Patents by Inventor Hai Sin Chong

Hai Sin Chong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Molded semiconductor package with C-wing and gull-wing leads
    Patent number: 10325837
    Abstract: A semiconductor package includes a semiconductor die embedded in a molded package body, leads electrically connected to the die and protruding from a side face of the molded package body, and a recess extending inward from the side face and into a bottom main face of the molded package body to forma single groove. The recess begins below a region of the side face from which the leads protrude, so that this region of the side face is flat and each of the leads exits the molded package body in the same plane. A first subset of the leads is bent inward towards the molded package body and seated in the single groove, to form a first row of leads configured for surface mounting. A second subset of the leads extends outward from the molded package body, to form a second row of leads configured for surface mounting.
    Type: Grant
    Filed: November 7, 2017
    Date of Patent: June 18, 2019
    Assignee: Infineon Technologies AG
    Inventors: Cher Hau Danny Koh, Hai Sin Chong, Stefan Machiener, Yong Chern Poh, Toni Salminen, Khay Chwan Saw
  • Molded Semiconductor Package with C-Wing and Gull-Wing Leads
    Publication number: 20190139869
    Abstract: A semiconductor package includes a semiconductor die embedded in a molded package body, leads electrically connected to the die and protruding from a side face of the molded package body, and a recess extending inward from the side face and into a bottom main face of the molded package body to form a single groove. The recess begins below a region of the side face from which the leads protrude, so that this region of the side face is flat and each of the leads exits the molded package body in the same plane. A first subset of the leads is bent inward towards the molded package body and seated in the single groove, to form a first row of leads configured for surface mounting. A second subset of the leads extends outward from the molded package body, to form a second row of leads configured for surface mounting.
    Type: Application
    Filed: November 7, 2017
    Publication date: May 9, 2019
    Inventors: Cher Hau Danny Koh, Hai Sin Chong, Stefan Macheiner, Yong Chern Poh, Toni Salminen, Khay Chwan Saw