transparent protection layer are formed on the substrate in that order.

Abstract: A housing for an electronic device includes a plastic base, a prime layer, a decorative layer, and a transparent protection layer. The prime layer is coated on the plastic base, and defines a pattern embedded in the prime layer. The decorative layer is coated on the prime layer and the pattern. The decorative layer has a light reflective capability, and a thickness of the decorative layer is less than a depth of the pattern. The transparent protection layer is coated on the decorative layer.

Abstract: A housing for an electronic device includes a metallic base, a chemical plating layer, a prime layer, a color coating layer, a decorative layer, and a transparent protection layer. The chemical plating layer, the prime layer, the color coating layer, the decorative layer, and the transparent protection layer are coated on the metallic base in that order. The color coating layer defines a pattern embedded in the color coating layer. The decorative layer is coated on the color coating layer and the pattern. The decorative layer has light reflective capability, and a thickness of the decorative layer is less than a depth of the pattern.