Patents by Inventor HAI-QUAN ZHENG

HAI-QUAN ZHENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ADHESIVE BONDING ASSEMBLY AND METHOD FOR MAKING THE SAME
    Publication number: 20090226703
    Abstract: An exemplary adhesive bonding assembly includes a first component, a second embodiment, and an adhesive substance. The first component includes a first bonding surface and an operation surface opposite to the first bonding surface. A channel is defined in the first component extending from the first bonding surface to the operation surface. The second component includes a second bonding surface contacting the first bonding surface. The adhesive substance is received in the channel for bonding the first component and the second component together. A method for making the adhesive bonding assembly is also provided.
    Type: Application
    Filed: October 9, 2008
    Publication date: September 10, 2009
    Applicants: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: HAI-QUAN ZHENG, JIAN-MING HUANG