Patents by Inventor Hai Tran

Hai Tran has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12678790
    Abstract: Examples herein include an apparatus having a substrate, a sensor over the substrate including an active surface and a sensor bond pad, a molding layer over the substrate and covering sides of the sensor, the molding layer having a lower portion with a first molding height relative to a top surface of the substrate and an upper portion with a second molding height relative to the top surface of the substrate, the first molding height and the second molding height each being greater than a height of the active surface, the second molding height being great than the first molding height; and a lidding layer over at least some of the lower portion of the molding layer and over the active surface. The lidding layer and the molding layer form a space over the active surface of the sensor that defines a flow channel.
    Type: Grant
    Filed: November 1, 2022
    Date of Patent: July 14, 2026
    Assignee: Illumina, Inc.
    Inventors: Ravi Billa, Arvin Emadi, Hai Tran
  • Patent number: 12642864
    Abstract: Provided herein are novel antibody-agent conjugates formed by the introduction of methionine residues to antibody scaffold light or heavy chains at select positions, followed by conjugation of the agent to the methionine, for example, by oxaziridine chemistries. Methionine substitutions at the targeted positions enable highly efficient functionalization to form very stable conjugates, including conjugates suitable for in vivo use. The positions were identified for the trastuzumab and other related scaffolds which can be engineered for affinity to any target antigen. The conjugates include ADCs and detections agents. Also disclosed are novel oxaziridine reagents for conjugation to methionines in proteins.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: June 2, 2026
    Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: James Wells, Hai Tran, Susanna Elledge
  • Publication number: 20260042851
    Abstract: The present disclosure provides methods of degrading an EGFR protein on a target cell. The present disclosure further discloses antigen binding molecules that bind to an EGFR protein and a membrane-associated internalizing protein, such as ITGB6.
    Type: Application
    Filed: October 9, 2025
    Publication date: February 12, 2026
    Inventors: Shyra Jane Gardai, Hai Tran, Andrew Christopher Goodrich, Lisa Marshall, Isaac J. Rondon, Shruti Yadav, Jonathan Sitrin, Fortunato Ferrara
  • Publication number: 20260022189
    Abstract: The present disclosure provides methods of degrading a cMET protein on a target cell. The present disclosure further discloses binding agents that bind to a cMET protein and a degrading protein.
    Type: Application
    Filed: May 6, 2025
    Publication date: January 22, 2026
    Inventors: Jonathan SITRIN, Hai TRAN, Lisa MARSHALL, Kenneth NG, Kimberly HOI, Shyra GARDAI, Katarina PANCE, Josef GRAMESPACHER, Rami HANNOUSH
  • Publication number: 20250388682
    Abstract: The present disclosure provides methods of degrading an EGFR protein on a target cell. The present disclosure further discloses bispecific binding agents that bind to an EGFR protein and a membrane-associated internalizing protein.
    Type: Application
    Filed: January 17, 2025
    Publication date: December 25, 2025
    Inventors: Katarina PANCE, Josef GRAMESPACHER, Rami HANNOUSH, Hai TRAN, Jonathan SITRIN, Lisa MARSHALL, Man-Tzu WANG, Kenneth NG, Shyra GARDAI
  • Publication number: 20250164386
    Abstract: Disclosed is an apparatus and method of forming, including a supporting structure, a sensor on the supporting structure, a pair of columns on the supporting structure at opposite sides of the sensor, the pair of columns having a column height relative to a top surface of the supporting structure, the column height being higher than a height of the active surface of the sensor relative to the top surface of the supporting structure, and a lidding layer on the pair of columns and over the active surface, the lidding layer being supported at opposite ends by the pair of columns. The active surface of the sensor, the lidding layer and the pair of columns form an opening above at least more than about half of the active surface of the sensor, and the supporting structure, the sensor, the lidding layer and the pair of columns together form a flow cell.
    Type: Application
    Filed: January 17, 2025
    Publication date: May 22, 2025
    Applicant: Illumina, Inc.
    Inventors: Donglai Lu, Xiuyu Cai, Wenyi Feng, Hai Tran
  • Publication number: 20250164399
    Abstract: An example sensor includes a flow cell, a detection device, and a controller. The flow cell includes a passivation layer having opposed surfaces and a reaction site at a first of the opposed surfaces. The flow cell also includes a lid operatively connected to the passivation layer to partially define a flow channel between the lid and the reaction site. The detection device is in contact with a second of the opposed surfaces of the passivation layer, and includes an embedded metal layer that is electrically isolated from other detection circuitry of the detection device. The controller is to ground the embedded metal layer.
    Type: Application
    Filed: January 17, 2025
    Publication date: May 22, 2025
    Applicant: Illumina, Inc.
    Inventors: Tracy Helen Fung, Xiuyu Cai, Lisa Kwok, Hai Tran, Kevan Samiee, Liangliang Qiang, Boyan Boyanov
  • Patent number: 12241835
    Abstract: An example sensor includes a flow cell, a detection device, and a controller. The flow cell includes a passivation layer having opposed surfaces and a reaction site at a first of the opposed surfaces. The flow cell also includes a lid operatively connected to the passivation layer to partially define a flow channel between the lid and the reaction site. The detection device is in contact with a second of the opposed surfaces of the passivation layer, and includes an embedded metal layer that is electrically isolated from other detection circuitry of the detection device. The controller is to ground the embedded metal layer.
    Type: Grant
    Filed: May 5, 2023
    Date of Patent: March 4, 2025
    Assignee: ILLUMINA, INC.
    Inventors: Tracy Helen Fung, Xiuyu Cai, Lisa Kwok, Hai Tran, Kevan Samiee, Liangliang Qiang, Boyan Boyanov
  • Publication number: 20250050334
    Abstract: A circuit with electrical interconnect for external electronic connection and sensor(s) on a die are combined with a laminated manifold to deliver a liquid reagent over an active surface of the sensor(s). The laminated manifold includes fluidic channel(s), an interface between the die and the fluidic channel(s) being sealed. Also disclosed is a method, the method including assembling a laminated manifold including fluidic channel(s), attaching sensor(s) on a die to a circuit, the circuit including an electrical interconnect, and attaching a planarization layer to the circuit, the planarization layer including a cut out for the die. The method further includes placing sealing adhesive at sides of the die, attaching the laminated manifold to the circuit, and sealing an interface between the die and fluidic channel(s).
    Type: Application
    Filed: October 28, 2024
    Publication date: February 13, 2025
    Inventors: Darren Segale, Hai Tran, Paul Crivelli
  • Patent number: 12151240
    Abstract: A circuit with electrical interconnect for external electronic connection and sensor(s) on a die are combined with a laminated manifold to deliver a liquid reagent over an active surface of the sensor(s). The laminated manifold includes fluidic channel(s), an interface between the die and the fluidic channel(s) being sealed. Also disclosed is a method, the method including assembling a laminated manifold including fluidic channel(s), attaching sensor(s) on a die to a circuit, the circuit including an electrical interconnect, and attaching a planarization layer to the circuit, the planarization layer including a cut out for the die. The method further includes placing sealing adhesive at sides of the die, attaching the laminated manifold to the circuit, and sealing an interface between the die and fluidic channel(s).
    Type: Grant
    Filed: January 13, 2023
    Date of Patent: November 26, 2024
    Assignee: ILLUMINA, INC.
    Inventors: Darren Segale, Hai Tran, Paul Crivelli
  • Publication number: 20240190987
    Abstract: The present invention uses an indinavir based mechanism of “chemically induced dimerization” to enable a precise temporal control of the activity of a T cell engaging complex in a patient.
    Type: Application
    Filed: July 10, 2023
    Publication date: June 13, 2024
    Inventors: Zachary B. HILL, Alexander J. MARTINKO, Allison COOKE, Hai TRAN, Erin SIMONDS, Sunandan BANERJEE
  • Publication number: 20240009665
    Abstract: Provided herein include various examples of a flow cell and methods for forming aspects of flow cell. The method may include applying a first adhesive to a substrate. The method may include orienting a die on the first adhesive. The method may also include orienting a package on the first adhesive. The package includes a die and a top surface of the die comprises an active surface and electrical contact points. Surfaces adjacent to the active surface on at least two opposing sides of the active surface form fanout regions for utilization in a fluidic path of the flow cell. The method further may include applying a second adhesive to a part of the package and attaching a lid to the second adhesive to define a fluidic flow-cell cavity below the lid and above a surface comprising the active surface and the fanout regions.
    Type: Application
    Filed: February 1, 2022
    Publication date: January 11, 2024
    Inventors: Ravi BILLA, John WALKER, Arvin EMADI, Jon ADAY, Tara BOZORG-GRAYELI, Ludovic VINCENT, Hai TRAN, Sanket RATHORE
  • Publication number: 20230314326
    Abstract: An example sensor includes a flow cell, a detection device, and a controller. The flow cell includes a passivation layer having opposed surfaces and a reaction site at a first of the opposed surfaces. The flow cell also includes a lid operatively connected to the passivation layer to partially define a flow channel between the lid and the reaction site. The detection device is in contact with a second of the opposed surfaces of the passivation layer, and includes an embedded metal layer that is electrically isolated from other detection circuitry of the detection device. The controller is to ground the embedded metal layer.
    Type: Application
    Filed: May 5, 2023
    Publication date: October 5, 2023
    Applicant: ILLUMINA, INC.
    Inventors: Tracy Helen FUNG, Xiuyu CAI, Lisa KWOK, Hai TRAN, Kevan SAMIEE, Liangliang QIANG, Boyan BOYANOV
  • Patent number: 11680906
    Abstract: An example sensor includes a flow cell, a detection device, and a controller. The flow cell includes a passivation layer having opposed surfaces and a reaction site at a first of the opposed surfaces. The flow cell also includes a lid operatively connected to the passivation layer to partially define a flow channel between the lid and the reaction site. The detection device is in contact with a second of the opposed surfaces of the passivation layer, and includes an embedded metal layer that is electrically isolated from other detection circuitry of the detection device. The controller is to ground the embedded metal layer.
    Type: Grant
    Filed: April 19, 2018
    Date of Patent: June 20, 2023
    Assignee: ILLUMINA, INC.
    Inventors: Tracy Helen Fung, Xiuyu Cai, Lisa Kwok, Hai Tran, Kevan Samiee, Liangliang Qiang, Boyan Boyanov
  • Publication number: 20230158493
    Abstract: A circuit with electrical interconnect for external electronic connection and sensor(s) on a die are combined with a laminated manifold to deliver a liquid reagent over an active surface of the sensor(s). The laminated manifold includes fluidic channel(s), an interface between the die and the fluidic channel(s) being sealed. Also disclosed is a method, the method including assembling a laminated manifold including fluidic channel(s), attaching sensor(s) on a die to a circuit, the circuit including an electrical interconnect, and attaching a planarization layer to the circuit, the planarization layer including a cut out for the die. The method further includes placing sealing adhesive at sides of the die, attaching the laminated manifold to the circuit, and sealing an interface between the die and fluidic channel(s).
    Type: Application
    Filed: January 13, 2023
    Publication date: May 25, 2023
    Inventors: Darren Segale, Hai Tran, Paul Crivelli
  • Publication number: 20230146020
    Abstract: Examples herein include an apparatus having a substrate, a sensor over the substrate including an active surface and a sensor bond pad, a molding layer over the substrate and covering sides of the sensor, the molding layer having a lower portion with a first molding height relative to a top surface of the substrate and an upper portion with a second molding height relative to the top surface of the substrate, the first molding height and the second molding height each being greater than a height of the active surface, the second molding height being great than the first molding height; and a lidding layer over at least some of the lower portion of the molding layer and over the active surface. The lidding layer and the molding layer form a space over the active surface of the sensor that defines a flow channel.
    Type: Application
    Filed: November 1, 2022
    Publication date: May 11, 2023
    Inventors: Ravi Billa, Arvin Emadi, Hai Tran
  • Publication number: 20230076887
    Abstract: Disclosed is an apparatus and method of forming, including a supporting structure, a sensor on the supporting structure, a pair of columns on the supporting structure at opposite sides of the sensor, the pair of columns having a column height relative to a top surface of the supporting structure, the column height being higher than a height of the active surface of the sensor relative to the top surface of the supporting structure, and a lidding layer on the pair of columns and over the active surface, the lidding layer being supported at opposite ends by the pair of columns. The active surface of the sensor, the lidding layer and the pair of columns form an opening above at least more than about half of the active surface of the sensor, and the supporting structure, the sensor, the lidding layer and the pair of columns together form a flow cell.
    Type: Application
    Filed: November 10, 2022
    Publication date: March 9, 2023
    Inventors: Donglai Lu, Xiuyu Cai, Wenyi Feng, Hai Tran
  • Patent number: 11565252
    Abstract: A circuit with electrical interconnect for external electronic connection and sensor(s) on a die are combined with a laminated manifold to deliver a liquid reagent over an active surface of the sensor(s). The laminated manifold includes fluidic channel(s), an interface between the die and the fluidic channel(s) being sealed. Also disclosed is a method, the method including assembling a laminated manifold including fluidic channel(s), attaching sensor(s) on a die to a circuit, the circuit including an electrical interconnect, and attaching a planarization layer to the circuit, the planarization layer including a cut out for the die. The method further includes placing sealing adhesive at sides of the die, attaching the laminated manifold to the circuit, and sealing an interface between the die and fluidic channel(s).
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: January 31, 2023
    Assignee: ILLUMINA, INC.
    Inventors: Darren Segale, Hai Tran, Paul Crivelli
  • Patent number: 11519846
    Abstract: Disclosed is an apparatus and method of forming, including a supporting structure, a sensor on the supporting structure, a pair of columns on the supporting structure at opposite sides of the sensor, the pair of columns having a column height relative to a top surface of the supporting structure, the column height being higher than a height of the active surface of the sensor relative to the top surface of the supporting structure, and a lidding layer on the pair of columns and over the active surface, the lidding layer being supported at opposite ends by the pair of columns. The active surface of the sensor, the lidding layer and the pair of columns form an opening above at least more than about half of the active surface of the sensor, and the supporting structure, the sensor, the lidding layer and the pair of columns together form a flow cell.
    Type: Grant
    Filed: January 29, 2019
    Date of Patent: December 6, 2022
    Assignee: ILLUMINA, INC.
    Inventors: Donglai Lu, Xiuyu Cai, Wenyi Feng, Hai Tran
  • Publication number: 20220072148
    Abstract: Provided herein are novel antibody-agent conjugates formed by the introduction of methionine residues to antibody scaffold light or heavy chains at select positions, followed by conjugation of the agent to the methionine, for example, by oxaziridine chemistries. Methionine substitutions at the targeted positions enable highly efficient functionalization to form very stable conjugates, including conjugates suitable for in vivo use. The positions were identified for the trastuzumab and other related scaffolds which can be engineered for affinity to any target antigen. The conjugates include ADCs and detections agents. Also disclosed are novel oxaziridine reagents for conjugation to methionines in proteins.
    Type: Application
    Filed: December 30, 2019
    Publication date: March 10, 2022
    Applicant: The Regents of the University of California
    Inventors: James Wells, Hai Tran, Susanna Elledge