Patents by Inventor HAI-QIAO WANG

HAI-QIAO WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8748557
    Abstract: The present invention relates to an extreme low formaldehyde emission UF resin with a novel structure, and a process for its preparation. This UF resin is produced from formaldehyde, urea, a long chain multi-aldehyde prepolymer, and some modifiers. Its process follows three steps: weak caustic, weak acid and weak caustic. By using this prepolymer, the modified UF resin has stable alkyl ether structure, and the residual aldehyde groups on the UF polymer chain could accelerate cross-linking instead of dissociative formaldehyde. The UF resin made from this invention has extreme low dissociative formaldehyde and simple technology. The boards produced from this resin have good physical performance and water resistance. Moreover, the formaldehyde emission of the boards is extreme low, achieving Japan F???? grade, the average emission value ?0.3 mg/L.
    Type: Grant
    Filed: August 29, 2011
    Date of Patent: June 10, 2014
    Assignee: Beijing University of Chemical Technology
    Inventors: Xiao-Yu Li, Jun Ye, Hai-Qiao Wang, Teng Qiu
  • Publication number: 20120088897
    Abstract: The present invention relates to an extreme low formaldehyde emission UF resin with a novel structure, and a process for its preparation. This UF resin is produced from formaldehyde, urea, a long chain multi-aldehyde prepolymer, and some modifiers. Its process follows three steps: weak caustic, weak acid and weak caustic. By using this prepolymer, the modified UF resin has stable alkyl ether structure, and the residual aldehyde groups on the UF polymer chain could accelerate cross-linking instead of dissociative formaldehyde. The UF resin made from this invention has extreme low dissociative formaldehyde and simple technology. The boards produced from this resin have good physical performance and water resistance. Moreover, the formaldehyde emission of the boards is extreme low, achieving Japan F???? grade, the average emission value?0.3 mg/L.
    Type: Application
    Filed: August 29, 2011
    Publication date: April 12, 2012
    Applicant: BEIJING UNIVERSITY OF CHEMICAL TECHNOLOGY
    Inventors: XIAO-YU LI, JUN YE, HAI-QIAO WANG, TENG QIU