Patents by Inventor Haibin Du

Haibin Du has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • WEARABLE AND ROTATABLE METHODS, SYSTEMS, AND APPARATUSES FOR MOUNTABLE DEVICES
    Publication number: 20240353057
    Abstract: Methods, apparatuses, systems, devices, and/or the like are provided. In some embodiments, a wearable apparatus may include a mounting plate configured to be operably engaged with a mountable device; a strap operably attached to the mounting plate and configured to be operably engaged with a user; and a connecting axis configured to operably engage the mounting plate and the strap, wherein the connecting axis is configured to rotate relative to one of the mounting plate or the strap while refraining from rotating relative to the other of the mounting plate or the strap.
    Type: Application
    Filed: April 3, 2024
    Publication date: October 24, 2024
    Inventors: Yinlei ZHANG, Haibin DU, Tiecheng QU, Xiaoyan SONG, Mengshan LI
  • BATTERY LOCKING MECHANISMS
    Publication number: 20230124646
    Abstract: Devices, assemblies, and associated methods are provided for mobile devices. An example mobile device includes a body defining a first surface, a second surface opposite the first surface, and a cavity at the second surface that receives a battery therein. The mobile device includes a locking mechanism coupled with the cavity of the body that moves between an unlocked position and a locked position at which the locking mechanism secures the battery within the cavity in an instance in which the battery is received by the cavity. The cavity and the locking mechanism are configured to prevent a contact between the battery and the locking mechanism that results in movement of the locking mechanism from the locked position to the unlocked position.
    Type: Application
    Filed: October 10, 2022
    Publication date: April 20, 2023
    Inventors: Chaobin CHEN, Zhihua DAI, Yazhou LIU, Shu TAN, Haibin DU
  • Integrated circuit package including embedded thin-film battery
    Patent number: 9012264
    Abstract: An integrated circuit package is provided with a thin-film battery electrically connected to and encapsulated with an integrated circuit die. The battery can be fabricated on a dedicated substrate, on the die pad, or on the integrated circuit die itself.
    Type: Grant
    Filed: July 1, 2014
    Date of Patent: April 21, 2015
    Assignee: STMicroelectronics, Inc.
    Inventors: Michael J. Hundt, Haibin Du, Krishnan Kelappan, Frank Sigmund
  • INTEGRATED CIRCUIT PACKAGE INCLUDING EMBEDDED THIN-FILM BATTERY
    Publication number: 20140315334
    Abstract: An integrated circuit package is provided with a thin-film battery electrically connected to and encapsulated with an integrated circuit die. The battery can be fabricated on a dedicated substrate, on the die pad, or on the integrated circuit die itself.
    Type: Application
    Filed: July 1, 2014
    Publication date: October 23, 2014
    Inventors: Michael J. Hundt, Haibin Du, Krishnan Kelappan, Frank Sigmund
  • Integrated circuit package including embedded thin-film battery
    Patent number: 8766435
    Abstract: An integrated circuit package is provided with a thin-film battery electrically connected to and encapsulated with an integrated circuit die. The battery can be fabricated on a dedicated substrate, on the die pad, or on the integrated circuit die itself.
    Type: Grant
    Filed: June 30, 2004
    Date of Patent: July 1, 2014
    Assignee: STMicroelectronics, Inc.
    Inventors: Michael J. Hundt, Haibin Du, Krishnan Kelappan, Frank Sigmund
  • Integrated circuit package including embedded thin-film battery
    Publication number: 20060001137
    Abstract: An integrated circuit package is provided with a thin-film battery electrically connected to and encapsulated with an integrated circuit die. The battery can be fabricated on a dedicated substrate, on the die pad, or on the integrated circuit die itself.
    Type: Application
    Filed: June 30, 2004
    Publication date: January 5, 2006
    Applicant: STMicroelectronics, Inc.
    Inventors: Michael Hundt, Haibin Du, Krishnan Kelappan, Frank Sigmund