Patents by Inventor Haicheng YAO

Haicheng YAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12259287
    Abstract: A sensing structure and a method of fabricating a sensing structure for a compressive-type pressure sensor. The method comprises the steps of providing an elastic micropatterned substrate defining a plurality of 3-dimensional microstructures, each microstructure comprising a tip portion pointing away from the substrate in a first direction; forming a conductive film on the elastic micropatterned substrate such that the 3-dimensional microstructures are substantially covered by the conductive film; and forming cracks in the conductive film in areas on 3-dimensional microstructures.
    Type: Grant
    Filed: February 7, 2020
    Date of Patent: March 25, 2025
    Assignee: NATIONAL UNIVERSITY OF SINGAPORE
    Inventors: Chee Keong Tee, Haicheng Yao, Weidong Yang, Yu Jun Tan
  • Publication number: 20220299385
    Abstract: A composite structure for a pressure sensor, a pressure sensor, a method of pressure sensing using the pressure sensor, and a method of fabricating a composite structure for a pressure sensor. The method of fabricating a composite structure for a pressure sensor comprises the steps of forming an array of microstructures made from an elastomeric material; and forming a flexible conductive coating on the array of microstructures such that a surface morphology of microstructures is substantially maintained for the coated array of the microstructures; wherein the conductive coating exhibits a Young's modulus that is higher than that of the elastomeric material.
    Type: Application
    Filed: June 10, 2020
    Publication date: September 22, 2022
    Applicant: NATIONAL UNIVERSITY OF SINGAPORE
    Inventors: Chee Keong TEE, Haicheng YAO, Pengju LI, Wen CHENG
  • Publication number: 20220128420
    Abstract: A sensing structure and a method of fabricating a sensing structure for a compressive-type pressure sensor. The method comprises the steps of providing an elastic micropatterned substrate defining a plurality of 3-dimensional microstructures, each microstructure comprising a tip portion pointing away from the substrate in a first direction; forming a conductive film on the elastic micropatterned substrate such that the 3-dimensional microstructures are substantially covered by the conductive film; and forming cracks in the conductive film in areas on 3-dimensional microstructures.
    Type: Application
    Filed: February 7, 2020
    Publication date: April 28, 2022
    Applicant: NATIONAL UNIVERSITY OF SINGAPORE
    Inventors: Chee Keong TEE, Haicheng YAO, Weidong YANG, Yu Jun TAN