Patents by Inventor Hai-Wei CONG

Hai-Wei CONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat dissipating apparatus
    Patent number: 8737061
    Abstract: A heat dissipating apparatus comprises a first heat sink, a second heat sink and a fixing unit. The first heat sink comprises a connecting portion. The second heat sink comprises a connecting unit which is inserted into the connecting portion. The fixing unit includes an end portion exposed outside the connecting portion and a body accommodated in the connecting portion.
    Type: Grant
    Filed: September 21, 2011
    Date of Patent: May 27, 2014
    Assignee: Asus Technology Pte Ltd.
    Inventors: Chien-Lung Chang, Hai-Wei Cong
  • HEAT DISSIPATING APPARATUS
    Publication number: 20120075798
    Abstract: A heat dissipating apparatus comprises a first heat sink, a second heat sink and a fixing unit. The first heat sink comprises a connecting portion. The second heat sink comprises a connecting unit which is inserted into the connecting portion. The fixing unit includes an end portion exposed outside the connecting portion and a body accommodated in the connecting portion.
    Type: Application
    Filed: September 21, 2011
    Publication date: March 29, 2012
    Inventors: Chien-Lung CHANG, Hai-Wei CONG