Abstract: Disclosed herein is an aqueous non-Cr passivating composition including, on the basis of the weight of the non-Cr passivating composition: (a) 5 to 20% by weight of a silicon-containing compound; and (b) 5 to 15% by weight of a water-borne polymer, which is selected from the group consisting of a polyurethane resin, an epoxy resin, a polyacrylate resin and the combination thereof. Further disclosed herein are a metal with a surface passivated by the aqueous non-Cr passivating composition and an article having a metallic surface passivated by the aqueous non-Cr passivating composition, and a process for passivating a metallic surface with the aqueous non-Cr passivating composition.

Abstract: Described herein is an anti-rust composition for metal surfaces including: a) 30% to 80% by weight of water-soluble or water-dispersible acrylic resin and/or urethane resin; b) 0.1% to 10% by weight of epoxysilane and/or vinylsilane; c) 0.1% to 3% by weight of silicone surfactant and/or fluorosurfactant; d) 0.1% to 10% by weight of alcohol and/or ether; and e) water, where the weight percentage of each component is based on the total weight of the aqueous composition. Also described herein is an anti-rust treatment method on a metal surface including steps of i) coating the invented anti-rust composition onto the metal surface and ii) drying the coating layer at a temperature from 60° C. to 150° C. Also described herein is an anti-rust treated coil steel obtained by the anti-rust treatment method.

Abstract: Disclosed herein is an aqueous composition including components (A) from 10% to 35% by weight of acrylic resin without hydroxyl group, where the acrylic resin has an average particle diameter in a range of from 50 ?m to 200 ?m measured by dynamic light scattering according to ISO13321:2004, (B) from 0.1% to 4% by weight of a film-forming aid having a boiling point of no more than 300° C. under 1 atm, (C) from 1% to 8% by weight of a lubricant having an average particle diameter in a range of from 100 nm to 600 nm measured by dynamic light scattering according to ISO13321:2004, and (D) from 0.1% to 1% by weight of a water-soluble chromium compound, where its weight is calculated from the chromium element, and the weight percentages of all components are based on the total weight of the aqueous composition.

Abstract: This application relates to the field of cloud computing technologies, and discloses a pod deployment method and apparatus. A master node receives an instruction for deploying one or more scheduling domains, where the instruction includes a quantity of each type of resources occupied by each of the scheduling domains; selects a worker node for deploying the one or more scheduling domains, and sends, to the worker node, the instruction for deploying the one or more scheduling domains, where the instruction includes the quantity of each type of resources occupied by the scheduling domain; and sends, to the worker node based on association information of a scheduling domain, an instruction for deploying one or more pods, where the instruction includes a quantity of pods, a quantity of containers included in each pod, and an identifier of the scheduling domain to which resources used by the one or more pods belong.

Abstract: Described herein is an anti-rust composition for metal surfaces including: a) 30% to 80% by weight of water-soluble or water-dispersible acrylic resin and/or urethane resin; b) 0.1% to 10% by weight of epoxysilane and/or vinylsilane; c) 0.1% to 3% by weight of silicone surfactant and/or fluorosurfactant; d) 0.1% to 10% by weight of alcohol and/or ether; and e) water, where the weight percentage of each component is based on the total weight of the aqueous composition. Also described herein is an anti-rust treatment method on a metal surface including steps of i) coating the invented anti-rust composition onto the metal surface and ii) drying the coating layer at a temperature from 60° C. to 150° C. Also described herein is an anti-rust treated coil steel obtained by the anti-rust treatment method.

Abstract: A chip bonding apparatus includes a chip separation unit, a chip alignment unit, a chip bonding unit and a bonding robotic arm unit. The bonding robotic arm unit includes a first bonding robotic arm unit and a second bonding robotic arm unit. The first bonding robotic arm unit includes a first motion stage, a first driver configured to drive the first motion stage and at least one first bonding robotic arm arranged on the first motion stage. The first bonding robotic arm is configured to suck up a chip from the chip separation unit and deliver it to the chip alignment unit. The second bonding robotic arm unit includes a second motion stage, a second driver configured to drive the second motion stage and at least one second bonding robotic arm arranged on the second motion stage.

Abstract: A chip bonding apparatus and method are disclosed. The chip bonding apparatus includes: at least one separation module for separating chips; at least one bonding module for bonding the chips a substrate; a transportation device for transporting the chips between the separation module and the bonding module, the transportation device including one or more guide tracks and one or more transportation carriers for retaining the chips, each of the guide tracks is provided thereon with at least one of the transportation carriers; and a control device for individually controlling the separation module, the bonding module and the transportation device. The chip bonding apparatus and method allows pickup, transportation and chip-to-substrate bonding of chips in batches with increased chip bonding yield and improved chip bonding accuracy.

Abstract: A service container creation method and apparatus, where the method includes receiving, by a virtualization layer in a network functions virtualization (NFV) infrastructure (NFVI), a container creation message from a virtualized infrastructure manager (VIM) for a target service, creating, by the virtualization layer, a service container in the NFVI, deploying the target service in the service container, according to the container creation message, and establishing, by the virtualization layer according to a timer type in the container creation message, a binding relationship between the service container and one or more central processing units (CPUs) in the NFVI. Hence, isolate performance impact posed by a high-precision timer in an NFV system within a range of a single service container such that the NFV system considers performance of each service container while ensuring flexible service deployment.

Abstract: The present invention discloses a method for affinity binding of interrupt of a virtual network interface card, and a computer device. The method includes: receiving a request message sent by an IaaS resource management system, where the request message carries an interrupt affinity policy parameter of a virtual network interface card; performing one-to-one correspondence affinity binding between multiple virtual central processing units VCPUs and multiple physical central processing units PCPUs; performing affinity binding between a virtual interrupt of the virtual network interface card and a VCPU; and performing affinity binding between a physical interrupt of the virtual network interface card and a corresponding PCPU according to the affinity policy parameter.

Abstract: A universal chip batch-bonding apparatus and method. The apparatus comprises a material pick-and-place area and a transfer work area. The material pick-and-place area comprises a blue tape pick-and-place area (110) for providing a chip (113) and a substrate pick-and-place area (120) for placing a substrate (123), the blue tape pick-and-place area (110) and the substrate pick-and-place area (120) being separately arranged at two ends of the transfer work area. The transfer work area sequentially comprises a chip pickup and separation area (210), a chip alignment and fine-tuning area (220), and a chip batch-bonding area (230) in a direction running from the blue tape pick-and-place area (110) to the substrate pick-and-place area (120).

Abstract: A batch bonding apparatus and bonding method. The bonding apparatus comprises: a chip supply unit (10) for providing a chip (60) to be bonded; a substrate supply unit (20) for providing a substrate; a transfer unit (40) for transferring the chip (60) between the chip supply unit (10) and the substrate supply unit (20); and a pickup unit (30) disposed above the chip supply unit (10), for picking up the chip (60) from the chip supply unit (10) and uploading the chip (60) to the transfer unit (40) after flipping a marked surface of the chip (60) in a required direction. In the present invention pickup of each chip is completed individually, but transfer processes and bonding processes can be carried out for multiple chips at the same time, greatly increasing yield.

Abstract: A chip bonding device is disclosed, including a first motion stage (110), a second motion stage (200), a chip pickup element (160), a transfer carrier (170), a chip adjustment system (1000), a bonding stage (420) and a control system (500). A chip bonding method is also disclosed, in which a set of chips are temporarily retained on the transfer carrier (170) and their positions on the transfer carrier (170) are accurately adjusted by using the chip adjustment system (1000), followed by bonding the chips on the transfer carrier (170) simultaneously onto the substrate (430). With this batch bonding approach, flip-chips can be bonded with greatly enhanced efficiency. Moreover, picking up and bonding chips in batches can balance times for chip picking up, fine chip position tuning and chip bonding, thereby ensuring high bonding accuracy while increasing the throughput.

Abstract: Provided are a chip bonding apparatus and bonding method.

Abstract: A six-degree-of-freedom linear motor is disclosed, including a magnet array and a coil group disposed above the magnet array, the magnet array includes a first Halbach magnet array and a second Halbach magnet array, the first Halbach magnet array has a parallelogrammic cross section in a plane defined by X- and Y-axes, the first Halbach magnet array has a first side parallel to the Y-axis and a second side forming an angle of ? with the Y-axis, the second Halbach magnet array is in mirror symmetry with the first Halbach magnet array with respect to the Y-axis, and the coil group includes a first, second, third and fourth coil group, each having an axis inclined at an angle of ? with respect to the Y-axis, the first and second coil groups are in mirror symmetry with the third and fourth coil groups with respect to the Y-axis, respectively.

Abstract: Provided are a chip bonding apparatus and bonding method.

Abstract: A universal chip batch-bonding apparatus and method. The apparatus comprises a material pick-and-place area and a transfer work area. The material pick-and-place area comprises a blue tape pick-and-place area (110) for providing a chip (113) and a substrate pick-and-place area (120) for placing a substrate (123), the blue tape pick-and-place area (110) and the substrate pick-and-place area (120) being separately arranged at two ends of the transfer work area. The transfer work area sequentially comprises a chip pickup and separation area (210), a chip alignment and fine-tuning area (220), and a chip batch-bonding area (230) in a direction running from the blue tape pick-and-place area (110) to the substrate pick-and-place area (120).

Abstract: A batch bonding apparatus and bonding method. The bonding apparatus comprises: a chip supply unit (10) for providing a chip (60) to be bonded; a substrate supply unit (20) for providing a substrate; a transfer unit (40) for transferring the chip (60) between the chip supply unit (10) and the substrate supply unit (20); and a pickup unit (30) disposed above the chip supply unit (10), for picking up the chip (60) from the chip supply unit (10) and uploading the chip (60) to the transfer unit (40) after flipping a marked surface of the chip (60) in a required direction. In the present invention pickup of each chip is completed individually, but transfer processes and bonding processes can be carried out for multiple chips at the same time, greatly increasing yield.

Abstract: A chip bonding apparatus includes a chip separation unit, a chip alignment unit, a chip bonding unit and a bonding robotic arm unit. The bonding robotic arm unit includes a first bonding robotic arm unit and a second bonding robotic arm unit. The first bonding robotic arm unit includes a first motion stage, a first driver configured to drive the first motion stage and at least one first bonding robotic arm arranged on the first motion stage. The first bonding robotic arm is configured to suck up a chip from the chip separation unit and deliver it to the chip alignment unit. The second bonding robotic arm unit includes a second motion stage, a second driver configured to drive the second motion stage and at least one second bonding robotic arm arranged on the second motion stage.

Abstract: A chip bonding apparatus and method are disclosed. The chip bonding apparatus includes: at least one separation module for separating chips; at least one bonding module for bonding the chips a substrate; a transportation device for transporting the chips between the separation module and the bonding module, the transportation device including one or more guide tracks and one or more transportation carriers for retaining the chips, each of the guide tracks is provided thereon with at least one of the transportation carriers; and a control device for individually controlling the separation module, the bonding module and the transportation device. The chip bonding apparatus and method allows pickup, transportation and chip-to-substrate bonding of chips in batches with increased chip bonding yield and improved chip bonding accuracy.

Abstract: A chip bonding device is disclosed, including a first motion stage (110), a second motion stage (200), a chip pickup element (160), a transfer carrier (170), a chip adjustment system (1000), a bonding stage (420) and a control system (500). A chip bonding method is also disclosed, in which a set of chips are temporarily retained on the transfer carrier (170) and their positions on the transfer carrier (170) are accurately adjusted by using the chip adjustment system (1000), followed by bonding the chips on the transfer carrier (170) simultaneously onto the substrate (430). With this batch bonding approach, flip-chips can be bonded with greatly enhanced efficiency. Moreover, picking up and bonding chips in batches can balance times for chip picking up, fine chip position tuning and chip bonding, thereby ensuring high bonding accuracy while increasing the throughput.