Abstract: Provided are a preparation method for a CTL cell and an application thereof. The preparation method comprises the following steps of: inducing a CTL cell by using a tumor antigen PAP-GM-CSF sensitized DC cell; and knocking out a PD-1 gene of the CTL cell to obtain a PD-1 knock-out CTL cell. The CTL cell obtained by the preparation method can be used for preparing drugs for treatment of prostate cancer, especially for treating PAP-positive prostate cancer. The CTL cell does not cause CTL cell failure and anergy due to the tumor-expressed PD-L1 after being transfused into the body, thereby producing efficient specific cytotoxic effect on a tumor cell and improving the curative effect and reducing the side effect.

Abstract: Devices, assemblies, and associated methods are provided for mobile devices. An example mobile device includes a body defining a first surface, a second surface opposite the first surface, and a cavity at the second surface that receives a battery therein. The mobile device includes a locking mechanism coupled with the cavity of the body that moves between an unlocked position and a locked position at which the locking mechanism secures the battery within the cavity in an instance in which the battery is received by the cavity. The cavity and the locking mechanism are configured to prevent a contact between the battery and the locking mechanism that results in movement of the locking mechanism from the locked position to the unlocked position.

Abstract: An integrated circuit package is provided with a thin-film battery electrically connected to and encapsulated with an integrated circuit die. The battery can be fabricated on a dedicated substrate, on the die pad, or on the integrated circuit die itself.

Abstract: An integrated circuit package is provided with a thin-film battery electrically connected to and encapsulated with an integrated circuit die. The battery can be fabricated on a dedicated substrate, on the die pad, or on the integrated circuit die itself.

Abstract: An integrated circuit package is provided with a thin-film battery electrically connected to and encapsulated with an integrated circuit die. The battery can be fabricated on a dedicated substrate, on the die pad, or on the integrated circuit die itself.

Abstract: An integrated circuit package is provided with a thin-film battery electrically connected to and encapsulated with an integrated circuit die. The battery can be fabricated on a dedicated substrate, on the die pad, or on the integrated circuit die itself.