Abstract: An electrode structure of an LED includes an adhesion layer and a bond pad layer. The adhesion layer is stacked on the LED. The bond pad layer is stacked on the adhesion layer. The bond pad layer includes at least two first metal layers, at least two second metal layers and an outermost gold layer sequentially and alternately stacked. The first metal layers are selected from the group consisting Al and an Al alloy, and the second metal layers are selected from the group consisting of Ti, Ni, Cr, Pt, Pd, TiN, TiW, W, Rh and Cu. Thus, the main structure of the bond pad layer is a stacked structure of the first metal layers and the second metal layers. The first metal layers may be selected from a low-cost material, and the second metal layers improve issues of inadequate hardness and electromigration of the first metal layers.

Abstract: An electrode structure of an LED includes an adhesion layer and a bond pad layer. The adhesion layer is stacked on the LED. The bond pad layer is stacked on the adhesion layer. The bond pad layer includes at least two first metal layers, at least two second metal layers and an outermost gold layer sequentially and alternately stacked. The first metal layers are selected from the group consisting Al and an Al alloy, and the second metal layers are selected from the group consisting of Ti, Ni, Cr, Pt, Pd, TiN, TiW, W, Rh and Cu. Thus, the main structure of the bond pad layer is a stacked structure of the first metal layers and the second metal layers. The first metal layers may be selected from a low-cost material, and the second metal layers improve issues of inadequate hardness and electromigration of the first metal layers.

Abstract: A transparent conductive layer structure for an LED is provided. The LED includes a reflecting layer, an N-type electrode, an N-type semiconductor layer, a light emitting layer, a P-type semiconductor layer, a current block layer, a transparent conductive layer and a P-type electrode that are stacked on a substrate. The current block layer is disposed between and separates the P-type electrode and the P-type semiconductor layer. The transparent conductive layer is disposed between the P-type electrode and the current block layer, and connects to the P-type electrode and the P-type semiconductor layer. At a region corresponding to the P-type electrode, a plurality of holes are disposed at the transparent conductive layer to reduce an area of and hence an amount of light absorbed by the transparent conductive layer, thereby increasing light extraction efficiency of excited light from the light emitting layer and enhancing light emitting efficiency of the LED.

Abstract: A current block layer structure applied to a light emitting diode is provided. The LED includes a reflecting layer, an N-type electrode, an N-type semiconductor layer, a light emitting layer, a P-type semiconductor layer, a transparent conductive layer and a P-type electrode. A current block reflecting layer is disposed the transparent conductive layer at a region corresponding to the P-type electrode and an end close to the light emitting layer. The current block reflecting layer includes a Bragg reflector (DBR) structure, which allows the current block reflecting layer to reflect an excited light from the light emitting layer. Thus, the excited light emitted towards the P-type electrode is provided with a higher reflection rate and is again reflected by the reflecting layer. The excited light takes exit via regions without the N-type electrode and the P-type electrode after several reflections, thereby enhancing light extraction efficiency of the LED.

Abstract: A transparent conductive layer structure for an LED is provided. The LED includes a reflecting layer, an N-type electrode, an N-type semiconductor layer, a light emitting layer, a P-type semiconductor layer, a current block layer, a transparent conductive layer and a P-type electrode that are stacked on a substrate. The current block layer is disposed between and separates the P-type electrode and the P-type semiconductor layer. The transparent conductive layer is disposed between the P-type electrode and the current block layer, and connects to the P-type electrode and the P-type semiconductor layer. At a region corresponding to the P-type electrode, a plurality of holes are disposed at the transparent conductive layer to reduce an area of and hence an amount of light absorbed by the transparent conductive layer, thereby increasing light extraction efficiency of excited light from the light emitting layer and enhancing light emitting efficiency of the LED.

Abstract: A flip chip light-emitting diode (LED) package structure includes a circuit board, an electrical conducting layer and a plurality of flip chip light-emitting elements. The circuit board includes a bearing surface. The electrical conducting layer is formed on the bearing surface, and includes a plurality of electrical connection regions independent of each other. Each flip chip light-emitting element includes a p-type electrode and an n-type electrode. The p-type electrodes and the n-type electrodes of the flip chip light-emitting elements are electrically connected to the electrical connection regions, so that the flip chip light-emitting elements are electrically connected in series to form a package structure. During packaging of the flip chip light-emitting elements, the structure formed by the serial connection forms a circuit that can withstand a high voltage, and further reduce the current.

Abstract: A periodically structured substrate includes a slab and a periodic structure formed on the slab and including a plurality of spaced apart first surrounding elements and a plurality of spaced apart central elements. The first surrounding elements are periodically arranged in such a manner to form repeating polygonal patterns. Each of the central elements is disposed at a center of a respective one of the polygonal patterns. The periodic structure further includes a spacer medium that fills a space among the central element and the first surrounding elements of each of the polygonal patterns and that has a refractive index different from those of the central element and the first surrounding elements.