Abstract: The present application provides a displaying base plate and a displaying device, which relates to the technical field of displaying. The displaying device can ameliorate the problem of screen greening caused by electrostatic charges, thereby improving the effect of displaying. The displaying base plate includes an active area and a non-active area connected to the active area, the non-active area includes an edge region and a first-dam region, and the first-dam region is located between the active area and the edge region; the displaying base plate further includes: a substrate; an anti-static layer disposed on the substrate, wherein the anti-static layer is located at least within the edge region; and a driving unit and a touch unit that are disposed on the substrate, wherein the driving unit is located within the active area.

Abstract: The present disclosure describes techniques for displaying comment information. The disclosed techniques comprise determining position information of a mobile terminal in a first coordinate system, the mobile terminal comprising a camera, a focus point of the camera being an origin of the first coordinate system; determining first position information associated with at least one comment in the first coordinate system based on the position information of the mobile terminal; converting the first position information associated with the at least one comment to second position information associated with the at least one comment in a second coordinate system based on one or more predetermined rules; obtaining the at least one comment; and displaying the at least one comment based on the second position information associated with the at least one comment in the second coordinate system.

Abstract: The present disclosure describes techniques for displaying comment information. The disclosed techniques comprise determining position information of a mobile terminal in a first coordinate system, the mobile terminal comprising a camera, a focus point of the camera being an origin of the first coordinate system; determining first position information associated with at least one comment in the first coordinate system based on the position information of the mobile terminal; converting the first position information associated with the at least one comment to second position information associated with the at least one comment in a second coordinate system based on one or more predetermined rules; obtaining the at least one comment; and displaying the at least one comment based on the second position information associated with the at least one comment in the second coordinate system.

Abstract: The present invention relates to novel fluorine containing polymers, compositions comprising the polymers, the use of the polymers in coatings, especially in water and dirt repellent coatings, and products coated with polymer containing coatings.

Abstract: The present invention relates to novel fluorine containing polymers, compositions comprising the polymers, the use of the polymers in coatings, especially in water and dirt repellent coatings, and products coated with polymer containing coatings.

Abstract: A low profile semiconductor package is disclosed including at least first and second stacked semiconductor die mounted to a substrate. The first semiconductor die may be electrically coupled to the substrate with a plurality of stitches in a forward ball bonding process. The second semiconductor die may in turn be electrically coupled to the first semiconductor die using a second set of stitches bonded between the die bond pads of the first and second semiconductor die. The second set of stitches may each include a lead end having a stitch ball that is bonded to the bond pads of the second semiconductor die. The tail end of each stitch in the second set of stitches may be wedge bonded directly to lead end of a stitch in the first set of stitches.

Abstract: A low profile semiconductor package is disclosed including at least first and second stacked semiconductor die mounted to a substrate. The first semiconductor die may be electrically coupled to the substrate with a plurality of stitches in a forward ball bonding process. The second semiconductor die may in turn be electrically coupled to the first semiconductor die using a second set of stitches bonded between the die bond pads of the first and second semiconductor die. The second set of stitches may each include a lead end having a stitch ball that is bonded to the bond pads of the second semiconductor die. The tail end of each stitch in the second set of stitches may be wedge bonded directly to lead end of a stitch in the first set of stitches.