Patents by Inventor Haicang CUI

Haicang CUI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9964864
    Abstract: A silicon wafer edge protection device having: a horizontal motion assembly; vertical motion assembly; speed regulating device, which is in signal connection with the vertical motion assembly and used for regulating vertical motion assembly motion speed; flexible bumper assembly, which is connected to the horizontal motion assembly and vertical motion assembly and used for reducing the amplitude of vibration of the silicon wafer edge protection device when a collision occurs; and control device, which is in signal connection with the speed regulating device and used for sending a control signal to the speed regulating device to control motion of the vertical motion assembly. The silicon wafer edge protection device can prevent a wafer stage from undergoing an instantaneous strong impact and prevent a silicon wafer from being crushed. When a collision occurs, the wafer stage and the silicon wafer can be protected. Production efficiency is also improved.
    Type: Grant
    Filed: December 27, 2015
    Date of Patent: May 8, 2018
    Assignee: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
    Inventors: Xu Zhou, Haicang Cui, Fei Ni, Lili Ge
  • Publication number: 20170357162
    Abstract: A silicon wafer edge protection device having: a horizontal motion assembly; vertical motion assembly; speed regulating device, which is in signal connection with the vertical motion assembly and used for regulating vertical motion assembly motion speed; flexible bumper assembly, which is connected to the horizontal motion assembly and vertical motion assembly and used for reducing the amplitude of vibration of the silicon wafer edge protection device when a collision occurs; and control device, which is in signal connection with the speed regulating device and used for sending a control signal to the speed regulating device to control motion of the vertical motion assembly. The silicon wafer edge protection device can prevent a wafer stage from undergoing an instantaneous strong impact and prevent a silicon wafer from being crushed. When a collision occurs, the wafer stage and the silicon wafer can be protected. Production efficiency is also improved.
    Type: Application
    Filed: December 27, 2015
    Publication date: December 14, 2017
    Applicant: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
    Inventors: Xu ZHOU, Haicang CUI, Fei NI, Lili GE